Test, Measurement & Analytics

Top Stories

How Hardware Can Bias AI Data

Degrading sensors and other devices can skew AI data in ways that are difficult to discern.

Test On New Technology’s Frontiers

Where the gaps are and what that means for coverage and reliability.

Nvidia’s Top Technologists Discuss The Future Of GPUs

Power, performance, architectures, and making AI pervasive.

More Semiconductor Data Moving To Cloud

A year ago many companies were unwilling to ship their data offsite. What changed?

How Many Test Miles Make A Vehicle Safe?

Simulation and test can improve safety, but that requires a standard framework and definitions.

Using Better Data To Shorten Test Time

More sensors plus machine learning are making it possible to focus testing where it has the most impact.

Silicon Photonics Begins To Make Inroads

Maturing processes and new application areas open doors for extremely fast, low-power applications.

Big Shifts In Big Data

Why the growth of cloud and edge computing and the processing of more data will have a profound effect on semiconductor design and manufacturing.

5G OTA Test Not Ready For Production

High-volume, production-ready over-the-air testing systems don’t yet exist for 5G.

Data Confusion At The Edge

Disparities in processors and data types will have an unpredictable impact on AI systems.

More Top Stories »

Round Tables

New 5G Hurdles

Experts at the Table, part 2: Getting 5G standards and technology ready are only part of the problem. Reducing latency and developing applications ...

Preparing For A 5G World

Experts at the table, part 1: Rising costs, massive complexity, and challenges in testing and simulating these devices will require some fundamenta...

More Roundtables »


Improving Quality Through Data Analytics

How to utilize data across different manufacturing processes.

Ensuring A 5G Design Is Viable

What's different in 5G vs. 4G.

Using ML For Post-Silicon Validation

Why machine learning is so effective in improving chip designs.

ATE Lab To Fab

How to close the gap between the design and test worlds to improve coverage and shorten time to market.

Making AI More Dependable

Considerations in using AI to improve reliability in all chips.

More Multimedia »

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Latest Blogs

Inside Big Data

Machine Learning For ADAS Camera Manufacturing

The need for high quality automotive cameras is rising, and new technologies ...
September 16, 2019
Editor's Note

The Critical But Less Obvious Risks In AI

Just because a system starts out working correctly doesn't mean it will conti...
September 10, 2019
Accelerating Design & Test

Looking To Unlicensed Spectrum For 5G

Large amounts of spectrum are necessary for 5G to meet its potential, but sha...
Semiconductor Yield Management

The Hidden Potential Of Test Engineers

Including test engineers early in the workflow can speed time to market and m...
Test For The Autonomous Age

Highly Efficient Scan Diagnosis With Dynamic Partitioning

A clever technique increases volume scan diagnosis throughput by 10X.
Scaling Electronics

Degradation Monitoring – From Vision to Reality

How to use in-circuit monitoring and off-chip machine-learning to improve rel...
August 6, 2019
Extraordinary ASICs

Deprocessing And SEM For Semiconductor Failure Analysis

Finding failure sites that are hidden from optical view.
July 9, 2019

Knowledge Centers
Entities, people and technologies explored

  Trending Articles

Chiplets, Faster Interconnects, More Efficiency

Why Intel, AMD, Arm, and IBM are focusing on architectures, microarchitectures, and functional changes.

Nvidia’s Top Technologists Discuss The Future Of GPUs

Power, performance, architectures, and making AI pervasive.

Siemens-Mentor Deal Retrospective

CEO Tony Hemmelgarn talks about autonomous cars, 5G, EDA integration and the Siemens acquisition of Mentor.

Synthesizing Hardware From Software

Can a software engineer create hardware? It may be possible, but not in the way that existing high-level synthesis tools do it.

EDA Gears Up For 3D

Experts at the Table: What are the limitations today that are preventing 3D-ICs from becoming mainstream, and which companies pushing to make it happen?