The Week In Review: Manufacturing


Chipmakers United Microelectronics Corp. (UMC) has expanded its process portfolio within its joint fab venture in China. The Taiwan government has approved UMC’s application to license its 28nm technology to its subsidiary company in China--United Semiconductor. The subsidiary has been ramping up 40nm technology. “This licensing approval will help Fab 12X to ramp its manufacturing scale, e... » read more

RF Device And Process Biz Heats Up


The RF device and process technology markets are heating up, especially for two critical components used in smartphones—RF switch devices and antenna tuners. RF device makers and their foundry partners continue to ramp up traditional RF switch chips and tuners based on RF SOI process technologies for today’s 4G wireless networks. And recently, [getentity id="22819" comment="GlobalFoundri... » read more

Manufacturing Bits: April 25


Making strange hadrons CERN, the European Organization for Nuclear Research, has produced and observed what it says are the world’s first sub-atomic particles called strange hadrons. Strange hadrons are well-known sub-atomic particles with names such as Kaon, Lambda, Xi and Omega, according to CERN. Strange hadrons have never been observed until now. The observation could shed light on su... » read more

22nm Process War Begins


Many foundry customers at the 28nm node and above are developing new chips and are exploring the idea of migrating to 16nm/14nm and beyond. But for the most part, those companies are stuck because they can’t afford the soaring IC design costs at advanced nodes. Seeking to satisfy a potential gap in the market, [getentity id="22819" comment="GlobalFoundries"], [getentity id="22846" e_name="... » read more

Enabling Magnetic Tunnel Junctions Array Processing For Embedded STT MRAM


The semiconductor industry is entering a new era of next-generation memory technologies, with several major inflections taking shape. Among these is the emergence of Magnetic RAM (MRAM). Over several posts, I’ll provide background on what is driving the adoption of MRAM, highlight some of the initial challenges and discuss progress on making STT MRAM commerically viable. Today, a typical m... » read more

The Week In Review: Manufacturing


Fab tool vendors In the wafer fab equipment (WFE) rankings, Applied Materials was the leader in terms of market share in 2016, according to Gartner. For WFE, Lam Research jumped from fourth place in 2015 to second place in the rankings in 2016, according to Gartner. ASML was third, followed by TEL. Meanwhile, VLSI Research recently released its ranking for both front-end and backend equipment.... » read more

The Evolution Of EUV


EUV systems are beginning to ship to large foundries in volume, setting the stage for one of the biggest leaps in technology the semiconductor industry has ever witnessed. ASML has emerged as the sole supplier in this market, but it has taken an entire ecosystem to develop EUV. It has taken billions of dollars of investment by ASML, along with enormous cash infusions by Intel and TSMC, contr... » read more

Sizing up China’s Fab Tool Biz


China is pouring billions of dollars into its semiconductor industry and is building several new fabs. As reported, China is bolstering its IC industry for good reason. China is trying to reduce its huge trade imbalance in ICs. The country continues to import a large percentage of its chips from foreign vendors. Behind the scenes, China also continues to develop its domestic semiconductor eq... » read more

The Other Side Of H1-B Visas


There is a lot of discussion these days about “Hire American.” But what does that actually mean in practice? I’m at the Materials Research Society Spring Meeting this week, where one of the presentations was by a scientist who works at the TEL Technology Center, America, in Albany, NY. It’s the largest Tokyo Electron research center outside of Japan. It’s affiliated with the SUNY P... » read more

Photoresist Shape In 3D


Things were easy for integrators when the pattern they had on the mask ended up being the pattern they wanted on the chip. Multi-patterning schemes such as Self-Aligned Double Patterning (SADP) and Self-Aligned Quadruple Patterning (SAQP) have changed that dramatically. Now, what you have on the mask determines only a part of what you will get at the end. You will only obtain your final product... » read more

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