Jeff Dorsch

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Jeff Dorsch is a former contributing editor at Semiconductor Engineering.

Author's Latest Posts

A Tale of Two Testers
By Jeff Dorsch - 07 Aug, 2017 - Comments: 0

David Tacelli, president and CEO of Xcerra, was excited. His company’s reception for customers (and the press) at the Trou Normand restaurant in San Francisco’s hip South of Market neighborhood was going very well. Gourmet salames and other tasty foods were on offer, along with fine wines and craft ales and beers. He gleefully pointed out to editors that the product to be introduced at t... » read more

Module Testing Adds New Challenges
By Jeff Dorsch - 07 Aug, 2017 - Comments: 1

System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is something more than a chip package and a great deal smaller than most printed circuit boards. Testing these modules often requires system-level test. These modules typically will be inserted int... » read more

The Week In Review: IoT
By Jeff Dorsch - 04 Aug, 2017 - Comments: 0

Legislation Four senators plan to introduce a bipartisan bill that would require federal government vendors to provide Internet-connected devices and equipment that is patchable and conforms to industry cybersecurity standards. Such products must not have unchangeable passwords or known security vulnerabilities. The bill was drafted with expert advice from the Atlantic Council and Harvard Univ... » read more

Flexible Devices Drive New IoT Apps
By Jeff Dorsch - 03 Aug, 2017 - Comments: 1

Printed and flexible electronics are becoming almost synonymous with many emerging applications in the IoT, and as the technologies progress so do the markets that rely on those technologies. Flexible [getkc id="187" kc_name="sensors"] factor into a number of [getkc id="76" kc_name="IoT"] use cases such as agriculture, health care, and structural health monitoring. Other types of flexible de... » read more

The Week In Review: IoT
By Jeff Dorsch - 28 Jul, 2017 - Comments: 0

Finance August Home received $25 million in Series C funding, bringing its total funding to $75 million. Existing investors Bessemer Venture Partners, Comcast Ventures, Maveron, and Qualcomm Ventures were joined by AGL, Liberty Mutual, and SPDG. The Internet of Things startup will use the money to expand operations and to extend its offerings in home access products and services. Prospera, ... » read more

The Week In Review: IoT
By Jeff Dorsch - 21 Jul, 2017 - Comments: 0

Finance Particle, the provider of a full-stack Internet of Things device platform for enterprises, has raised $20 million in Series B funding, bringing its total venture funding to $30 million. Spark Capital led the new round, with participation by Qualcomm Ventures and existing investors in the IoT startup. Machina Research estimates cellular IoT connections will increase from 334 million in ... » read more

The Week In Review: IoT
By Jeff Dorsch - 14 Jul, 2017 - Comments: 0

Tools SAP brought out an Internet of Things tool called the Leonardo IoT Bridge, meant to connect sensor data from the field with business data systems inside enterprises. Leonardo IoT Bridge makes use of the SAP Leonardo cloud-based service. The German software company said it would partner with the Bosch Group to provide an IoT Bridge dashboard for delivery companies, keeping tabs on deliver... » read more

5G Test Equipment Race Begins
By Jeff Dorsch - 12 Jul, 2017 - Comments: 0

Test and measurement vendors stand ready to help with the development and deployment of 5G wireless communications, as the technology is fine-tuned and tested in trials around the world. Juniper Research forecasts 5G operator-billed service revenues will rise to $269 billion by 2025, compared with $851 million in 2019, for a compound annual growth rate of 161% during the first seven years of... » read more

Advanced Packaging Picks Up Steam
By Jeff Dorsch - 10 Jul, 2017 - Comments: 0

The semiconductor industry’s push toward continued miniaturization and increasing complexity is driving wider adoption of system-in-package (SiP) technology. One of the big benefits of [getkc id="199" kc_name="SiP"] is that it allows more features to be squeezed into ever-smaller form factors, such as wearable gadgets and medical implants. So while the individual chips in this package may ... » read more

Test at “West”
By Jeff Dorsch - 10 Jul, 2017 - Comments: 0

As you wander through the North Hall of Moscone Center this week, you may notice that some of the big names in automated test equipment are not on the SEMICON West show floor this year. Advantest America has a booth, but the same cannot be said of Teradyne or Xcerra. Some of the bigger names in test and measurement instruments won’t be found exhibiting at SEMICON West, either – such as Keys... » read more

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