Bump Height Uniformity And 3D Sensing

By Subodh Kulkarni - 08 Nov, 2022 - Comments: 0

Achieving 3D sensing for semiconductor bump height uniformity is essential before adding photoresist. But there are challenges in using traditional methods for measuring uniformity after copper plating, which requires a combination of 3D fringe projection technology and NanoResolution inspection and metrology. Here’s what we’ve learned in a bump height uniformity case study: » read more

Measuring Reflective Surfaces

By Subodh Kulkarni - 15 Jun, 2020 - Comments: 0

Manufacturers are adopting automated optical inspection (AOI) systems based on phase shift profilometry (PSP) for applications in advanced packaging processes. Many of these processes use front end-like techniques to create connections among die within a package and from the packaged die to the outside world. The technique offers fast, precise measurements of the 10µm to 100µm features that a... » read more

The Need for Speed

By Subodh Kulkarni - 01 Jun, 2020 - Comments: 0

We’ve previously identified the convergence occurring between surface mount technologies (SMT), used to connect packaged semiconductor devices on printed circuit boards, and advanced packaging (AP) technologies, in which connections between the semiconductor devices and to the outside world are incorporated in the packaging process using front-end-like, wafer-or panel-based manufacturing proc... » read more

The Convergence Of Advanced Packaging And SMT

By Subodh Kulkarni - 07 Apr, 2020 - Comments: 0

One statement is almost always true in the electronics industry: smaller is better. The relentless demand for electronic systems that pack more computing power and functionality into less space has driven the development of new processes and designs since the invention of the integrated circuit. In recent years that drive has taken a new direction, literally, as manufacturers have discovered th... » read more