Manufacturing Bits: July 16


Levitating metrology The Instituto de Ciencias Físicas UNAM has developed a new contaminant detection technique. It uses sound waves to levitate droplets of water for sampling purposes. Researchers use a technique called laser induced breakdown spectroscopy (LIBS). The technique analyzes heavy metals in levitating drops of water, according to The Optical Society (OSA) journal Optics Letter... » read more

Week In Review: Manufacturing, Test


Chipmakers GlobalFoundries said that the company’s 22nm FD-SOI technology has delivered more than $2 billion worth of client design win revenue. With more than 50 total client designs, the technology is designed for automotive, 5G connectivity and the Internet of Things (IoT). Helic has announced that its electromagnetic (EM) modeling engine has been certified for GlobalFoundries’ 22nm ... » read more

Manufacturing Bits: July 10


Ruthenium interconnects Imec has developed a process to enable ruthenium (Ru) interconnects in chips at 5nm and beyond. Ru is one of several candidates to replace traditional copper as the interconnect material in chips. The interconnects, which reside on the top of the transistor, consist of tiny copper wiring schemes that transfer electrical signals from one transistor to another. The int... » read more

Week In Review: Manufacturing, Test


Chipmakers Last year, Micron filed suit against UMC, alleging that UMC stole memory technology from the company and transferred it to Jinhua Integrated Circuit Co., a DRAM maker in China. In response, UMC filed patent infringement lawsuits against Micron in the mainland China courts in January of 2018 This week, Micron appears to have suffered a legal setback in its suit against Taiwan... » read more

China IP Battle Takes New Turn


Micron Technology appears to have suffered a legal setback in its suit against Taiwan’s United Microelectronics Corp. (UMC) in China. On Tuesday, UMC announced that the Fuzhou Intermediate People's Court of the People's Republic of China (PRC) issued a preliminary injunction against Micron Semiconductor (Xi'an) and Micron Semiconductor (Shanghai), enjoining Micron from offering to sell, an... » read more

Manufacturing Bits: July 3


X-ray holography Using a technique called X-ray holography, a group of researchers have uncovered the phase transitions of vanadium dioxide. X-ray holography is a promising high-resolution metrology technique. Vanadium dioxide is one of many materials that can exhibit metal or insulator properties depending on the temperature. Vanadium dioxide can switch from an insulating to a metallic pha... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Fujitsu Semiconductor and United Microelectronics Corp. (UMC) announced that UMC will acquire all of the shares of Mie Fujitsu Semiconductor Limited (MIFS), a 300mm wafer foundry joint venture between both companies. In addition to the 15.9% of MIFS shares currently owned by UMC, Fujitsu Semiconductor will transfer the remaining 84.1% of its shares in MIFS to UMC, making MI... » read more

Manufacturing Bits: June 26


Gummy bear chips The Technical University of Munich (TUM) and Forschungszentrum Jülich have developed a 3D inkjet printing technique to print electrodes on several soft substrates, including gummy bears. The main application is to develop a new class of sensor-based implants for life sciences. For this application, electrodes or microelectrode arrays (MEAs) are developed and printed on sof... » read more

Where Is Selective Deposition?


For years, the industry has been working on an advanced technology called area-selective deposition for chip production at 5nm and beyond. Area-selective deposition, an advanced self-aligned patterning technique, is still in R&D amid a slew of challenges with the technology. But the more advanced forms of technology are beginning to make some progress, possibly inching closer from the la... » read more

Practical Methods To Overcome The Challenges Of 3D Logic Design


What should you do If you don’t have enough room on your floor to store all your old boxes? Luckily, we live in a 3D world, and you can start stacking them on top of each other. The Challenge: How can we shrink logic devices? Logic designers are currently facing even bigger challenges than you might be having in tidying up your storage area. Not only are logic cells highly packed together... » read more

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