category: Packaging and Test

category: IoT, Security & Automotive

Testing AI Systems
By Ed Sperling - 15 Jan, 2019 - Comments: 0

AI is booming. It's coming to a device near you—maybe even inside of you. And AI will be used to design, manufacture and even ship those devices, regardless of what they are, where they are used, or how they are transported. The big questions now are whether these systems work, for how long—and what do those metrics even mean? An AI system, or AI-enhanced system, is supposed to adapt ove... » read more

More 2.5D/3D, Fan-Out Packages Ahead
By Mark LaPedus - 15 Jan, 2019 - Comments: 0

A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

Chasing Reliability In Automotive Electronics
By Susan Rambo And Ed Sperling - 15 Jan, 2019 - Comments: 0

Assuring reliability in automotive electronics has set off a scramble across the semiconductor supply chain and unearthed a list of issues for which there is insufficient data, a lack of well-defined standards, and inconsistent levels of expertise. Reliable functional safety that spans 18 to 20 years of service in harsh environments, or under constant use with autonomous taxis or trucks, is ... » read more

What AI Is… And Isn’t
By Terry Brewer - 15 Jan, 2019 - Comments: 0

AI is very good at some things. It may never be good at others. The challenge is figuring out where it can help the most, and then making the cost calculation for how it can be applied. Cost sounds like it should be fairly straightforward, but it isn't. For instance, what is the cost of continuing to doing something the same way if you aren't making necessary changes? Delaying those changes ... » read more

The Next Big Generation
By Judy Davies - 15 Jan, 2019 - Comments: 0

As members of the global semiconductor business, we are continually looking to identify the next big thing (NBT) that will drive market growth. Typically, we try to predict which new product – from smart vehicles to wearable electronics – will become the next mass-market item that will boost our industry into a successively higher orbit. Thanks to the innovators and visionaries among us, th... » read more

The Next Semiconductor Revolution
By Ed Sperling - 15 Jan, 2019 - Comments: 0

What will drive the next semiconductor revolution? When you ask people with decades of experience in semiconductor manufacturing and software development, the answers include everything from AI and materials to neuromorphic architectures. Federico Faggin, designer of the world's first microprocessor; Terry Brewer, president and CEO of Brewer Science; Sanjay Natarajan, corporate vice presi... » read more

AI In Chip Manufacturing
By Ed Sperling - 15 Jan, 2019 - Comments: 0

Ira Leventhal, New Concept Product Initiative vice president at Advantest, talks with Semiconductor Engineering about using analysis and deep learning to make test more efficient and more effective. https://youtu.be/3VVG4JVnjHo » read more

Using a Fault Insertion and Current Sensing Unit
By National Instruments - 15 Jan, 2019 - Comments: 0

When testing embedded software on mission critical electronic control units, like those used in automobiles or aircraft, it is important to validate the behavior with external faults for example if the integrity of the signals to the controller are compromised. The SLSC-12251/2 products from NI are designed for this purpose, these modules can be inserted into the signal path between the data ac... » read more

Striking the Right Chord for Chiplet Integration
By Kandou Bus - 14 Jan, 2019 - Comments: 0

The growing digitalization of our society has made our lives connected and, in many aspects, easier. But the digital revolution also implies that the total amount of data processed in the world is doubling every two years or so. Electronic devices such as mobile phones, laptops, satellites, servers or self-driving vehicles must cope with twice as much data, at higher speeds. Traditional signali... » read more

Vapor-Deposited Octadecanethiol Masking Layer on Copper for Selective Hf3N4 ALD
By Veeco - 14 Jan, 2019 - Comments: 0

Full title: Vapor-deposited octadecanethiol masking layer on copper to enable area selective Hf3N4 atomic layer deposition on dielectrics studied by in situ spectroscopic ellipsometry Journal of Vacuum Science & Technology A 36, 031605 (2018); Authors: Laurent Lecordiera, Veeco Instruments Sebastiaan Herregods and Silvia Armini, IMEC Area-selective atomic layer deposition (AS-ALD) h... » read more

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