Intelligent Innovation
Overlay, Critical Dimension, And Z-Height Metrology Solut...
Maintaining the yield and productivity of high-volume manufacturing packaging...
May 8, 2025
Bringing AI To Scale
AI For Test: The New Frontier
Enhancing the connection between data sources and faster, more reliable decis...
May 8, 2025
Silicon Lifecycle Management
Better ATPG To Minimize Chip Test Time And Cost
Any effort expended to reduce the number of test patterns or runtime on the t...
May 8, 2025
Test For The Autonomous Age
IoT Security By Design
A defense in depth solution is essential for creating safe and secure ICs for...
May 8, 2025
Advanced Interconnect Test
Coaxial Test Sockets Are In The Critical Path Of Advanced...
Overlooking the importance of test socket performance to a successful product...
May 8, 2025
Next-Generation Test
Chip Complexity Drives Innovation In Automated Test Equip...
Shift left and shift right strategies ensure that test coverage is balanced a...
May 8, 2025
The Human Machine Interface
Optimizing Tester Memory Resources With Pooling Technology
Extend capacity by dynamically redistributing unused vector memory across tes...
April 8, 2025
Surface Measurement And Analysis
Gas Analysis For A Greener Tomorrow
Simultaneous measurement of multiple gases to identify sources of air polluti...
December 10, 2024
Yield Intelligence
Using Predictive Data Analytics In Manufacturing
Understanding the meaning hidden within data is key to turning it to gold.
June 11, 2024
Chip Industry Week in Review
AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.
Three-Way Race To 3D-ICs
Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.
Chip Industry Week in Review
TSMC's technology roadmap; Intel cuts; reciprocal hacking; McKinsey on IC challenges, ML algorithm table; subsystem chiplets; cross-domain PLM; magnetic switches; sarin sensors.
AI Agents Need Goals
AI cannot optimize unless it can measure progress towards goals, but defining those goals is not easy, especially when looking at the entire development flow.
Chip Industry Week In Review
TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; NVIDIA, AMD export licenses; Cadence's acquisition; DRAM, NAND flash; rare earths dry up; new EV chips.
