AI Infrastructure At A Crossroads

By Ramin Farjadrad - 30 Jan, 2025 - Comments: 0

By Ramin Farjadrad and Syrus Ziai There is a big push to achieve greater scale, performance and sustainability to fuel the AI revolution. More speed, more memory bandwidth, less power — these are the holy grails. Naturally, the one-two punch of StarGate and DeepSeek last week has raised many questions in our ecosystem and with our various stakeholders. Can DeepSeek be real? And if so, w... » read more

UMI: Extending Chiplet Interconnect Standards To Deal With The Memory Wall

By Ramin Farjadrad - 14 Oct, 2024 - Comments: 0

With the Open Compute Project (OCP) Summit upon us, it’s an appropriate time to talk about chiplet interconnect (in fact the 2024 OCP Summit has a whole day dedicated to the multi-die topic, on October 17). Of particular interest is the Bunch of Wires (BoW) interconnect specification that continues to evolve. At OCP there will be an update and working group looking at version 2.1 of BoW. (... » read more

Simultaneous Bi-Directional Signaling: A Breakthrough Alternative For Multi-Die Assemblies

By Ramin Farjadrad - 29 Aug, 2024 - Comments: 0

In designing multi-die systems-in-package, with or without chiplets, it is easy to think of the interconnect between dies as simply analogous to the interconnect between functional blocks on a single die. But this analogy can lead architects and designers into a blind alley from which it becomes impossible to meet system performance and power requirements. The reason lies in fundamental differe... » read more