Special Reports

Thermal Damage To Chips Widens

By: Ed Sperling

Heat issues resurface at advanced nodes, raising questions about how well semiconductor...
What Is Cyberwarfare?

By: Ernest Worthman

Tens of billions of dollars are being spent on this growing threat, but so far no one c...
Will 5nm Happen?

By: Mark LaPedus

Investments in finFET technology are hard to discard, but technical and financial chall...

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Top Stories

Debug Becomes A Bigger Problem

EDA companies have been developing more integrated debug flows that bring execution eng...

Adventures In Assembly

How engineering teams are approaching SoC assembly is changing.

Powerful New Standard

A new version of IEEE 1801 enables complete power-aware flows to be constructed using a...

Fuel Cells And The IoE

From the infrastructure, to transportation, to the smart home, and mobile devices, fuel...

M2M Vs. IoE

Before IoE there was M2M, but will it continue to exist?

Designing SoCs For Hybrids

It’s a whole new ballgame when it comes to designing SoCs for hybrid electric vehicle...

Network Challenges Ahead

High performance and high security will become a requirement for the IoE, but right now...

Executive Insight: Paul Kocher

Rambus' cryptography guru talks about new worries, and why we're further from a solutio...

Fallout From Scaling

There are an increasing number of options to deal with the device scaling issues. All o...

Upcoming Hurdles For The Semicond...

Experts at the table, part three: Going vertical; consolidation; partnerships; playing ...

more top stories »


Latest News

The Week In Review: Manufacturing

N.Y. launches EUV center; 14nm foundry tools; EU packaging gro...

The Week In Review: Design/IoT

Imagination CEO steps down; Mentor Embedded Linux update; 14nm...

Blog Review: Feb. 10

Hybrid planes; thermal as the new power; simulating sky lanter...

more news »



Startup Corner

GridComm: Smarter Grids

Singapore startup utilizes powerline infrastructure to reduce ...

more startups »



Research

System Bits: Feb. 9

Hack-proof RFID chips; silicon-based photonics chips; silver a...

Manufacturing Bits: Feb. 9

3D chip consortium; warm dense matter; copper atom lasers.

Power/Performance Bits: Feb. 9

Molybdenum disulfide memristors; neural network chip for mobil...

more research »

Knowledge Centers / Entities, people and technologies explored

M&A/Business

Lam To Acquire KLA-Tencor

Deal would give Lam strong position in mask and wafer inspection.

ARM Buys Carbon

Deal allows ARM to create virtual prototypes for performance a...

Mentor Buys Remainder Of Calypto

Why the HLS division was spun out, and why it is now being rec...

Intel Acquires Docea Power

Intel has acquired another EDA company, although both companie...

more M&A/Business »

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