Special Reports

The Rising Price Of Power In Chips

By: Ed Sperling

More data requires faster processing, which leads to a whole bunch of problems — not all of which are obvious...
Backside Power Delivery Gears Up For 2nm Devices

By: Laura Peters

But this novel approach to optimizing logic performance depends on advancing lithography, etching, polishing, and bonding processes.
SRAM Scaling Issues, And What Comes Next

By: Karen Heyman

While it will remain a workhorse memory, using SRAM at advanced nodes requires new approaches.

 more »

Top Stories

Optimizing Energy At The System Level

A lot of effort has gone into optimization of hardware during implementation, but that ...

Backside Power Delivery Adds New Thermal Concerns

Lack of shielding, routing issues, and new mechanical stresses could have broad impact ...

Photonics: The Former And Future Solution

Twenty-five years ago, photonics was supposed to be the future of high technology. Has ...

Security Is Critical For Commercial Chiplets

Data management, trust, traceability, and provenance tracking are essential to making a...

DTCO/STCO Create Path For Faster Yield Ramps

A holistic approach can improve reliability and reduce defects, but it has to start ear...

AI/ML Challenges In Test and Metrology

New tools are changing the game, but it will take time and collaboration for them to ac...

Strategies For Detecting Sources Of Silent Data Corruption

Manufacturing screening needs improvement, but that won't solve all problems. SDCs will...

Increased Automotive Data Use Raises Privacy, Security Concerns

More valuable data is being generated by vehicles and collected by a variety of compani...

Securing DRAM Against Evolving Rowhammer Threats

A multi-layered, system-level approach is crucial to DRAM protection.

V2X Path To Deployment Still Murky

While industry experts expect many benefits of V2X technology, technological and social...

Chiplet IP Standards Are Just The Beginning

Data and protocol interoperability standards are needed for EDA tools, and there are mo...

Startup Funding: February 2024

Power electronics, data center interconnects among 49 startups that raised $800 million.

more top stories »

Latest News

Chip Industry Week In Review

Europe expands its semi footprint; Arm-Cadence automotive chiplets; Indian government's tech deals; Europe's AI Act; Cerebras' 4T transistors; DTCO/STCO; power re...

Blog Review: Mar. 13

Address translation in PCIe; 1.6T Ethernet; algorithm-specific NPUs; battery drain analysis.

more news »



Research

Chip Industry Technical Paper Roundup: Mar. 11

Current-induced switching of ferromagnets; fault-resistant par...

Research Bits: Mar. 11

Ferroelectric nanosheets; superluminescent projection printing...

Chip Industry Technical Paper Roundup: Mar. 5

Analog IMC; timing vulnerabilities in processors; scaling and ...

more research »



Startup Corner

Startup Funding: February 2024

Power electronics, data center interconnects among 49 startups...

Startup Funding: January 2024

Chiplet packaging, AI, and quantum draw investment; 20 startup...

more startups »

Videos

Changes And Challenges In Auto MCUs


Integration Challenges For RISC-V Designs


New Issues In Power Semiconductors


Yield Tracking In RDL


Knowledge Centers / Entities, people and technologies explored