Chip industry repositions as technology begins to take shape; no clear winners yet.
Design challenges and tool flow gaps emerge, but so do real-world PPA metrics.
High price of moving to finFETs pushes foundries to offer a less expensive alternative.
Technology will complement cameras and radar in autonomous vehicles.
The ability to shrink devices will continue for at least four more nodes as EUV begins to ramp, but it’s just one of a growing number of options.