Chip Industry Technical Paper Roundup: July 1
Integrated phononic waveguide on thin-film lithium niobate on diamond; aZnMIm resist for EUV lithography; TMDC multi-channel GAA-FET architectures ...
Research Bits: July 1
GaN-silicon integration; simple 2D computer; stacking processors and memory.
Research Bits: June 24
Image sensors: In-sensor visual processing; better colors with perovskites; self-powered artificial synapse.
Chip Industry Technical Paper Roundup: June 24
Wafer-scale AI accelerators vs. single chip GPUs; machine intelligence on wireless edge networks; topological flat-band-driven metallic thermoelect...
Chip Industry Technical Paper Roundup: June 17
HBM roadmap from KAIST; RISC-V base station-on-chip; fully automated processor design; analysis of LLMs on HDL-based communication protocol generat...
Research Bits: June 17
Enabling 6G: Superlattice castellated FETs; compact phased-array transceiver; RF GaN-on-Si transistor.
Research Bits: June 9
InGaOx GAA transistor; 2D hybrid glaphene; simulating plasma.
Chip Industry Technical Paper Roundup: June 9
Customizing a LLM for VHDL design; HW-centric analysis of DeepSeek's multi-head latent attention; high-density polymer waveguides with silicon phot...
Chip Industry Technical Paper Roundup: June 3
Chiplet to chiplet communication; SRAM scaling with monolithic 3D integration of 2D FETs; scan instrumentation for post-silicon test; photonic HW o...
Research Bits: June 3
Magnetic sensing: Imaging power electronics; hexagonal boron nitride; nuclear spin microscopy.
