Author's Latest Posts


Improve Volume Scan Diagnosis Throughput 10X With Dynamic Partitioning


Performing volume scan diagnosis on today’s large, advanced node designs puts demands on turn-around-time and compute resources. This paper describes a new technique to maximize diagnosis throughput while performing ever more demanding scan diagnosis. The dynamic partitioning technology in Tessent Diagnosis enables in a 50% reduction in scan diagnosis time using only 20% of the typical memory... » read more

Creating A Unified Platform For Automotive Embedded Application Development


Automotive embedded software complexity is ballooning as software applications play a critical role in delivering the features and functionality demanded in modern vehicles. Current software development methodologies are incapable of managing the numerous and intricate cyber-physical interfaces in the cars of today. To compete, companies must evolve their software development processes to estab... » read more

Improving Verification Predictability And Efficiency Using Big Data


By providing a Big Data infrastructure, with state of the art technologies, within the verification environment, the combination of all verification metrics allows all resources to be used as efficiently as possible and enables process improvements using predictive analysis. This paper covers the technology, the metrics, and the process, and it will explore a number of techniques enabled by suc... » read more

Reusable UPF: Transitioning From RTL To Gate Level Verification


This paper highlights the differences between an RTL UPF and a Gate Level Simulation UPF, and presents a new methodology to write RTL UPF in such a way that minimal changes are required during gate-level power verification. To read more, click here. » read more

ON Semiconductor Reduces Memory BiST Insertion Time By 6X With Tessent Hierarchical Flow


This paper describes a case study on the insertion of memory BiST for an ON Semiconductor multi-million gate-level netlist with 300 memory instances. The physical implementation will be done using a flat layout. Two different methodologies can be applied when it comes to physical implementation; hierarchical or fullflat. When performing physical implementation as full-flat flow, typically the D... » read more

High-Level Synthesis For Autonomous Drive


The sensors in autonomous vehicles continuously generate a high volume of data in real time about the environment surrounding the car. The vehicles need new hardware architectures to be able to process this data quickly and make decisions that enable self driving. Catapult, the industry’s leading High-Level Synthesis (HLS) platform, provides a new paradigm of designing silicon at a higher lev... » read more

Konica Minolta Proves C++ Level Signoff Possibilities Using Catapult HLS Platform


A team’s ultimate goal is to move verification up to the C++ level in order to minimize the time spent in RTL verification and to achieve C++ signoff. A team at Konica Minolta® has been using the Catapult HLS Platform for many years to dramatically improve their productivity by coding at the C++ level and using the platform to generate RTL. They recently evaluated the high-level verification... » read more

Effective Elements List And Transitive Natures Of UPF Commands


Although UPF is very well defined through IEEE 1801 LRM, it is often difficult to comprehend many primitive and inherent features of individual UPF commands-options or relations between different varieties of UPF commands-options. In this paper, we provide a simplistic approach to find inherent links between UPF commands-options through their transitive nature. We also explain how these inheren... » read more

Meeting ISO 26262 Requirements Using Tessent IC Test Solutions


As the industry moves towards greater automation in vehicles, suppliers of the ICs used to drive the automotive electronic systems are rapidly adopting solutions to meet ISO 26262 requirements. The Tessent family of IC test products offers the highest defect coverage, in-system non-destructive memory test, hybrid ATPG/Logic BIST, and analog test coverage measurement. These technologies add up t... » read more

Automotive Trends Create New Challenges For Wiring Harness Development


The rapid introduction of new technologies and the influx of automotive start-ups into the market has led to a multitude of challenges for harness development. OEMs and startups alike must consider the number and sophistication of technology features they integrate into their vehicles as they have a direct effect on harness weight, bundle diameter, and cost. Electrification, autonomous drive an... » read more

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