Special Reports

Pressure Builds To Revamp The Design Flow

By: Ed Sperling

Some contend it needs to be rebuilt from scratch, others believe it can be tweaked and ...
FinFET Rollout Slower Than Expected

By: Mark LaPedus

It costs nearly three times more to design a finFET-based chip than a 28nm planar chip,...
Is Dark Silicon Wasted Silicon?

By: Ann Steffora Mutschler

The physics of semiconductor scaling require thinking about die area utilization in a n...

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Top Stories

What Not To Verify

Successful verification increasingly depends on being much more selective.

What EDA’s Big 3 Think Now

One year later, the conversation has shifted for all three CEOs.

Is Art Acceptable In Verification?

Fuzzy definitions, complexity and a vast range of designs make it difficult to draw con...

Blurring The Lines On Prototyping

More granular approaches emerge for when to use physical and virtual prototyping, and f...

Sponges, Skyscrapers, And Low-K

New strategies for using low dielectric constant materials.

New Patterning Paradigm?

Selective deposition may be the way forward to the far reaches of device scaling after ...


Experts at the table, part 1: Why is FD-SOI needed and for what applications? Plus, how...

Next EUV Challenge: Mask Inspection

EUV lithography is making progress finally, but there are other related issues that sti...

Flash Dance For Inspection And Me...

3D NAND is the logical next step, but metrology and inspection issues continue to mount.

Ecosystem Changes

Experts at the table, part 3: What information gets shared with competitors; comparing ...

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Latest News

The Week In Review: Manufacturing

Who bought EUV tools?; fan-out consortium; KLA and Lam results...

The Week In Review: Design/IoT

Synopsys acquires security company Codenomicon; Mentor Graphic...

Blog Review: April 22

Neural engineering; harvesting energy from rain; trade-offs to...

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Startup Corner

Brite Semiconductor: Design Services

Company leverages tight relationship with foundry and packagin...

more startups »


Manufacturing Bits: April 21

Fan-out packaging consortium; making MoS2; MoS2 FETs.

Power/Performance Bits: April 21

Harvesting more electromagnetic energy; switching on molecular...

System Bits: April 21

What DARPA is investigating; MIT's tech forecasting model.

more research »

Knowledge Centers / Entities, people and technologies explored

International News

NXP To Buy Freescale For $16.7B

Overlap minimal between companies, strengthening position in a...

Executive Insight: Frankwell Lin

Andes Technology's president talks about the exploding market ...

ARM Buys Dutch IoT Security Company

Purchase fills in missing puzzle piece for embedded microcontr...

EDA Up, Japan Continues To Slide

Strong growth in PCB driven by automotive market; China, Asia ...

more international news »