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Here At Last! Automated Verification Of Heterogeneous 2D/3D Package Connectivity


By Michael Walsh and Jin Hou with Todd Burkholder The heterogeneous integration of multiple ICs in a single package along with high-performance, high-bandwidth memory is critical for many high-performance computing applications. After everything has been heterogeneously integrated and packaged, such designs feature complex connectivity with many hundreds of thousands of connections, making i... » read more