Gary Dagastine

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Gary Dagastine is a writer and marketing communications consultant. He is the Director of Media Relations for the IEEE International Electron Devices Meeting (IEDM). He also is an editor at Nanochip Fab Solutions magazine and has written for publications such as Electronic Engineering Times and IBM’s Think Research magazine. He started in the industry at General Electric, where he provided communications support to GE’s power, analog and custom IC businesses. Dagastine is a graduate of Union College in Schenectady, NY.

Author's Latest Posts

Finding New Dimensions Of Innovation
By Gary Dagastine - 15 Nov, 2018 - Comments: 0

Whenever a company announces a major strategy shift and restructuring, such as pivoting away from 7nm FinFET technology development, it’s understandable that confusion, uncertainty and misunderstandings may arise. The best way to allay these concerns is to take an objective look at the situation: Demand for chips for the automotive, IoT, mobility and data center/wireless infrastructure mar... » read more

Moving To ASICs For ADAS
By Gary Dagastine - 19 Jul, 2018 - Comments: 0

By some estimates, there are now more than 260 startups and established companies around the world scrambling to develop, qualify and bring to market chips and technologies for new ADAS (advanced driver-assistance systems) and autonomous driving applications. Accordingly, venture capitalists, technology companies, carmakers, Tier 1 automotive suppliers and others are sharply ratcheting up ... » read more

How 5G Differs From Previous Network Technologies
By Gary Dagastine - 17 May, 2018 - Comments: 0

The Mobile World Congress in Barcelona, Spain is the wireless industry’s leading annual event, and this year’s edition in late February was buzzing with talk of 5G wireless technology and its evolving uses and technology requirements. First, Gregg Bartlett and Dr. Bami Bastani, Sr. Vice Presidents of GlobalFoundries' CMOS and RF business units, respectively, outlined 5G-related semico... » read more

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