Power Architect
TSMC Uncorks A16 With Super Power Rail
Reporter's Notebook: Aggressive roadmap ramps up competition at the leading e...
April 25, 2024
Spotlight On Reliability
Trusted Electronics: Current And Future Developments
Key techniques for demonstrating quality, safety, and security, from unique i...
April 11, 2024
Best Of Both: LP & HP
How To Get Accurate Inductance Extraction For Superconduc...
New physical verification approaches are needed to ensure the performance and...
April 11, 2024
A Bit About Memory
How AI 2.0 Will Shape The Memory Landscape
The need for more memory bandwidth and capacity spans from data center to end...
April 11, 2024
IP And LP In SoCs
Integrating Energy Efficiency Considerations Into Your De...
Optimizing the performance per watt of HPC SoCs starts when defining the arch...
April 11, 2024
Everything Low Power
LPDDR5X Opening New Markets For Low-Power DRAMs
From gaming consoles to network switches, higher data rates are enabling low-...
April 11, 2024
Power Source
Running On Star Power
Simulation helps manage the complexities of building and maintaining a fusion...
April 11, 2024
MIPI And Beyond
MIPI In Next Generation Of AI IoT Devices At The Edge
IoT demands a balance between cloud and edge processing to optimize system pe...
April 11, 2024
Embedded ML Design
Hybrid Architecture Blends Best Of Both Worlds
A true chimera with both CPU and systolic array DNA.
April 11, 2024
Design Reuse Made Real
Quantum Computing: Top 5 Questions Answered
Quantum error detection, suppression, and correction strategies are critical ...
March 14, 2024
Chip Industry Week In Review
Applied Materials' $4B facility at risk; AI chip bonanza; Japan, U.S. alliance; Rapidus' U.S. subsidiary; EDA revenue up; TSMC $6.6B funding; Infineon, Amkor team up; S. Korea's big bet; Apple's processor overhaul; high-NA EUVL defect system; chiplet HW security module; new Spectre attack.
What Works Best For Chiplets
Not all chiplets are interchangeable, and options will be limited.
Architecting Chips For High-Performance Computing
Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always straightforward.
Chip Industry Week In Review
IC sales up; Taiwan's quake; Japan's big bets; Intel Foundry loss; edgeAI startup funding; smartphone market's recovery; robots; data center security; NoCs in 3D.
EDA Looks Beyond Chips
System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.