Andy Heinig

(all posts)
Andy Heinig is group leader for advanced systems integration and department head for efficient electronics at Fraunhofer Institute of Integrated Circuits, Division of Engineering and Adaptive Systems.

Author's Latest Posts

Interaction Of Hard IP And Chip-Package

By Andy Heinig - 08 Nov, 2018 - Comments: 0

Current and future customer-specific circuit development requires an increasing number of different interfaces, such as for memory (DDR3, DDR4, LPDDR3, LPDDR4, etc.), radio interfaces (Bluetooth, NBIoT, etc.) or high-speed LVDS/SERDES interfaces (DisplayPort, Ethernet, USB, etc.). For customer-specific circuit projects, these components are frequently purchased as hard IP because the developmen... » read more

Why Use An Assembly Design Kit And Assembly Design Flow?

By Andy Heinig - 08 Feb, 2018 - Comments: 0

A number of years ago, the packages of electronic systems were only intended to protect the circuit from mechanical stresses and to realize a simple fan-out from the close spacing of connections on the circuit to the larger spacing on the packaging. At the time, there were also only a few different packaging types, all of simple design. Over the years, however, the requirements on packages have... » read more

Newer posts →