Packaging, Test & Electronic Systems

Top Stories

Fan-Out Wars Begin

The number of low-density packaging options is increasing as the popularity of advanced packaging grows.

Cheaper Packaging Options Ahead

Low-cost alternatives to interposers could have a big impact on chip design.

Testing Analog Chips

Increasing numbers of analog components could help perk up this market after years of steady but sleepy growth.

Packaging Challenges For 2018

Shortages, pricing pressures, rising investments and more packaging options add up to an interesting year for OSATs.

Auto Chip Test Issues Grow

Semiconductors used in cars have higher quality and reliability requirements than most chips, but they have the same cost and time-to-market pressu...

Getting Serious About Chiplets

Issues involving known good die and test still remain, but this approach is getting a lot of interest.

Fan-Outs vs. TSVs

Market for advanced packaging begins to diverge based on performance and price.

Changes Ahead For Test

Testing microprocessors, microcontrollers, application processors, and other system-on-a-chip devices grows more complicated.

3D Neuromorphic Architectures

Why stacking die is getting so much attention in computer science.

Litho Options For Panel Fan-out

Panels could sharply reduce the cost of fan-outs, but this approach will require new equipment.

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Round Tables

2.5D Surprises And Alternatives

First of two parts: Cost and supply chain issues remain as advanced packaging begins to ramp.

Stacked Die Changes

Experts at the table, part 3: How mature are high-speed interconnects and what hurdles remain for widespread adoption.

Stacked Die Changes

Experts at the table, part 2: Different coefficients of thermal expansion cause warpage problems; known good die issues.

Stacked Die Changes

Experts at the table, part 1: There are new and better options for packaging chips together as the semiconductor industry begins to figure out what...

More Roundtables »


Tech Talk: System In Package

Why advanced packaging is so important for autonomous driving and the semiconductor industry.

Tech Talk: 2.5D Issues

How ready is this packaging approach and what problems remain?

Tech Talk: 14nm And Stacked Die

Why the 14nm node will be long lived, and how it will be used in 2.5D and 3D-IC packages.

Tech Talk: 2.5D Stacked Die

What's the real motivation behind stacking die?

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Latest Blogs

Editor's Note

What’s In The Package?

The emphasis on heterogeneity is increasing the burden on OSATs and foundries...
February 5, 2018

ATE Tailwind For 2018?

Will test equipment have another big year?
The Human Machine Interface

Walk A Mile In Their Shoes

Prosthetic technology is seeing rapid improvement with the integration of AI.
Accelerating Design & Test

System-Level Simulation Of Technologies Supporting Enhanc...

What does the ideal waveform for 5G communications look like?
The Connected Perspective

2017: A Good Year for ATE

Test equipment sales were up, and so were the share prices of ATE stocks.
January 8, 2018
Inside Big Data

Is It Safe To Assume That All “Passed” Die Ar...

Detecting tricky test escapes and preventing defective parts from getting int...
October 9, 2017
EDA For Manufacturability

Crossing The Chasm: Uniting SoC And Package Verification

EDA companies, OSATs, and foundries must collaborate to ensure wafer-level pa...
March 6, 2017

Knowledge Centers
Entities, people and technologies explored

  Trending Articles

Chip Aging Accelerates

As advanced-node chips are added into cars, and usage models shift inside of data centers, new questions surface about reliability.

Transistor Options Beyond 3nm

Complicated and expensive technologies are being planned all the way to 2030, but it’s not clear how far the scaling roadmap will really go.

Giant Auto Industry Disruption Ahead

Autonomous vehicles will cause fundamental shifts across a number of established industry segments tied to automotive, opening up big opportunities for chips and tools.

Deep Learning Spreads

Better tools, more compute power, and more efficient algorithms are pushing this technology into the mainstream.

Fan-Out Wars Begin

The number of low-density packaging options is increasing as the popularity of advanced packaging grows.