By Tom Morrow
“The challenge with all these technologies is that we cannot decouple them from the economics,” said Rick Wallace, president and CEO of KLA-Tencor during the annual Executive Summit at SEMICON West. While aligning the economics of new production technologies such as EUV, III-V materials, FinFETS, and 450 mm wafers have yet to be fully worked out, the insatiable appetite for...
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