A System Perspective
How AI And Connected Workflows Will Close The Verificatio...
The industry needs a fundamental shift in how verification is approached.
March 27, 2025
Intelligent System Design
High-Speed High-Capacity Mixed-Signal Simulation Of Silic...
Verifying the functionality of a full multi-chip system, including digital co...
March 27, 2025
The Next Wave
Unleashing AI Potential Through Advanced Chiplet Architec...
Chiplets are the only viable solution to maintain the annual cadence of hardw...
March 27, 2025
First By Design
Innovating For 6G
Emulation is crucial for testing the performance of 6G systems in real-time c...
March 27, 2025
NoC NoC
Achieving Lower Power, Better Performance, And Optimized ...
As design complexity increases, manual design approaches can struggle to mini...
March 27, 2025
Looking Past The Horizon
Bold Prediction: 50% Of New HPC Chip Designs Will Be Mult...
Advancements in low-latency interconnects, manufacturing processes, and desig...
February 27, 2025
Memory/IO Wall Solutions
AI Infrastructure At A Crossroads
Weighing efficiency gains vs. the scale of personalization.
January 30, 2025
The Chiplet Connection
Enabling Innovative Multi-Vendor Chiplet-Based Designs
What makes chiplets so attractive, and why they are essential for future desi...
September 26, 2024
Clock Talk
Droop And Silent Data Corruption
Advanced silicon lifecycle analytics and on-die telemetry are needed to count...
July 25, 2024
What Exactly Are Chiplets And Heterogeneous Integration?
New technologies drive new terminology, but the early days for those new approaches can be very confusing.
Chip Industry Week In Review
ASML-imec deal; Intel Foundry's future; European tech consortium; photonics-related acquisitions; global chip market up; new security IP and algorithms; neuromorphic AI chip; adaptive MCUs; auto superbrains.
Chip Industry Week In Review
Agentic AI chip design; $6.5B AI acquisition; IC energy consumption and emissions; US allies export controls; CPO switches; foundry and IC design house revenue reports; side-channel analysis library; 12-layer HBM4; 3D GAA utilizing 2D semis; EV charging in 5 minutes.
Chiplets Add New Power Issues
Well-understood challenges become much more complicated when SoCs are disaggregated.
3D-IC For The Masses
Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, but can it expand beyond that?
