Ben Gu

  (all posts)
Ben Gu is vice president of R&D at Cadence, and head of the Multi-Physics System Analysis Business Unit. He oversees R&D, product engineering, product validation of all the system level products in Cadence, including the recently acquired NUMECA CFD products, the recently launched Clarity 3D Solver, Celsius Thermal Solver, as well as Sigrity, Voltus and ESD products. Additionally, he is responsible for the strategy and M&A those products. Prior to taking this role, Gu held various R&D leadership positions in Cadence since 2012. He received a Bachelor of Science degree in electrical engineering from Shanghai Jiaotong University and an M.S. degree in electrical engineering from Penn State University.

Author's Latest Posts

Software-Defined Vehicles: The Automotive Revolution With Silicon At Its Heart
By Ben Gu - 05 Jan, 2023 - Comments: 0

The automotive sector is undergoing immense change. The retirement of the internal combustion engine (ICE) in favor of electrified powertrains and a shift towards autonomy has provided carmakers the opportunity to reimagine and redefine the entire automotive experience: how a car looks, works, and behaves, from the tires up. But such change isn’t easy. An industry founded on the manufactur... » read more

Smart Manufacturing: What’s Needed For The Industrial Intelligence Revolution?
By Ben Gu - 01 Dec, 2022 - Comments: 0

Smart manufacturing – the use of nascent technology within the industrial Internet of things (IIoT) to address traditional manufacturing challenges – is leading a supply chain revolution, resulting in smart, connected, and intelligent environments, capable of self-operation and self-healing. While factory automation has been around for decades, smart manufacturing goes a great deal furth... » read more

Holistic 3D-IC Interposer Analysis In Product Designs
By Ben Gu - 22 Sep, 2022 - Comments: 1

The miniaturization trend in electronic devices and the rise in smart and IoT device segments make adopting heterogeneous integration of chip components or 3D-ICs a viable option for miniaturization and better interconnection. This vertical stacking of ICs enables the next generation of sophisticated, intelligent devices, necessitating high chip density and terabytes of bandwidth. As per the f... » read more

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