Integrating Memristors For Neuromorphic Computing


Much of the current research on neuromorphic computing focuses on the use of non-volatile memory arrays as a compute-in-memory component for artificial neural networks (ANNs). By using Ohm’s Law to apply stored weights to incoming signals, and Kirchoff’s Laws to sum up the results, memristor arrays can accelerate the many multiply-accumulate steps in ANN algorithms. ANNs are being dep... » read more

OSAT Consolidation Continues


Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries Ltd. (SPIL) are beginning the process of uniting the two companies, which are among the largest outsourced semiconductor assembly and testing contractors in the world. For now, the companies will continue to operate separately, while their shares are traded under the ASX symbol on the New York Stock Exchange. ASE I... » read more

The Case For Chiplets


Discussion about chiplets is growing as the cost of developing chips at 10/7nm and beyond passes well beyond the capabilities of many chipmakers. Estimates for developing 5nm chips (the equivalent 3nm for TSMC and Samsung) are well into the hundreds of millions of dollars just for the NRE costs alone. Masks costs will be in the double-digit millions of dollars even with EUV. And that's assum... » read more

NIWeek on Offer in May


National Instruments is putting on its annual NIWeek conference and exhibition this month, May 21-24 at the Austin Convention Center in the capital of Texas. Details on the agenda and the full four-day program are available here. I’ve attended NIWeek for the past two years, and it’s an opportunity to learn new things, see impressive product demonstrations, and hear about developments ... » read more

Surface Modification: Solving Semiconductor Manufacturing Challenges


Process reliability and faster technology deployment are two of the most pressing manufacturing challenges currently facing the semiconductor industry. In a world of ever-evolving technology and innovation, engineers are working to transform materials that don’t possess all the desired functions through a method called “surface modification” – the act of modifying a material’s surface... » read more

How Power, Lighting, And EVS Improve Rotorcraft Safety And Performance


With rotorcraft serving rugged duty across a wide spectrum of mission-critical industries including firefighting, police work, emergency medical services (EMS), oil and gas transport, and search and rescue (SAR), integrating new technologies optimizes the safety and operational performance of the vehicle. Whether line-fit or retrofit, rotorcraft that operate in rugged, degraded environments dep... » read more

Understanding NI CompactRIO Scan Mode


The LabVIEW Real-Time Module 8.6 introduced powerful new features for programming CompactRIO hardware that reduce development time and complexity as well as provide tools for monitoring and maintaining CompactRIO applications. This functionality is powered by two technologies in LabVIEW, the NI Scan Engine and the RIO Scan Interface. The NI Scan Engine is a new component of LabVIEW Real-Time th... » read more

MIS Packaging Takes Off


Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on MIS substrate technology, which is ramping up in the analog, power IC and even the cryptocurrency markets. MIS starts with a specialized substrate material for select IC packages. The MIS sub... » read more

Software-Defined Test And Measurement


Software-defined radios, instrumentation and test are ramping up alongside a flood of new technologies related to assisted and autonomous vehicles, 5G, and military/aerospace electronics, breathing new life and significant change into the test and measurement market. Software-defined test adds flexibility in markets where the products and protocols are evolving or still being defined, and wh... » read more

Packaging Chips For Cars


As the complexity of automotive chips grows, so does the complexity of the package. In fact, packaging is becoming increasingly crucial to the performance and reliability of the chips, and both parts need to meet stringent safety standards before they are used inside a vehicle. This is true for all safety-critical applications, but for automotive in particular there are several key reasons w... » read more

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