Test, Measurement & Analytics

Top Stories

Gaps In 5G Test

Millimeter wave technology will require a whole new approach to ensuring reliability.

Finding Defects In Chips With Machine Learning

Better algorithms and more data could bolster adoption, particularly at advanced nodes.

Domain Expertise Becoming Essential For Analytics

More data doesn't mean much unless you know what to do with it.

Using Sensor Data To Improve Yield And Uptime

Deeper understanding of equipment behavior and market needs will have broad impact across the semiconductor supply chain.

Mapping The Impact Of Heat On Photonics

Thermal effects are difficult to quantify, but they can disrupt optical signals and reduce the lifespan of lasers.

Reliability Becomes The Top Concern In Automotive

Extended lifetimes and advanced-node designs are driving new approaches, but not everything is going smoothly.

Chasing Reliability In Automotive Electronics

Supply chain changes, resistance to sharing data and technology unknowns add up to continued uncertainty.

Quantum Issues And Progress

Work begins on building a quantum computing ecosystem.

The Growing Promise Of Printed Electronics

New sensors could vastly extend the reach of electronics, creating new markets and new opportunities within existing markets.

Dirty Data: Is the Sensor Malfunctioning?

Why sensor data needs to be cleaned, and why that has broad implications for every aspect of system design.

More Top Stories »



Round Tables

New 5G Hurdles

Experts at the Table, part 2: Getting 5G standards and technology ready are only part of the problem. Reducing latency and developing applications ...

Preparing For A 5G World

Experts at the table, part 1: Rising costs, massive complexity, and challenges in testing and simulating these devices will require some fundamenta...

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Multimedia

AI In Chip Manufacturing

How AI with knowledge transfer can significantly decrease error rates and improve test.

Concurrent Test

The growing challenge to do more in the same time window.

Planarization Challenges At 7nm And Beyond

Why it's becoming harder to prepare a wafer at advanced nodes.

ATE Lab To Fab

How to close the gap between the design and test worlds to improve coverage and shorten time to market.

Using DSA With EUV

Why directed self-assembly still has an important role to play at the most advanced nodes.

More Multimedia »



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Reducing the rate of defective parts calls for a whole new quality paradigm.
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Entities, people and technologies explored


  Trending Articles

Engineering Talent Shortage Now Top Risk Factor

New market opportunities and global competitiveness are limited by qualified people.

Finding Defects In Chips With Machine Learning

Better algorithms and more data could bolster adoption, particularly at advanced nodes.

The Challenge Of RISC-V Compliance

Showing that a processor core adheres to a specification becomes more difficult when the specification is extensible.

EUV Arrives, But More Issues Ahead

Improvement still needed for uptime, defectivity, line edge roughness and process flows.

New Design Approaches At 7/5nm

Smaller features and AI are creating system-level issues, but traditional ways of solving these problems don’t always work.