What’s In The Package?


Putting a variety of chips or hardened IP blocks into a package rather than trying to cram them into a single chip continues to gain ground. But it's also creating its own set of issues around verifying and testing these devices. This problem is well understood inside of SoCs, where everything is integrated into a single die. And looked at from a 30,000-foot perspective, packaging is someth... » read more

ATE Tailwind For 2018?


The automatic test equipment market enjoyed a record sales year during 2017, and there are indications that the good times will continue this year. Forecasters are predicting another robust year for sales of DRAMs and NAND flash memory devices, especially 3D NAND. That will drive demand for memory test equipment to keep up. Frost & Sullivan predicts semiconductor test equipment will h... » read more

NI Trend Watch 2018


Technology has never progressed faster than it is today, so we must think critically about where we’re headed and how we’ll get there. The NI Trend Watch provides insight into some of the biggest trends and challenges engineers will face as we accelerate into our future faster than ever before. To read more, click here. » read more

Fan-Out Wars Begin


Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, STATS ChipPAC and others sell traditional low-density fan-out packages, although some new and competitive technologies are beginning to appear in the market. Low-density fan-out, or sometimes cal... » read more

Cheaper Packaging Options Ahead


Lower-cost packaging options and interconnects are either under development or just being commercialized, all of which could have a significant impact on the economics of advanced packaging. By far, the most cited reason why companies don't adopt advanced [getkc id="27" kc_name="packaging"] is cost. Currently, silicon [getkc id="204" kc_name="interposers"] add about $30 to the price of a med... » read more

Walk A Mile In Their Shoes


To most of us, when we think about how artificial intelligence (AI) enhances our mobility, the most top-of-mind examples might be how our smart phones respond to voice commands when we ask for directions to the nearest coffee shop or the current weather at the location to which we’re heading. But for people missing limbs, AI has the potential to give them the mobility that they might never ha... » read more

Testing Analog Chips


The world of analog components is broad and diverse, and while testing analog chips may not take as long as running tests on complex SoCs, there are different requirements for analog devices. One type of chip that's seeing more application these days is analog microelectromechanical system devices. Automotive electronics call for a number of [getkc id="37" kc_name="analog"] chips, along with... » read more

System-Level Simulation Of Technologies Supporting Enhanced Spectral Efficiency For 5G New Radio


By Gent Paparisto, Joel Kirshman, and David Vye 5G New Radio (5G NR) is the wireless standard defining the next generation of mobile networks. 5G will offer higher capacity than current 4G, enabling a higher density of mobile broadband users and supporting device-to-device and massive-machine communications. 5G research and development will support lower latency, improved reliability, and... » read more

Fan-Out Wafer Level eWLB Technology As An Advanced System-in-Package Solution


System-in-Package (SiP) technology continues to be essential for higher integration of functional blocks to meet the ever demanding market needs with respect to smaller form factor, lower cost and time to market. A typical SiP incorporates all or some form of Fan-Out Wafer Level packaging, wire bonding or flip chip that serves a multitude of applications such as optoelectronics, RF, power ampli... » read more

Test Innovations For ISO 26262


We are witnessing the gradual transition of the automobile from a simple means of transportation to a mobile electronic hub. The amount of electronic content in passenger cars continues to grow rapidly. Recent reports indicate that electronics now contribute about 40% of the total costs of a traditional internal-combustion-engine car, and this jumps as high as 75% for the growing number of elec... » read more

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