Packaging, Test & Materials

Top Stories

Old Vs. New Packages

Two packaging technologies are making microchips smaller and more durable.

The Chiplet Race Begins

DARPA and a number of major vendors are backing this modular approach, but hurdles remain.

Return Of The Organic Interposer

Lower-cost options gain attention as chipmakers seek alternatives for 2.5D packaging.

New 5G Hurdles

Experts at the Table, part 2: Getting 5G standards and technology ready are only part of the problem. Reducing latency and developing applications ...

Bridges Vs. Interposers

Momentum growing for low-cost alternatives to interposers as a way of reducing overall development costs.

How To Test Autonomous Vehicles

New technologies, methodologies and flows will be required to guarantee self-driving cars are safe.

Preparing For A 5G World

Experts at the table, part 1: Rising costs, massive complexity, and challenges in testing and simulating these devices will require some fundamenta...

Advanced Packaging Confusion

Number of options and naming conventions are causing consternation throughout the semiconductor supply chain.

The Growing Materials Challenge

New applications and continued device scaling are putting increasing emphasis on materials engineering.

Extending The IC Roadmap

Imec's An Steegen sees advanced packaging as a critical component of future scaling, including new bridge technology.

More Top Stories »



Round Tables

New 5G Hurdles

Experts at the Table, part 2: Getting 5G standards and technology ready are only part of the problem. Reducing latency and developing applications ...

Preparing For A 5G World

Experts at the table, part 1: Rising costs, massive complexity, and challenges in testing and simulating these devices will require some fundamenta...

2.5D Surprises And Alternatives

Cost and supply chain issues remain as advanced packaging begins to ramp.

Stacked Die Changes

Experts at the table, part 3: How mature are high-speed interconnects and what hurdles remain for widespread adoption.

Stacked Die Changes

Experts at the table, part 2: Different coefficients of thermal expansion cause warpage problems; known good die issues.

More Roundtables »



Multimedia

Printed Electronics Materials

Why printed electronics are finding their way into edge devices, and why materials choices are so critical.

Defect Reduction At 7/5nm

Tech Talk: How materials impact quality and yield.

Tech Talk: 5G Everywhere

Where 5G works, where it doesn't, and why it's essential for so many markets.

Tech Talk: System In Package

Why advanced packaging is so important for autonomous driving and the semiconductor industry.

Tech Talk: 2.5D Issues

How ready is this packaging approach and what problems remain?

More Multimedia »



See All Posts in Packaging and Test »

Latest Blogs

Editor's Note

Who’s Paying For Auto Chip Test?

Complexity, advanced nodes, harsh conditions and safety concerns will make te...
August 6, 2018
The Human Machine Interface

Some Human Musings On Machine Learning

What will it take to make machines process information in the same way we do?
Material Science

The Next Generation Of Fingerprinting Technology

Identifying and tracking impurities before they make it onto the wafer.
All About Test

What’s in a Name?

Test Vision 2020 may need a new moniker.
Riding The Silicon Rapids

Making Organic Semiconductors Plastic

Enormous potential, but only with a better understanding of relationships bet...
July 12, 2018
Accelerating Design & Test

Toward Project-Based Learning

The value of student-centered instruction over an extended period of time.
May 7, 2018
The Connected Perspective

2017: A Good Year for ATE

Test equipment sales were up, and so were the share prices of ATE stocks.
January 8, 2018
Inside Big Data

Is It Safe To Assume That All “Passed” Die Ar...

Detecting tricky test escapes and preventing defective parts from getting int...
October 9, 2017
EDA For Manufacturability

Crossing The Chasm: Uniting SoC And Package Verification

EDA companies, OSATs, and foundries must collaborate to ensure wafer-level pa...
March 6, 2017

Knowledge Centers
Entities, people and technologies explored


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