Making Formal Normal
How To Optimize Silicon Utilization To Improve PPA
As designs grow more complex, detecting and eliminating underutilized compone...
April 29, 2025
NoC NoC
Data Movement Is the Energy Bottleneck of Today’s SoCs
A NoC provides a structured and scalable approach to transporting data betwee...
April 24, 2025
Looking Past The Horizon
AI-Driven Verification Regression Management
Automation of repetitive steps with proactive management to measure efficacy ...
April 24, 2025
A System Perspective
Reap Rewards With Shift-Left Pattern Matching For Custom ...
Reduce design iterations and improve product quality by moving critical check...
April 24, 2025
Intelligent System Design
NOP Flit Payload: A Dedicated Debug Channel
Capturing a granular view of link operation using specialized data packets de...
April 24, 2025
First By Design
What Is Electronic Design Automation And Why Do You Need It?
EDA software is revolutionizing high-speed digital design by accelerating tim...
April 24, 2025
The Next Wave
Unleashing AI Potential Through Advanced Chiplet Architec...
Chiplets are the only viable solution to maintain the annual cadence of hardw...
March 27, 2025
Memory/IO Wall Solutions
AI Infrastructure At A Crossroads
Weighing efficiency gains vs. the scale of personalization.
January 30, 2025
The Chiplet Connection
Enabling Innovative Multi-Vendor Chiplet-Based Designs
What makes chiplets so attractive, and why they are essential for future desi...
September 26, 2024
Clock Talk
Droop And Silent Data Corruption
Advanced silicon lifecycle analytics and on-die telemetry are needed to count...
July 25, 2024
Chip Industry Week in Review
AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.
Three-Way Race To 3D-ICs
Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.
Chip Industry Week in Review
TSMC's technology roadmap; Intel cuts; reciprocal hacking; McKinsey on IC challenges, ML algorithm table; subsystem chiplets; cross-domain PLM; magnetic switches; sarin sensors.
Tape-Out Failures Are The Tip Of The Iceberg
As the success rate for the semiconductor industry declines, it may be time to rethink our priorities.
Chip Industry Week In Review
TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; NVIDIA, AMD export licenses; Cadence's acquisition; DRAM, NAND flash; rare earths dry up; new EV chips.