Curtis Zwenger

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Curtis Zwenger is vice president of Advanced SiP Product Development at Amkor Technology. Zwenger joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via and Wafer Level packaging technologies. He is currently responsible for Advanced System in Package, MEMS/Sensor and Memory product development. Zwenger is Past General Chair for the IMAPS Symposium on Microelectronics 2019 and serves on the IMAPS Executive Council as Director of Membership. He has authored numerous technical articles and papers and co-authored a chapter in the recently released book, “Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies.” Zwenger has been issued 30 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.

Author's Latest Posts

Revolutionizing IC Packaging With High-Density RDL Technology
By Curtis Zwenger - 24 Oct, 2024 - Comments: 0

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been further accelerated by the COVID-19 pandemic, pushing the boundaries of silicon technology to its limits. Enter Amkor’s S-SWIFT, a packaging solution designed to address these challenges and revolution... » read more

Empowering RF Front End Cellular Innovations With DSMBGA
By Curtis Zwenger - 19 Aug, 2021 - Comments: 0

With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other 5G-enabled devices. Double-sided, molded ball grid array (DSMBGA) is a prime example of such solutions. “With our DSMBGA platform, we’ve established a preferred advanced packaging solution for this domain,”... » read more

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