Paving The Way To Autonomous Driving


Over the past couple weeks, four major carmakers began pairing off to jointly develop autonomous vehicles. Numerous reports say Ford will sign a deal with Volkswagen, and BMW is working on Level 4 self-driving vehicles with Daimler, the parent of Mercedes Benz. While this speaks volumes about the enormous cost of developing artificial intelligence systems to drive vehicles, it also points th... » read more

Challenges Of Logic BiST In Automotive ICs


The electronics in passenger cars continues to grow, and much of it is bound by the strict functional safety requirements formalized in the ISO 26262 standard. The ICs that drive the electronics systems in automobiles are also increasingly complex, designed to execute artificial intelligence algorithms that govern emerging self-driving capabilities. Designers are quickly adopting comprehensi... » read more

Silicon Photonics Begins To Make Inroads


Integrating photons and electrons on the same die is still a long way off, but advances in packaging and improvements in silicon photonics are making it possible to use optical communication for a variety of new applications. Utilizing light-based communication between chips, or in self-contained modules, ultimately could have a big impact on chip design. Photons moving through waveguides ar... » read more

Practical Ways To Reduce Test Time


If someone said that paper never refused ink, they could have said the same about test programs and tests. Early on in my career as a test development engineer, I commented out all tests except the key test for the new product I was working on. This allowed me to isolate the test and fix its repeatability. The next pre-production run finished much earlier than I expected and I was impressed ... » read more

Big Shifts In Big Data


The big data market is in a state of upheaval as companies begin shifting their data strategies from "nothing" or "everything" in the cloud to a strategic mix, squeezing out middle-market players and changing what gets shared, how that data is used, and how best to secure it. This has broad implications for the whole semiconductor supply chain, because in many cases it paves the way for ... » read more

Deprocessing And SEM For Semiconductor Failure Analysis


A typical semiconductor is fabricated from metal and barrier layers separated by passivation layers. A further glassivation and/or polyimide layer on top of these provides environmental and mechanical protection. Optical microscopes By using optical microscopy, the semiconductor die can be inspected for failure modes such as top-down visible crack degradation, melt-down of metal conductors,... » read more

Manufacturing ADAS Cameras Calls For Analytics


Automotive camera design and manufacturing is one of the most difficult undertakings in hardware. Not only do you need to deal with the usual difficulties of high performance mechanical and electrical designs, but now highly specialized and sensitive optics are added into the equation. Complicating factors is that you won’t know how good the product is until it’s been completely assembled, ... » read more

5G OTA Test Not Ready For Production


5G is poised to dominate the wireless world, but over-the-air (OTA) testing of 5G beamforming antennas is still not ready for volume production. Beamforming is a critical element in the millimeter wave version of 5G, because of the limitations of ultra-high-frequency signals. Unlike 4G and its predecessors, millimeter wave technology will not penetrate objects, so signals need to be directed... » read more

Highlights From The Automotive Testing Expo 2019


Thousands of automotive engineers and enthusiasts visited the Automotive Testing Expo in Stuttgart, Germany, in May to see nearly 500 companies show off their latest technologies to test features such as active safety, vehicle electrification, and connectivity, among others. This blog features highlights of the expo and the Autonomous Vehicle Test and Development Symposium held in conjunction w... » read more

Meeting ISO 26262 Requirements Using Tessent IC Test Solutions


As the industry moves towards greater automation in vehicles, suppliers of the ICs used to drive the automotive electronic systems are rapidly adopting solutions to meet ISO 26262 requirements. The Tessent family of IC test products offers the highest defect coverage, in-system non-destructive memory test, hybrid ATPG/Logic BIST, and analog test coverage measurement. These technologies add up t... » read more

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