Manufacturing & Process Technology

Top Stories

MEMS: A Tale Of Two Tough Markets

First in a series: Challenges increase across the board, but for different reasons. Low profits temper investments.

Big Changes In Patterning

The shift to GPU-accelerated mask writing and curvilinear shapes could fundamentally change chip design and manufacturing.

Get Ready For Nanotube RAM

This nonvolatile technology is as fast as DRAM, uses same tools and processes as other memory.

Progress In Flexible Electronics

Hybrid approach pairs very thin silicon with printed interconnects and sensors.

What Are FeFETs?

How this new memory stacks up against existing non-volatile memory.

BEOL Issues At 10nm And 7nm

Experts at the table, part 3: EUV, metallization, self-alignment, ALD, and the limits of copper.

Managing Parasitics For Transistor Performance

Capacitances that used to be insignificant are becoming critical factors at advanced nodes.

New Embedded Memories Ahead

Options grow as new wave of MCUs demand more capable NVM.

What’s Next For Transistors

New FETs, qubits, neuromorphic approaches, and advanced packaging.

Transferring Skills Getting Harder

Error rates rising because design complexity now requires persistent expertise updates.

More Top Stories »



Round Tables

BEOL Issues At 10nm And 7nm

Experts at the table, part 3: EUV, metallization, self-alignment, ALD, and the limits of copper.

New Embedded Memories Ahead

Options grow as new wave of MCUs demand more capable NVM.

BEOL Issues At 10nm And 7nm

Experts at the table, part 2: The impact and cost of air gap; reducing RC delay with liner-less approaches and cobalt; where EUV will make a dent.....

BEOL Issues At 10nm And 7nm

Experts at the table, part 1: Lines blur with middle of line as RC delay increases, reliability and yield become more difficult to achieve, and cos...

2.5D Surprises And Alternatives

First of two parts: Cost and supply chain issues remain as advanced packaging begins to ramp.

More Roundtables »



Multimedia

Tech Talk: FD-SOI vs. FinFET

Cost, performance, multi-patterning and the 12nm roadmap.

Tech Talk: Embedded Memories

Which type of memory is better and why.

Tech Talk: GPU-Accelerated Photomasks

Upcoming challenges in the mask shop and how to deal with them.

Tech Talk: Double-Triple Patterning

What comes after double patterning and why you need to understand it.

Tech Talk: 14nm And Stacked Die

Why the 14nm node will be long lived, and how it will be used in 2.5D and 3D-IC packages.

More Multimedia »



See All Posts in Manufacturing and Design »

Latest Blogs

Perfecting The Process

Semiconductor Process Development: Finding A Faster Way To Profitability

Why virtual fabrication is so valuable in process modeling....
Semico Spin

Semiconductor CapEx To Increase 4.3% In 2017

Sales growth up slightly from 2016; Intel, SK Hynix, Toshiba and Western Digital...
Piecing It Together

The Return Of Time Sharing

An explosion of data has changed how technology is used and prioritized. ...
On The Mark

What’s Next For NOR Flash?

NOR remains viable amid a decline in growth....
Connect With SEMI

China Moves To Top Spot In Fab Equipment Spending

Total will reach $10B by next year, setting record for any single region....
Foundry Choices

Better Chips, Better Cars

The foundry perspective on automotive chip manufacturing....
EDA For Manufacturability

ECO Fill Can Rescue Your SoC Tapeout Schedule

Why fill is critical to reducing time to market at all process nodes....
Applied Innovation

What's Up MEMS?

As MEMS see rapid growth, there's a need for new device technologies....
Riding The Silicon Rapids

The Limits Of The Lifecycle

Why some analyses are so misleading....
Meet The eBeamers

Will GPU-Acceleration Mean The End Of Empirical Mask Models?

Physical mask models are more important than ever, and now are practical to empl...
Foundry Forum

Samsung Foundry's Business Strategy

A look at manufacturing changes and advanced technology updates....
ImPatterning

3D Construction Ahead

Building sub-wavelength structures using photons, and using 3D printers to creat...

Knowledge Centers
Entities, people and technologies explored


  Trending Articles

What Are FeFETs?

How this new memory stacks up against existing non-volatile memory.

Battling Fab Cycle Times

Why it’s taking longer to manufacture chips at 10/7nm and what can be done about it.

New Memories And Architectures Ahead

So far there is not widespread adoption, but many see change as inevitable.

What’s New In Connected Autos

Internet of Things technology will be crucial to automobiles, but connectivity comes at a price.

Betting On Wafer-Level Fan-Outs

Chipmakers focus on packaging to reduce routing issues at 10nm, 7nm. Tool and methodology gaps remain.