Author's Latest Posts

Achieving Physical Reliability Of Electronics With Digital Design

By John Parry and G.A. (Wendy) Luiten With today’s powerful computational resources, digital design is increasingly used earlier in the design cycle to predict zero-hour nominal performance and to assess reliability. The methodology presented in this article uses a combination of simulation and testing to assess design performance, providing more reliability and increased productivity. ... » read more

Huawei Delivers Outstandingly Accurate Models

By John Parry, Mentor, a Siemens Business, and Yake Fang, Huawei Technologies Co., Ltd. Packaging high-performance multi-core IC devices used in communication applications is a key challenge for both manufacturers and system integrators. Traditionally a System-in-Package (SiP) has been taken, with chips mounted side-by-side, allowing differing semiconductor technologies to be mixed. More r... » read more

A Better Way To Measure Heat

Are you an engineering manager with budget responsibility, concerned about the thermal performance of your company’s designs or manufactured products? Or, are you a senior engineer who is responsible for the thermal design or characterization of components and systems? In either situation, the results of using the transient thermal testing method would be of benefit to you. The method is non-... » read more