Packaging, Test & Electronic Systems

Top Stories

Light In A Package

Why silicon photonics is so difficult, and why it's becoming more popular.

Get Ready For In-Mold Electronics

Changes in packaging under development for new applications and price points.

Inside Panel-Level Fan-Out Technology

Fraunhofer's panel experts dig into why this approach is needed and where the challenges are to making it work.

The Rising Value Of Data

Race begins to figure out what else can be done with data. But not all data is useful, and some of it is faulty.

Cheaper Fan-Outs Ahead

Demand for lower cost drives R&D for panel-level packaging. But which size?

Advanced Packaging Moves To Cars

Supply chain shake-up as OEMs look to fan-outs and systems in package for differentiation and faster time to market.

Module Testing Adds New Challenges

Technology is shaping up as system-level functional test.

5G Test Equipment Race Begins

Next-gen wireless communications technology is still under development, but instrument suppliers are ready to test 5G in trial deployments.

Advanced Packaging Picks Up Steam

System-in-package technology is poised to roll out across multiple new markets.

Tracking Down Errors With Data

Optimal Plus' CTO looks at how data can be deployed to improve quality and yield, and to find out what went wrong.

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Round Tables

2.5D Surprises And Alternatives

First of two parts: Cost and supply chain issues remain as advanced packaging begins to ramp.

Stacked Die Changes

Experts at the table, part 3: How mature are high-speed interconnects and what hurdles remain for widespread adoption.

Stacked Die Changes

Experts at the table, part 2: Different coefficients of thermal expansion cause warpage problems; known good die issues.

Stacked Die Changes

Experts at the table, part 1: There are new and better options for packaging chips together as the semiconductor industry begins to figure out what...

More Roundtables »


Tech Talk: System In Package

Why advanced packaging is so important for autonomous driving and the semiconductor industry.

Tech Talk: 2.5D Issues

How ready is this packaging approach and what problems remain?

Tech Talk: 14nm And Stacked Die

Why the 14nm node will be long lived, and how it will be used in 2.5D and 3D-IC packages.

Tech Talk: 2.5D Stacked Die

What's the real motivation behind stacking die?

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Latest Blogs

Editor's Note

Systems Of Packages

How and why the concept of subsystems is changing. ...
The Connected Perspective

Whither Xcerra?

What will become of the ATE vendor?...
Accelerating Design & Test

Women In Engineering

Why mentoring and STEM are so important for the next generation of engineers....
Inside Big Data

Are All Known Good Tested Devices Created Equal?

Post-mortem on RMAs backed by Big Data Analytics prove otherwise. ...

The Future of Testing

System-level testing and other technologies are on deck....
EDA For Manufacturability

Crossing The Chasm: Uniting SoC And Package Verification

EDA companies, OSATs, and foundries must collaborate to ensure wafer-level packa...

Knowledge Centers
Entities, people and technologies explored

  Trending Articles

Four Foundries Back MRAM

Next-gen embedded memory technology ramps up in wake of flash scaling issues.

The 200mm Equipment Scramble

Demand for equipment soars, but not all business models can support rising prices.

Frenzy At 10/7nm

Focus is on cutting costs across the board, and it turns out there is still quite a bit to cut.

Tools To Design CNNs

If neural networking architectures are simpler than a CPU, why is it so difficult to create them?

A Chip For All Seasons

FPGAs are proving to be versatile for many applications.