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Manufacturing & Process Technology

Top Stories

EUV Pellicle, Uptime And Resist Issues Continue

Problems won't derail next-gen litho, but could limit use and affect schedules.

Cryogenic Etch Re-Emerges

Technology could play a bigger role in 3D NAND, but control and cost remain problematic.

Variation’s Long, Twisty Tail Worsens At 7/5nm

Multiple sources of variability are causing unexpected problems in everything from AI chips to automotive reliability and time to market.

SiC Chip Demand Surges

Electric vehicles drive up market for silicon carbide power semiconductors, but cost remains an issue.

Survey: EUV Optimism Grows

Photomask business is expanding despite several challenges.

GF Puts 7nm On Hold

Foundry forms ASIC subsidiary as it focuses on 14nm/12nm and above.

Using AI In Chip Manufacturing

Coventor's CTO drills down into predictive maintenance, the impact of variation, and what this means for yield and future technology.

3D NAND Flash Wars Begin

Market overcrowding, more efficient manufacturing, and growing list of scaling issues create a challenging competitive landscape.

Next-Gen Memory Ramping Up

At least 5 technologies are in the running, with 3D XPoint leading the pack.

Inspecting Unpatterned Wafers

Finding smaller defects earlier is becoming more difficult and expensive.

More Top Stories »



Round Tables

Where FD-SOI Works Best

Experts at the Table, part 2: Why FD-SOI is being used alongside finFETs and other technologies, and what are the key drivers for chipmakers.

FD-SOI Going Mainstream

Experts at the Table, part 1: What previously was a niche technology has finally found a comfortable market on the fine line between finFETs and es...

More Lithography/Mask Challenges

Experts at the table, part 3: Demand for compute power still growing; what's after 5nm.

More Lithography/Mask Challenges

Experts at the Table, part 2: Options include everything from multi-patterning to high-NA EUV, multi-beam and e-beam—but none of them is perfect.

More Lithography/Mask Challenges

Experts at the Table, part 1: EUV ramps up, but high-volume manufacturing isn't likely to begin until at least the end of the year, maybe later.

More Roundtables »



Multimedia

22nm Process Technology

How FD-SOI compares with bulk technologies.

New Roadmap For Electronics

How new packaging and materials are changing the traditional physical boundaries of ICs.

Tech Talk: Connected Intelligence

A look at the slowdown in Moore's Law, and what comes next.

Tech Talk: MCU Memory Options

A look at the tradeoffs between embedded NVM and system in package.

Tech Talk: Smart Manufacturing

What's behind the latest industry efforts and why this is so important.

More Multimedia »



See All Posts in Manufacturing and Design »

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  Trending Articles

RISC-V: More Than a Core

Interest in the open-source ISA marks a significant shift among chipmakers, but it will require continued industry support to be successful.

Power Delivery Affecting Performance At 7nm

Slowdown due to impact on timing, and dependencies between power, thermal and timing that may not be caught by signoff tools.

RISC-V Inches Toward The Center

Access to source code makes it attractive for custom applications, but gaps remain in the tool flow and in software.

Machine Learning Shifts More Work to FPGAs, SoCs

SoC bandwidth, integration expand as data centers use more FPGAs for machine learning.

EUV Pellicle, Uptime And Resist Issues Continue

Problems won’t derail next-gen litho, but could limit use and affect schedules.