Special Reports

Electronics Butterfly Effect

By: Brian Bailey

The electronics industry is about to go through the biggest change it has seen since th...
Who’s Calling The Shots

By: Ann Steffora Mutschler

Second of two parts: Software remains a growing challenge.
Inside The 5G Smartphone

By: Mark LaPedus

Video and overall demand for higher bandwidth and throughput are creating new opportuni...

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Top Stories

Making Hardware Design More Agile

Experts at the table, part 3: Can the same techniques used in software apply at the sys...

Rethinking Differentiation

What makes one semiconductor design stand out from another?

Software Driving More Hardware De...

Functions and new OSes become the starting point for SoCs, but hardware still matters.

Embedded Vision Becoming Ubiquitous

Neural networks have propelled embedded vision to the point where they can be incorpora...

The Trouble With Abstractions

With all of the data needed for system tradeoffs coming from downstream, how well is de...

What Happened To ESL

Has the ESL methodology lived up to its promises?

Five Questions: Jeff Bier

Embedded Vision Alliance's founder and president of BDTI talks about the creation of th...

Advanced IC Packaging Biz Heats Up

Stacked die and fan-outs gain steam as shrinking features becomes more difficult. Where...

Interconnect Challenges Grow

RC delay issues grow in the back-end-of-the-line over the next couple of process nodes;...

Electronic Gas Concerns On The Rise

Contamination, shortages become bigger worries at advanced nodes.

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Latest News

The Week In Review: Manufacturing

E-beam inspection; fab tool downturn; drone mania at Intel and...

The Week In Review: Design/IoT

Tessera acquires Ziptronix; SoC market: $200 billion by 2019?;...

Blog Review: Aug. 26

Updates from IDF on 3D XPoint; design size and respins; preven...

more news »

Startup Corner

Nymi: Wearable Authentication

Startup uses heartbeat biometric sensors to improve security, ...

more startups »


System Bits: Sept.1

Seeing quantum movement; cloud-focused datacenters; 2D materials.

Manufacturing Bits: Sept. 1

Free-electron laser EUV consortium; 3D-printed fish; LEGO AFMs.

Power/Performance Bits: Sept. 1

Growing graphene nanoribbons; solid-state electrolytes in batt...

more research »

Knowledge Centers / Entities, people and technologies explored


Intel Acquires Docea Power

Intel has acquired another EDA company, although both companie...

Tsinghua Makes $23B Bid For Micron

In what would be the largest takeover of a U.S. company by a C...

Avago Buys Broadcom; NXP Spins Of...

M&A activity heats up across semiconductor industry.

Analysis: Applied-TEL Scrap Merger

Applied Materials and TEL have agreed to terminate their merge...

more M&A/Business »