Special Reports

Fan-Out Packaging Gains Steam

By: Mark LaPedus

Systems companies migrate from board to ultra-thin package for next-gen smartphones.
The Secret World Of Ciphers

By: Ernest Worthman

What's changing in this clandestine sector, and what does it really take to be an exper...
More Choices, Less Certainty

By: Ed Sperling

Increasingly costly scaling is forcing the entire semiconductor industry to weigh optio...

 more »

Top Stories

Memory Choices Grow

Memory is emerging as the starting point for SoCs, adding more confusion to already com...

Handoff Points Getting Blurry

The way information is shared throughout the design and test flow is changing.

Hardware Models For Software

Where the challenges are in early software development.

Defining Sufficient Coverage

Experts at the table, part 1: The definitions of coverage are changing and the industry...

Can Nano-Patterning Save Moore’...

Selective deposition is showing promise in the lab, but it's a long way from there to p...

Why Packaging Matters

As semiconductor designs become more complex and unique, so do the packages around thos...

Measuring FinFETs Will Get Harder

No one tool does everything, and the best tools for the job are slow.

Inside Multi-Beam E-Beam Lithography

One-on-one: David Lam sounds off on next-generation lithography and how to solve some v...

Do Circuits Whisper Or Shout?

What needs to be considered in optimizing SoCs for power and performance.

Placing Bets On Future Technology

One-On-One: Leti's CEO talks about what's next for different markets and why.

more top stories »

Latest News

The Week In Review: Manufacturing

Xiaomi’s woes; Samsung’s TSV memory; EDA for 10nm; merger ...

The Week In Review: Design/IoT

NXP-Freescale merger final approval; Synopsys Ethernet VIP; Me...

Blog Review: Nov. 25

Digging into deep learning; musings on Industry 4.0; Ethernet ...

more news »

Startup Corner

UltraSoC: Debug IP

U.K. startup aims to simplify development, performance monitor...

more startups »


Manufacturing Bits: Nov. 25

Asteroid mining and metrology; looking at single molecules; Ch...

Power/Performance Bits: Nov. 25

Insect robots on the water; advances in aqueous lithium-ion ba...

System Bits: Nov. 25

Quantum computer coding in silicon; supercomputing feats; revo...

more research »

Knowledge Centers / Entities, people and technologies explored


Lam To Acquire KLA-Tencor

Deal would give Lam strong position in mask and wafer inspection.

ARM Buys Carbon

Deal allows ARM to create virtual prototypes for performance a...

Mentor Buys Remainder Of Calypto

Why the HLS division was spun out, and why it is now being rec...

Intel Acquires Docea Power

Intel has acquired another EDA company, although both companie...

more M&A/Business »