Here Come The Economists


Big data is undergoing some big changes. For years, the challenge was getting enough good data to create models for everything from Wall Street trends to traffic routing. But with an influx of data from billions of sensors and electronic transactions, data is no longer in short supply. In fact, there is so much data pouring in that companies need to figure out what to do with it. That requi... » read more

Next-Generation Vehicles Pose Automotive Semiconductor Test Challenges


Various market trends are driving requirements for automotive semiconductor test as technology increasingly defines the future of the automobile. According to IHS Markit, the total market for semiconductors, having reached nearly $500 billion in 2018, will grow at a CAGR of 4.88% through 2022, while the automotive electronics category, reaching more than $40 billion in 2018, will outpace the to... » read more

Hidden Soldier Joints Inspection: 4 Case Studies


IC packaging technologies are becoming smaller and thinner. Ball grid array (BGA) packages were introduced some years ago in order to save space on the PCB, and are now widely used. To overcome the resulting problems with using optical microscopy as an inspection tool, the endoscope found its way into quality engineering departments. To read more, click here. » read more

Best Practices For Saving Measurement Data


You collect data to make decisions. However, an inefficient file format may cause problems when analyzing your data. The key to choosing a file format for your application involves thinking about the current system requirements and how the file can adapt for future application needs. To help you organize your file format for your application, use the guide and checklist of questions: • Ho... » read more

3D Metal Printing: Does It Add Up?


Prolific Renaissance artist Michelangelo said, “The sculpture is already complete within the marble block before I start my work. ... I just have to chisel away the superfluous material.” I wonder what the great visionary would think of exchanging his chisel for an additive-manufacturing tool such as today’s 3D printers. 3D printing has been around since the 1980s, when it was first kn... » read more

Challenges In Making And Testing STT-MRAM


Several chipmakers are ramping up a next-generation memory type called STT-MRAM, but there are still an assortment of manufacturing and test challenges for current and future devices. STT-MRAM, or spin-transfer torque MRAM, is attractive and gaining steam because it combines the attributes of several conventional memory types in a single device. In the works for years, STT-MRAM features the ... » read more

Breakthrough For Scan Diagnosis With Machine Learning


Cell-aware diagnosis is a new and effective way to detect defects inside standard cells. Industry standard failure analysis (FA) results from a major foundry show that cell-aware diagnosis is very effective at increasing the resolution of the diagnosis by reducing the number of suspects in cell-internal defect data. With advanced technology nodes, we have more complex layout structures and f... » read more

A Different Approach To Failure Analysis


Decapsulation of plastic IC packages in different types and size were performed by wet chemical technique. Studied devices were to use in satellites and going to subject a series of test which require the die to be exposed. Different package types with changing sizes and bonding types such as Au- and Cu-bonded packages for unmounted and PCBA-mount components were successfully achieved. A combin... » read more

Meeting ISO 26262 Requirements Using Tessent IC Test Solutions


As the industry moves towards greater automation in vehicles, suppliers of the ICs used to drive the automotive electronic systems are rapidly adopting solutions to meet ISO 26262 requirements. The Tessent family of IC test products offers the highest defect coverage, in-system non-destructive memory test, hybrid ATPG/Logic BIST, and analog test coverage measurement. These technologies add up t... » read more

5G Heats Up Base Stations


Before 5G can be deployed commercially on a large scale, engineers have to solve some stubborn problems—including how to make a hot technology a whole lot cooler. 5G-capable modem chipsets are already on the market from Qualcomm, Samsung, Huawei, MediaTek, Intel and Apple, with some 5G service (LTE-Advanced/LTE-Advanced Pro) available in the U.S. But still mostly missing from the 5G equati... » read more

← Older posts