Special Reports

EDA Looks Beyond Chips

By: Ed Sperling

System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.
Architecting Chips For High-Performance Computing

By: Ann Mutschler

Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always straightforward.
Digital Twins Target IC Tool And Fab Efficiency

By: Laura Peters

Virtual representations will improve performance and productivity across the entire design through manufacturing flow, but deployments will vary in effectiveness...

 more »

Top Stories

Communication Is Key To Finding And Fixing Bugs In ICs

 AI will be increasingly needed to make sense of huge amounts of data, allowing teams to...
May 8th, 2024 By Ann Mutschler and Adam Kovac

Can Models Created With AI Be Trusted?

 Evaluating the true cost and benefit of AI can be difficult, especially within the semi...
May 6th, 2024 By Brian Bailey

Fundamental Issues In Computer Vision Still Unresolved

 Industry and academia are addressing next steps.
May 2nd, 2024 By Karen Heyman

Design Considerations In Photonics

 As photonics and CMOS converge, will design engineers feel comfortable outside of their...
May 1st, 2024 By Karen Heyman

Multi-Die Design Pushes Complexity To The Max

 Continued scaling using advanced packaging will require changes across the entire semic...
April 29th, 2024 By Ann Mutschler

Dealing With AI/ML Uncertainty

 How neural network-based AI systems perform under the hood is currently unknown, but th...
April 25th, 2024 By Karen Heyman

Is There Any Hope For Asynchronous Design?

 This approach has long held promise, but never managed to deliver. Is there a fundament...
April 25th, 2024 By Brian Bailey

Navigating The GPU Revolution

 Potential cost and time benefits are driving GPU adoption, despite challenges.
April 24th, 2024 By Gregory Haley

Predicting And Preventing Process Drift

 AI/ML are increasingly vital for good yield and reliability, but there are still plenty...
April 22nd, 2024 By Gregory Haley

Electromigration Concerns Grow In Advanced Packages

 Higher density, heat, and more materials make it harder to ensure reliability.
April 18th, 2024 By Laura Peters

What Works Best For Chiplets

 Not all chiplets are interchangeable, and options will be limited.
April 18th, 2024 By Anne Meixner

Enabling Advanced Devices With Atomic Layer Processes

 Tradeoff between precision and speed becomes more critical at advanced nodes.
April 18th, 2024 By Katherine Derbyshire

more top stories »

Latest News

Blog Review: May 8

 UCIe for latency, power; Octal SPI for serial NAND flash; PCB assembly and library creation; SDV security implications.
May 8th, 2024 By Jesse Allen

Chip Industry Week In Review

 Samsung, Synopsys' GAA processors; UMC's 3D IC process; Si wafer shipments down; SiC wafer processing equipment up; women in CHIPS Act projects; imec startup fund...
May 3rd, 2024 By The SE Staff

more news »



Research

Research Bits: May 7

 High-temperature memory; probabilistic bits; switchable MOF.
By Jesse Allen

Chip Industry Technical Paper Roundup: May 7

 Heterogeneous multi-processor SoCs; parallel RTL simulation; ...
By Liz Allan

Chip Industry Technical Paper Roundup: April 30

 Single-molecule transistor using quantum interference; power +...
By Linda Christensen

more research »



Startup Corner

Startup Funding: March 2024

 Investors connect with interconnects; $1.1 billion for 39 comp...
By Jesse Allen

Startup Funding: February 2024

 Power electronics, data center interconnects among 49 startups...
By Jesse Allen

more startups »

Videos

Adapting To Evolving IC Requirements

May 7th, 2024

Sensor Fusion Challenges In Automotive

May 2nd, 2024

Overlay Optimization In Advanced IC Substrates

April 29th, 2024

Secure Movement Of Data In Test

April 16th, 2024

Knowledge Centers / Entities, people and technologies explored

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