Blog Review: May 1
Testing HBM; high density interconnect; SLM in aerospace and government.
Chip Industry Week In Review
U.S. workforce hubs; Samsung's V-NAND chip; TSMC's A16 process and SoW; NVIDIA's AI acquisitions; IBM to acquire HashiCorp; China/Japan AI EV partnerships; MIT's ...
Chip Industry Technical Paper Roundup: April 30
Single-molecule transistor using quantum interference; power +...
Research Bits: April 30
Sound waves in optical neural networks; 3D spectral processor;...
Research Bits: April 23
Probabilistic computer prototype; photonic AI chiplet; observi...
Startup Funding: March 2024
Investors connect with interconnects; $1.1 billion for 39 comp...
Startup Funding: February 2024
Power electronics, data center interconnects among 49 startups...