category: Packaging and Test

category: IoT, Security & Automotive

Auto Chip Design, Test Changes Ahead
By Kevin Fogarty - 19 Sep, 2018 - Comments: 0

The automotive industry’s unceasing demand for performance, coupled with larger and more complex processors, are driving broad changes in how electronics are designed, verified and tested. What's changing is that these systems, which include AI-oriented logic developed at the most advanced process nodes, need to last several times longer than traditional IT and consumer devices, and they n... » read more

System-Level Test: Where Does It Fit?
By Astronics - 17 Sep, 2018 - Comments: 0

Our second C-Brief discusses where system-level test (SLT) best fits into your semiconductor test workflow. With automated testing equipment (ATE), a traditional workflow may consist of: Wafer sort (WS) Burn-in after packaging (BI) Combination of structural testing (ST) and functional testing (FT). As demands on high-volume manufacturing shift in response to wider industry and com... » read more

Intel Buys NetSpeed for NoC, Fabric IP
By Jeff Dorsch - 10 Sep, 2018 - Comments: 0

Intel acquired NetSpeed Systems, taking in network-on-a-chip and interconnect fabric intellectual property for designing, developing, and testing system-on-a-chip devices. The acquisition gives Intel a key missing ingredient in its plan to develop customized heterogeneous solutions for its customers. The company now has various memory pieces, interconnect bridges, programmable logic and ASIC... » read more

The Quest For Perfection
By Ed Sperling - 10 Sep, 2018 - Comments: 0

Demands by automakers for zero defects over 15 years are absurd, particularly when it comes to 10/7nm AI systems that will be the brains of autonomous and assisted driving or any mobile electronic device. There are several reasons for this. To begin with, no one has ever used a 10/7nm device under extreme conditions for any length of time. Chips developed at these nodes are just starting to ... » read more

5G Lessons Learned From Automotive Radar Test
By Advantest - 10 Sep, 2018 - Comments: 0

Situated between microwave and infrared waves, the millimeter-wave spectrum is the band of spectrum between 30 gigahertz (GHz) and 300GHz. It is used for high-speed wireless communications and is widely considered as the means to bring 5G into the future by allocating more bandwidth to deliver faster, higher-quality video, and multimedia content and services. Automotive radar is the entry point... » read more

The Race To Zero Defects
By Jeff Dorsch - 10 Sep, 2018 - Comments: 1

By Jeff Dorsch and Ed Sperling Testing chips is becoming more difficult, more time-consuming, and much more critical—particularly as these chips end up in cars, industrial automation, and a variety of edge devices. Now the question is how to provide enough test coverage to ensure that chips will work as expected without slowing down the manufacturing process or driving up costs. Balanci... » read more

Solving Fan-Out Wafer-Level Warpage Challenges Using Material Science
By Kim Yess - 10 Sep, 2018 - Comments: 0

Now more than ever we’re finding that semiconductor process engineers are turning to material scientists to help find solutions for their most complex challenges. Currently, they are looking for ways to improve fan-out wafer-level packaging (FOWLP), one of today’s hottest technologies for heterogeneous integration. Often, with these new advanced solutions come challenges that can impact ... » read more

Cobalt Shortages Ahead
By Mark LaPedus - 10 Sep, 2018 - Comments: 0

Rapid growth of electric vehicles is creating an enormous demand for cobalt, causing tight supply, high prices and supply chain issues for this critical material. Cobalt is a ferromagnetic metal and one of the key materials used in lithium-ion batteries for cell phones, notebook PCs, battery-electric cars and hybrids. It also is used in alloys and semiconductors. And while the IC industry co... » read more

Sorting Out Packaging Options
By Ed Sperling - 10 Sep, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with David Butler, executive vice president and general manager of SPTS Technologies; Ingu Yin Chang, senior vice president president at ASE Group; Hubert Karl Lakner, executive director of the Fraunhofer Institute for Photonic Microsystems; Robert Lo, division director for electronics and optoelectronics research at Industrial T... » read more

Digital Fabrication’s Promise And Potential Pitfalls
By Judy Davies - 10 Sep, 2018 - Comments: 0

Semiconductor functionality continues to expand, enabling robotic machines to analyze problems, make decisions and communicate information better than ever. These capabilities open the door for new applications such as Industry 4.0, a term now commonly used throughout Europe and the U.S. (more on Japan’s interpretation to follow). By integrating the performance capabilities of the Internet of... » read more

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