Manufacturing & Process Technology

Top Stories

Here Comes High-Res Car Radar

A new crop of device makers are developing chips based on high-resolution radar technology for assisted and autonomous driving in cars.

Variation Spreads At 10/7nm

Differences in equipment under scrutiny as tolerances tighten.

Overlay Challenges On The Rise

Move to 10/7nm and beyond creates need for more precise metrology and alignment within different chip layers.

Toward Neuromorphic Designs

From synapses to circuits with memristors.

Searching For EUV Mask Defects

What comes after optical inspection isn't clear, and that's a problem.

MEMS Market Shifting

More precision, new materials and a much smaller universe of companies help to make this market attractive again.

Next-Gen Mask Writer Race Begins

New tools will be required at 7/5nm, and at this point it's a two-company competition.

What Happened To ReRAM?

After years of delays, this next-gen memory is finally gaining traction.

Unsolved Litho Issues At 7nm

Computational challenges on the rise with EUV. Scanners are no longer interchangeable.

Challenges Mount For Photomasks

Optical proximity correction, EUV pellicles, inverse lithography and actinic inspection make it hard to achieve a return on investment at advanced ...

More Top Stories »



Round Tables

Inside Lithography And Masks

Experts at the table, part 3: EUV, DSA, nanoimprint, nanopatterning, and best guesses for how far lithography can be extended.

Inside Lithography And Masks

Experts at the table, part 2: Where EUV fits, what problems still remain, and what are the alternatives.

Inside Lithography And Masks

Experts at the table, part 1: EUV's viability still in doubt even as rollout begins. Uptime and cost are top concerns.

BEOL Issues At 10nm And 7nm

Experts at the table, part 3: EUV, metallization, self-alignment, ALD, and the limits of copper.

BEOL Issues At 10nm And 7nm

Experts at the table, part 2: The impact and cost of air gap; reducing RC delay with liner-less approaches and cobalt; where EUV will make a dent.....

More Roundtables »



Multimedia

Tech Talk: Smart Manufacturing

What's behind the latest industry efforts and why this is so important.

Tech Talk: 7nm Litho

Coventor's CTO digs into multi-patterning, new transistor types, and the biggest problems for device scaling.

Tech Talk: FD-SOI vs. FinFET

Cost, performance, multi-patterning and the 12nm roadmap.

Tech Talk: Embedded Memories

Which type of memory is better and why.

Tech Talk: GPU-Accelerated Photomasks

Upcoming challenges in the mask shop and how to deal with them.

More Multimedia »



See All Posts in Manufacturing and Design »

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