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3D IC Supply Chain: Still Under Construction

By Barbara Jorgensen and Ed Sperling Stacked die, which promise high levels of integration, a tiny footprint, energy conservation and blinding speed, still have some big hurdles to overcome. Cost, packaging and manufacturability continue to make steady progress, with test chips being produced by all of the major foundries. But in a disaggregated ecosystem, the supply chain remains a big st... » read more