Manufacturing & Process Technology

Top Stories

Quantum Effects At 7/5nm And Beyond

At future nodes there are some unexpected behaviors. What to do about them isn't always clear.

200mm Fab Crunch

Shortages of used equipment and lower margins mean this problem isn't getting solved anytime soon.

RF SOI Wars Begin

5G is driving up demand for both 300mm and 200mm capacity. Both are in short supply.

FinFET Metrology Challenges Grow

Hybrid schemes are being deployed, with new equipment and machine learning ramping up.

Chipmakers Look Beyond Scaling

GlobalFoundries CTO Gary Patton digs into how customers' priorities are shifting with new market opportunities.

More Lithography/Mask Challenges

Experts at the table, part 3: Demand for compute power still growing; what's after 5nm.

Next EUV Issue: Mask 3D Effects

Old problem is becoming more difficult to resolve at each new node; mitigation measures being developed.

Design Rule Complexity Rising

Total number of rules is exploding, but that's only part of the problem.

Searching For EUV Defects

What issues remain, and how they could affect manufacturing at 7/5nm.

What Happened To Nanoimprint Litho?

Next-gen lithography technology resurfaces for a variety of tasks.

More Top Stories »



Round Tables

More Lithography/Mask Challenges

Experts at the table, part 3: Demand for compute power still growing; what's after 5nm.

More Lithography/Mask Challenges

Experts at the Table, part 2: Options include everything from multi-patterning to high-NA EUV, multi-beam and e-beam—but none of them is perfect.

More Lithography/Mask Challenges

Experts at the Table, part 1: EUV ramps up, but high-volume manufacturing isn't likely to begin until at least the end of the year, maybe later.

The Next 5 Years Of Chip Technology

Experts at the Table, part 3: The impact of reduced process variation; automotive chip reliability at advanced nodes; the impact of packaging.

The Next 5 Years Of Chip Technology

Experts at the Table, part 2: What are the sources of variation, how much is acceptable, and can it be reduced to the point where it buys an extra ...

More Roundtables »



Multimedia

Tech Talk: MCU Memory Options

A look at the tradeoffs between embedded NVM and system in package.

Tech Talk: Smart Manufacturing

What's behind the latest industry efforts and why this is so important.

Tech Talk: 7nm Litho

Coventor's CTO digs into multi-patterning, new transistor types, and the biggest problems for device scaling.

Tech Talk: FD-SOI vs. FinFET

Cost, performance, multi-patterning and the 12nm roadmap.

Tech Talk: Embedded Memories

Which type of memory is better and why.

More Multimedia »



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