category: Packaging and Test

category: IoT, Security & Automotive

The Rising Value Of Data
By Ed Sperling - 09 Aug, 2017 - Comments: 0

The volume of data being generated by a spectrum of devices continues to skyrocket. Now the question is what can be done with that data. By Cisco's estimates, traffic on the Internet will be 3.3 zetabytes per year by 2021, up from 1.2 zetabytes in 2016. And if that isn't enough, the flow of data isn't consistent. Traffic on the busiest 60-minute period in a day increased 51% in 2016, compare... » read more

Packaging Enters New Phase
By Ed Sperling - 07 Aug, 2017 - Comments: 0

The race is on to make advanced packaging less expensive than shrinking everything down onto the same die—much less expensive, in fact. Following several years of speculation and rather shaky market predictions at the beginning of this decade, packaging houses and foundries spent the last four years proving that packaging really does provide a viable alternative to shrinking die in terms o... » read more

Cheaper Fan-Outs Ahead
By Mark LaPedus - 07 Aug, 2017 - Comments: 5

Packaging houses continue to ramp up fan-out wafer-level packages in the market, but customers want lower cost fan-out products for a broader range of applications, such as consumer, RF and smartphones. So in R&D, the industry for some time has been developing next-generation fan-out using a panel-level format, a technology that could potentially lower the cost of fan-out. But there are ... » read more

Fine-Pitch Copper Pillar With Bond On Lead (BOL).
By STATS ChipPAC - 07 Aug, 2017 - Comments: 0

Fine pitch copper (Cu) pillar bump adoption has been growing in high-performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bond-on-lead (BOL) interconnection, while higher performance requirements are driving increased current densities. Assembling such packages u... » read more

A Tale of Two Testers
By Jeff Dorsch - 07 Aug, 2017 - Comments: 0

David Tacelli, president and CEO of Xcerra, was excited. His company’s reception for customers (and the press) at the Trou Normand restaurant in San Francisco’s hip South of Market neighborhood was going very well. Gourmet salames and other tasty foods were on offer, along with fine wines and craft ales and beers. He gleefully pointed out to editors that the product to be introduced at t... » read more

Advanced Packaging Moves To Cars
By Ann Steffora Mutschler - 07 Aug, 2017 - Comments: 0

By Ann Steffora Mutschler and Ed Sperling As automotive OEMs come up to speed on electrification of vehicles, each at their own pace, they are starting to embrace novel packaging approaches as a way to differentiate themselves in an increasingly competitive market. Wirebond used to dominate this market, where most of the chips were relatively unsophisticated and product cycles were slow... » read more

Module Testing Adds New Challenges
By Jeff Dorsch - 07 Aug, 2017 - Comments: 1

System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is something more than a chip package and a great deal smaller than most printed circuit boards. Testing these modules often requires system-level test. These modules typically will be inserted int... » read more

Design Challenges Of Next-Generation AESA Radar
By National Instruments - 07 Aug, 2017 - Comments: 0

Phased-array antennas, first used in military radar systems, are gaining in popularity for a variety of applications with new active electronically-scanned arrays (AESAs) being used for radar systems in satellites and unmanned aerial vehicles. As these systems are deployed, meeting size and performance requirements are critical. To support AESA radar development efforts, electronic design autom... » read more

Astronics Test Systems And Tabor Electronics End Obsolescence For NAVAIR
By Astronics - 07 Aug, 2017 - Comments: 0

Obsolescence. This is not a favorite word for most end users. Flexibility, options, extended product life – those words bring relief to the testing environments of end users. Yet, nonetheless, obsolescence is a factor that must be faced within the testing industry. When the US Naval Air Systems Command (NAVAIR) faced obsolescence with a major Test & Measurement OEM, they turned to Astr... » read more

Women In Engineering
By Sherry Hess - 07 Aug, 2017 - Comments: 0

While I’ve been involved in Women In Microwaves for many years now, beginning in 2011 with my chairmanship of what was then only a WIM social hour at IMS, until this year I had never participated in the WIM panel sessions that were expanded from the social hour starting several years ago. In Hawaii this year that changed when I was invited to join in the 2017 WIM panel, “Inspiring the Next ... » read more

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