Managing The Huge Power Demands Of AI Everywhere
More efficient hardware, better planning, and better utilization of available power can help significantly.
New AI Data Types Emerge
Several PPA considerations mean no single type of data is ideal for all AI models.
Big Changes Ahead For Analog Design
In-house flows are unable to keep up with foundry PDKs and heterogeneous integration, but commercial EDA tools add their own set of challenges.
How Big A Deal Is Aging?
Aging must be understood, analyzed, and mastered. Until then, additional margins are the only way out.
Unbundling Analog From Digital Where It Makes Sense
The shift toward heterogeneous integration and advanced packaging have changed the dynamics of mixed-signal design — and created some new issues.
The Cost Of EDA Data Storage And Processing Efficiency
Sustainability in the EDA process is less about the environment and more about preserving resources to speed up run times.
Memory Fundamentals For Engineers
eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are u...
CXL Thriving As Memory Link
Adoption of Compute Express Link protocol spreads as way to connect memories.
Is PPA Relevant Today?
Power, performance, and area/cost have been the three optimization targets for decades, but are they pertinent for today's complex systems?
Higher Density, More Data Create New Bottlenecks In AI Chips
More options are available, but each comes with tradeoffs and adds to complexity.
Big Changes Ahead For Analog Design
In-house flows are unable to keep up with foundry PDKs and heterogeneous integration, but commercial EDA tools add their own set of challenges.
Unbundling Analog From Digital Where It Makes Sense
The shift toward heterogeneous integration and advanced packaging have changed the dynamics of mixed-signal design — and created some new issues.
Striking A Balance On Efficiency, Performance, And Cost
More efficient designs can save a lot of power, but in the past those savings have been co-opted for higher performance.
Where Power Savings Really Count
How chiplets and advanced packaging will affect power efficiency, and where design teams can have the biggest impact on energy consumption.
Managing kW Power Budgets
Strategies for dealing with increasing compute demands from AI and other applications.
Next-Gen High-Speed Communication In Data Centers
New approaches to moving more data faster and more efficiently.
Real-World Applications Of Computational Fluid Dynamics
How faster processing is revolutionizing different industries.
Making Electronics More Efficient
Challenges and future directions for disaggregating SoCs.
Challenges With Chiplets And Power Delivery
Benefits and challenges in heterogeneous integration.
New Issues In Power Semiconductors
Challenges increase with higher voltage and heterogeneous integration in advanced packages.
