Time For Massively Parallel Testing


Time is money in electronics, as in other industries, and the more time that is invested in testing chips means more costs being added to the product in question. To speed up testing for memory devices and other semiconductors, test equipment vendors have resorted to parallel testing technology, simultaneously testing multiple chips at a time. The industry also is turning to system-level tes... » read more

Is Product Quality Getting Lost In The IIoT?


Manufacturing operations have continuously evolved using data capture and management to assess and test production effectiveness on the manufacturing floor. The advent of the Industrial Internet of Things (IIoT) and its anticipated ability to track and manage the factory environment with machine-to-machine process analytics heralds yet another transformation, promising a higher level of data in... » read more

Getting Ready For 5G


Evolving communication systems are driving developments in the RF/microwave industry. The big umbrella of 5G focuses on supporting three main technologies: 1. Enhanced mobile broadband, which is the natural development of LTE; 2. Massive machine-type communications, also known as the Industrial Internet of Things (IIoT), and 3. Ultra-reliable, low-latency communications providing mission-cri... » read more

System-Level Testing


This white paper on system-level testing for semiconductors. Covering the history and trends of system-level test for semiconductors, this solution brief discusses: The increasing complexities of testing advanced semiconductor integrated devices across a span of applications: automotive, mobile computing, wearables, and more; Semiconductor trends driving necessary shifts in testing method... » read more

Board Level Reliability Of Automotive Embedded Wafer-Level BGA FOWLP


With shrinking chip sizes, Wafer Level Packaging (WLP) is becoming an attractive packaging technology with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the advancement of various fan-out Wafer Level Packaging (FOWLP) designs, this advanced technology has proven to be a more optimal and promising solution compared to fan-in WLP because of the greater design flex... » read more

An Advanced Product Analytics Platform For Industry 4.0 And IIoT


Industry 4.0, Industrie 4.0 or the fourth industrial revolution, is the current trend of automation and data exchange in manufacturing technologies. IIoT is a critical component of Industry 4.0 combining sensing, intelligent analytics and Internet/cloud connectivity. One of the main tasks of Industry 4.0 is mass personalization (meeting the customer’s needs more effectively and efficiently) ... » read more

2.5D, FO-WLP Issues Come Into Focus


Advanced packaging is beginning to take off after years of hype, spurred by 2.5D implementations in high-performance markets and fan-out wafer-level packaging for a wide array of applications. There are now more players viewing packaging as another frontier driving innovation. But perhaps a more telling sign is that large foundries in Taiwan have begun offering packaging services to customer... » read more

12 Important Considerations When Migrating to the Digital Pattern Instrument


The PXI Digital Pattern Instrument brings ATE-class digital to the PXI platform through features and programming that are familiar to semiconductor test engineers. Those features not only come through in the hardware of the instrument, they also appear in the NI-Digital Pattern Driver and Digital Pattern Editor. The digital pattern instrument represents an improved experience to previously exis... » read more

How Testing MEMS, Sensors Is Different


When it comes to testing microelectromechanical system devices and sensors, sometimes you have to shake and bake. [getkc id="311" comment="MEMS"] and [getkc id="187" kc_name="sensors"] are physically different from standard ICs. They require a specific type of stimulus to get the required testing results. Most chips only need to have an electrical charge run through them to gauge their pass/... » read more

Electroplating IC Packages


The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. [getentity id="22817" e_name="Applied Materials"]  recently rolled out an ECD system for IC packaging. In addition, Lam Research, TEL and others compete in the growing but competitive ECD equipment market for packaging. ECD—sometimes referred to as pl... » read more

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