Author's Latest Posts


Pitching To Your Audience


One of the most time-consuming parts of being a journalist is listening to enough people to get all sides of a story. Writing the story is often the easy part. What makes listening more difficult is that there are detail people and concept people, but few that sit in the middle. Some people love to get down into the details about the latest feature they have just implemented in a tool, or wh... » read more

Architectural Considerations For AI


Custom chips, labeled as artificial intelligence (AI) or machine learning (ML), are appearing on a weekly basis, each claiming to be 10X faster than existing devices or consume 1/10 the power. Whether that is enough to dethrone existing architectures, such as GPUs and FPGAs, or whether they will survive alongside those architectures isn't clear yet. The problem, or the opportunity, is that t... » read more

Targeting Redundancy In ICs


Technology developed for one purpose is often applicable to other areas, but organizational silos can get in the way of capitalizing on it until there is a clear cost advantage. Consider memory. All memories are fabricated with spare rows and columns that are swapped in when a device fails manufacturing test. "This is a common method to increase the yield of a device, based on how much memor... » read more

Thermal Floorplanning For Chips


Heat management is becoming crucial to an increasing number of chips, and it's one of a growing number of interconnected factors that must be considered throughout the entire development flow. At the same time, design requirements are exacerbating thermal problems. Those designs either have to increase margins or become more intelligent about the way heat is generated, distributed, and dissi... » read more

Continuing Challenges For Open-Source Verification


Experts at the Table: This is the last part of the series of articles derived from the DVCon panel that discussed Verification in the Era of Open Source. It takes the discussion beyond what happened in the panel and utilizes some of the questions that were posed, but never presented to the panelists due to lack of time. Contributing to the discussion are Ashish Darbari, CEO of Axiomise; Serge L... » read more

A Price To Be Paid


Ancient wisdom says you should be careful what you ask for, because you just might get it. This was certainly true many times during my career within EDA, and I am sure it is still happening today. Sometimes the outcome was not what was wanted, or the price was higher than expected. As an example, consider VHDL, the language that was meant to correct the problems of Verilog. One of the probl... » read more

Do We Have An IC Model Crisis?


Models are critical for IC design. Without them, it's impossible to perform analysis, which in turn limits optimizations. Those optimizations are especially important as semiconductors become more heterogenous, more customized, and as they are integrated into larger systems, creating a need for higher-accuracy models that require massive compute power to develop. But those factors, and other... » read more

Scaling Simulation


Without functional simulation the semiconductor industry would not be where it is today, but some people in the industry contend it hasn't received the attention and research it deserves, causing a stagnation in performance. Others disagree, noting that design sizes have increased by orders of magnitude while design times have shrunk, pointing to simulation remaining a suitable tool for the job... » read more

Power Optimization: What’s Next?


Concerns about the power consumed by semiconductors has been on the rise for the past couple of decades, but what can we expect to see coming in terms of analysis and automation from EDA companies, and is the industry ready to make the investment? Ever since Dennard scaling stopped providing automatic power gains by going to a smaller geometry, circa 2006, semiconductors have been increasing... » read more

HBM Takes On A Much Bigger Role


High-bandwidth memory is getting faster and showing up in more designs, but this stacked DRAM technology may play a much bigger role as a gateway for both chiplet-based SoCs and true 3D designs. HBM increasingly is being viewed as a way of pushing heterogenous distributed processing to a completely different level. Once viewed as an expensive technology that only could be utilized in the hig... » read more

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