Manufacturing & Process Technology

Top Stories

RF Device And Process Biz Heats Up

Which technology will win in 5G world?

Will Self-Heating Stop FinFETs

Central fins can be up to 50% hotter than other fins, causing inconsistent threshold behavior and reliability problems.

Inside Next-Gen Transistors

Coventor's CTO looks at new types of transistors, the expanding number of challenges at future process nodes, and the state of semiconductor develo...

Inside Lithography And Masks

Experts at the table, part 2: Where EUV fits, what problems still remain, and what are the alternatives.

Patterning Problems Pile Up

Edge placement error emerges as the top issue at advanced nodes.

TFETs Cut Sub-Threshold Swing

Devices are still experimental, but they could solve power issues in scaling.

Inside Lithography And Masks

Experts at the table, part 1: EUV's viability still in doubt even as rollout begins. Uptime and cost are top concerns.

China: Fab Boom or Bust?

A frenzy of activity is causing lots of speculation about how this complex market will evolve.

MEMS: A Tale Of Two Tough Markets

First in a series: Challenges increase across the board, but for different reasons. Low profits temper investments.

Big Changes In Patterning

The shift to GPU-accelerated mask writing and curvilinear shapes could fundamentally change chip design and manufacturing.

More Top Stories »



Round Tables

Inside Lithography And Masks

Experts at the table, part 2: Where EUV fits, what problems still remain, and what are the alternatives.

Inside Lithography And Masks

Experts at the table, part 1: EUV's viability still in doubt even as rollout begins. Uptime and cost are top concerns.

BEOL Issues At 10nm And 7nm

Experts at the table, part 3: EUV, metallization, self-alignment, ALD, and the limits of copper.

New Embedded Memories Ahead

Options grow as new wave of MCUs demand more capable NVM.

BEOL Issues At 10nm And 7nm

Experts at the table, part 2: The impact and cost of air gap; reducing RC delay with liner-less approaches and cobalt; where EUV will make a dent.....

More Roundtables »



Multimedia

Tech Talk: FD-SOI vs. FinFET

Cost, performance, multi-patterning and the 12nm roadmap.

Tech Talk: Embedded Memories

Which type of memory is better and why.

Tech Talk: GPU-Accelerated Photomasks

Upcoming challenges in the mask shop and how to deal with them.

Tech Talk: Double-Triple Patterning

What comes after double patterning and why you need to understand it.

Tech Talk: 14nm And Stacked Die

Why the 14nm node will be long lived, and how it will be used in 2.5D and 3D-IC packages.

More Multimedia »



See All Posts in Manufacturing and Design »

Latest Blogs

22nm Process War Begins

High price of moving to finFETs pushes foundries to offer a less expensive alter...

Enabling Magnetic Tunnel Junctions Array Processing For Embedded STT MRAM

What to consider in optimizing this memory, and key performance metrics to watch...

The Evolution Of EUV

Why a number of individual steps ultimately proved so difficult, and how that wi...

Sizing up China’s Fab Tool Biz

Can China succeed in the IC-equipment industry? ...

The Other Side Of H1-B Visas

How restrictions on hiring will unfold for people who have nothing to do with te...

Photoresist Shape In 3D

How tiny variations can result in much bigger problems....

SEMI Members Mobilize For 2017 SEMI Washington Forum

A focus on trade, taxes, immigration, and R&D in discussions with U.S. policymak...

Impact Of Rising SoC Design Costs On Innovation

While design costs have been rising steadily since 40nm, the acceleration at 7nm...

Better Chips, Better Cars

The foundry perspective on automotive chip manufacturing....

ECO Fill Can Rescue Your SoC Tapeout Schedule

Why fill is critical to reducing time to market at all process nodes....

Will GPU-Acceleration Mean The End Of Empirical Mask Models?

Physical mask models are more important than ever, and now are practical to empl...

Samsung Foundry's Business Strategy

A look at manufacturing changes and advanced technology updates....

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Entities, people and technologies explored


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