Chip Industry Week In Review
Samsung, Synopsys' GAA processors; UMC's 3D IC process; Si wafer shipments down; SiC wafer processing equipment up; women in CHIPS Act projects; imec startup fund...
Blog Review: May 1
Testing HBM; high density interconnect; SLM in aerospace and government.
Research Bits: May 7
High-temperature memory; probabilistic bits; switchable MOF.
Chip Industry Technical Paper Roundup: May 7
Heterogeneous multi-processor SoCs; parallel RTL simulation; ...
Chip Industry Technical Paper Roundup: April 30
Single-molecule transistor using quantum interference; power +...
Startup Funding: March 2024
Investors connect with interconnects; $1.1 billion for 39 comp...
Startup Funding: February 2024
Power electronics, data center interconnects among 49 startups...