Special Reports

New Wave Of Consolidation

By: Ed Sperling

What's driving it, what's next, and who should be concerned?
Why EUV Is So Difficult

By: Mark LaPedus

One of the most complex technologies ever developed is getting closer to rollout. Here'...
Healthcare IoT: Promise And Peril

By: Gale Morrison

Regulation, legal liability and added design costs make this a difficult market to tap.

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Top Stories

Embedded Software Verification Is...

Inconsistent results, integration issues, and lack of financial incentives to solve the...

Tuning Heterogeneous SoCs

Just adding more cores doesn't guarantee better performance or lower power.

Analog’s Rising Status

Uptick in demand low power and power-sensitive designs brings new challenges and opport...

Reflecting Back on 2016: Markets

How last year's predictions panned out over the past 12 months.

Timing Closure Issues Resurface

Adding more features and more power states is making it harder to design chips at 10nm ...

Car Becomes A Living Platform

An entirely new view of all aspects of a vehicle is essential to design moving forward.

IoT Security Risks Grow

Experts at the table, part 1: Side-channel attacks, botnets, ransomware all loom as att...

Optimizing Multiple IoT Layers

Where and how IoT engineering teams are approaching design optimization among various l...

Smart Cities, Challenging Issues

Research points to massive savings and better quality of life, but getting there isn't ...

Agricultural IoT: Outstanding In ...

The Internet of Things for agriculture. Yes, it’s a thing—and a huge market.

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Latest News

Blog Review: Dec. 7

Verification results; portable stimulus; JESD204B; MEMS capaci...

The Week In Review: Manufacturing

Changes at SEMI; FD-SOI program; phone, PC, tablet forecasts.

The Week In Review: IoT

Intel shakes up IoT Group; Mirai variant touted; EEMBC preps s...

The Week In Review: Design

Kilopass pushes eNVM into finFET world; IP for MIPI I3C and C-...

more news »


Manufacturing Bits: Dec. 6

Magnet record; IEDM potpourri; 7nm; gate-all-around FETs.

System Bits: Dec. 6

Computers that read; custom drones; 3-atom-thick chip prototype.

Power/Performance Bits: Dec. 6

Perovskites for data storage; large solar cells.

more research »

Startup Corner

GMK: Rethinking The Audio Jack

Korean startup adds power and digital communication to standar...

more startups »

Knowledge Centers / Entities, people and technologies explored


Siemens To Buy Mentor For $4.5B

Updated: Deal adds mechanical, thermal, electrical and embedde...

Samsung To Buy Harman For $8B

Tier 1 acquisition boosts automotive portfolio.

Qualcomm + NXP = IoT Powerhouse

What the Qualcomm-NXP deal means for IoT.

Lam, KLA-Tencor Scrap Merger

Updated: Regulatory issues plague M&A activity in fab tool bus...

more Business »