Baby Steps Toward 3D DRAM
Stacking layers means a complete architecture rethink.
Challenges In Powering Electrification With GaN And SiC
No single material is ideal, but unique combinations are emerging.
HBM Options Increase As AI Demand Soars
But manufacturing reliable 3D DRAM stacks with good yield is complex and costly.
FOPLP Gains Traction in Advanced Semiconductor Packaging
Panel-level packaging offers scalability and cost efficiency, but meeting advanced node process targets remains a formidable challenge.
New Tradeoffs In Leading-Edge Chip Design
Monolithic integration builds from the top down and the bottom up.
One Chip Vs. Many Chiplets
Challenges and options vary widely depending on markets, workloads, and economics.
Asia Government Funding Surges
Taiwan, China, South Korea, and Japan continue to foster growth, while the rest of Asia competes for foreign investment and talent.
Published on November 18th, 2024 by
Liz Allan
EMEA Investments Driving Technology Specialization
Semiconductor policies, funding, and competitions are enabling industry and academia to pursue breakthroughs amidst the quest for supply chain resi...
2D Semiconductors Make Progress, But So Does Silicon
Can 2D materials be fabricated consistently at a cost that competes with silicon?
Hybrid Bonding Makes Strides Toward Manufacturability
Companies are selecting preferred flows, but the process details are changing rapidly to meet the needs of different applications.
One Chip Vs. Many Chiplets
Challenges and options vary widely depending on markets, workloads, and economics.
Monolithic Vs. Heterogeneous Integration
New processes, materials, and combinations of existing technologies will determine future directions for semiconductors.
Opportunities Grow For GPU Acceleration
The convergence of AI/ML and GPU advancements are creating new opportunities for faster processing.
Navigating The GPU Revolution
Potential cost and time benefits are driving GPU adoption, despite challenges.
Making Heterogeneous Integration More Predictable
Engineering teams, methods, and modeling need to be rethought. One size doesn't fit all, and defects are inevitable.
Emerging Technologies Driving Heterogeneous Integration
New architectures, opportunities, and challenges as chipmakers move from monolithic architectures to chiplets.
Secure Movement Of Data In Test
Why heterogeneous integration changes how data is used in manufacturing.
Challenges Of Testing Advanced Packages
Bundling more chips or chiplets increases the difficulty of thoroughly testing a device.
High-NA EUV Progress And Problems
Why it's necessary, when it's coming, and what still needs to be done.
Challenges Of Heterogeneous Integration
Cramming more features into a small space adds challenges and benefits.
