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A Complete Guide To Enclosure Thermal Design… 14 Key Considerations


Enclosure design is an important aspect of system level thermal management to ensure electronics performance and reliability. Learn how to improve enclosure design in this guide covering 14 considerations on thermal management best practice. Examples of areas to focus on for advantages in cooling efficiency are illustrated and where tradeoff decisions are needed. Newly updated as of 2018, this... » read more

Artifacts Of Custom Checkers In Questa Power-Aware Dynamic Simulation


UPF provides a powerful mechanism to define a custom PA checker or assertion and provides a layer to completely separate it from design code. This is done by embedding the binding of the design and checker within the UPF file through the bind_checker command and its options. As a result, it provides a consolidated verification mechanism and allows Questa PA-SIM to access all instances of a targ... » read more

Test Innovations For ISO 26262


We are witnessing the gradual transition of the automobile from a simple means of transportation to a mobile electronic hub. The amount of electronic content in passenger cars continues to grow rapidly. Recent reports indicate that electronics now contribute about 40% of the total costs of a traditional internal-combustion-engine car, and this jumps as high as 75% for the growing number of elec... » read more

Sensors Are Fundamental To New Intelligent Systems


The evolution of intelligent electronic sensors is creating a revolution for IoT and Industrial IoT as companies bring new sensor-based, intelligent systems to market. These systems now incorporate processors and software and they include communication hardware in order to move data into the Cloud for analysis. While the sensor market continues to garner billions of dollars, the average selling... » read more

Heatsinks Here, There, Everywhere!


Heatsinks are often perceived to be the magic answer to all electronics cooling challenges. A heatsink makes heat spread out, so that it passes to the air over a much larger surface area than it would otherwise. Air then carries the heat away, cooling the electronics that generated it. So, why not place a heatsink on top of any thermally critical component? To read more, click here. » read more

Improving In-System Test With Tessent VersaPoint Test Point Technology


This paper describes a new versatile test point technology called VersaPoint, which has been developed specifically to work with designs implementing mixed EDT/LBIST methodologies to reduce EDT pattern counts and improve Logic BIST (LBIST) test coverage. VersaPoint test points can reduce compressed pattern counts 2X to 4X beyond compression alone and improve LBIST test coverage beyond what is p... » read more

Measuring ISO 26262 Metrics Of Analog Circuitry In ICs


The goals for automotive electronics are zero defective parts per million (0 DPPM), and safe operation during the expected lifetime of the vehicle. The ISO 26262 standard provides procedures and metrics required before delivery to ensure systems can be expected to operate without unreasonable risk. ISO 26262 specifies circuit metrics and minimum values that are design requirements. Since the... » read more

Creating Software Separation For Mixed Criticality Systems


The continued evolution of powerful embedded processors is enabling more functionality to be consolidated into single heterogeneous multicore devices. Mixed criticality designs, those designs which contain both safety-critical and non-safety critical processes, can successfully leverage these devices and meet the regulatory requirements for IEC safety standards and the highest level of ISO. Thi... » read more

Co-modeling: A Powerful Capability For Hardware Emulation


Understanding co-modeling technology, its impact on verification and validation should be a critical aim for anyone selecting and deploying emulation co-modeling resources. This paper explores how emulation co-modeling — specifically for the Veloce Strato emulation platform from Mentor, a Siemens business — is architected to meet the needs of advanced verification and validation. To rea... » read more

Preventing IoT Edge Device Vulnerabilities


As an EDA toolchain provider, Mentor keeps a close eye on security issues that occur in the world of electronics. We see volumes of research centered on protecting complex SoCs from attacks and interesting studies about detecting malicious logic in these ICs. But, security issues around IoT edge devices are rarely mentioned in the literature. However, the projected billions of IoT edge devices ... » read more

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