Advanced Packaging Moving At Breakneck Pace
A chiplet supermarket is still years off, but progress is being made on all fronts.
Assembly Design Rules Slowly Emerge
Assembly design kits will greatly increase efficiency, but custom methods prevail for now.
Electrifying Everything: Power Moves Toward ICs
Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.
Upcoming Challenges And Changes In Semiconductor Materials
Brewer Science's new co-CEOs talk about shifts in materials for IC manufacturing, flexible substrates, and the uncertainties in advanced packaging.
Improving GaN Device Architectures
Novel combinations show promise for different applications.
What’s Next For Through-Silicon Vias
Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging.
Baby Steps Toward 3D DRAM
Stacking layers means a complete architecture rethink.
Navigating Increased Complexity In Advanced Packaging
Variability is a growing challenge; achieving higher yields requires even tighter control and precision.
Challenges In Powering Electrification With GaN And SiC
No single material is ideal, but unique combinations are emerging.
NAND Flash Targets 1,000 Layers
New techniques go beyond improved deposition and etching, but challenges stack up, too.
Advanced Packaging Moving At Breakneck Pace
A chiplet supermarket is still years off, but progress is being made on all fronts.
One Chip Vs. Many Chiplets
Challenges and options vary widely depending on markets, workloads, and economics.
Monolithic Vs. Heterogeneous Integration
New processes, materials, and combinations of existing technologies will determine future directions for semiconductors.
Opportunities Grow For GPU Acceleration
The convergence of AI/ML and GPU advancements are creating new opportunities for faster processing.
Navigating The GPU Revolution
Potential cost and time benefits are driving GPU adoption, despite challenges.
Emerging Technologies Driving Heterogeneous Integration
New architectures, opportunities, and challenges as chipmakers move from monolithic architectures to chiplets.
Secure Movement Of Data In Test
Why heterogeneous integration changes how data is used in manufacturing.
Challenges Of Testing Advanced Packages
Bundling more chips or chiplets increases the difficulty of thoroughly testing a device.
High-NA EUV Progress And Problems
Why it's necessary, when it's coming, and what still needs to be done.
Challenges Of Heterogeneous Integration
Cramming more features into a small space adds challenges and benefits.
