Manufacturing & Process Technology

Top Stories

Samsung Unveils Scaling, Packaging Roadmaps

Foundry unit rolls out ambitious plan down to 4nm, along with 18nm FD-SOI and advanced packaging developments.

Reworking Established Nodes

Attention turns to pre-finFET processes because benefits of device scaling don't apply equally to all markets.

200mm Crisis?

Demand is up, capacity is flat. A look at what's behind this imbalance.

Extending EUV Beyond 3nm

Now that EUV is finally shipping, companies are working on extending it much further using anamorphic lenses and high numerical aperture technology.

Materials For Future Electronics

Flexible electronics, new memory types, and neuromorphic computing dominate research.

Inside Lithography And Masks

Experts at the table, part 3: EUV, DSA, nanoimprint, nanopatterning, and best guesses for how far lithography can be extended.

RF Device And Process Biz Heats Up

Which technology will win in 5G world?

Will Self-Heating Stop FinFETs

Central fins can be up to 50% hotter than other fins, causing inconsistent threshold behavior and reliability problems.

Inside Next-Gen Transistors

Coventor's CTO looks at new types of transistors, the expanding number of challenges at future process nodes, and the state of semiconductor develo...

Patterning Problems Pile Up

Edge placement error emerges as the top issue at advanced nodes.

More Top Stories »



Round Tables

Inside Lithography And Masks

Experts at the table, part 3: EUV, DSA, nanoimprint, nanopatterning, and best guesses for how far lithography can be extended.

Inside Lithography And Masks

Experts at the table, part 2: Where EUV fits, what problems still remain, and what are the alternatives.

Inside Lithography And Masks

Experts at the table, part 1: EUV's viability still in doubt even as rollout begins. Uptime and cost are top concerns.

BEOL Issues At 10nm And 7nm

Experts at the table, part 3: EUV, metallization, self-alignment, ALD, and the limits of copper.

New Embedded Memories Ahead

Options grow as new wave of MCUs demand more capable NVM.

More Roundtables »



Multimedia

Tech Talk: FD-SOI vs. FinFET

Cost, performance, multi-patterning and the 12nm roadmap.

Tech Talk: Embedded Memories

Which type of memory is better and why.

Tech Talk: GPU-Accelerated Photomasks

Upcoming challenges in the mask shop and how to deal with them.

Tech Talk: Double-Triple Patterning

What comes after double patterning and why you need to understand it.

Tech Talk: 14nm And Stacked Die

Why the 14nm node will be long lived, and how it will be used in 2.5D and 3D-IC packages.

More Multimedia »



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