Author's Latest Posts

Unveiling the Stability of Proper Polyethyleneimine-Functionalized Carbon Nanotube Composites-Derived Chemiresistive CO2 Sensors
By Brewer Science - 24 Oct, 2024 - Comments: 0

A technical paper titled "Unveiling the Stability of Proper Polyethyleneimine-Functionalized Carbon Nanotube Composites-Derived Chemiresistive CO2 Sensors" was published by researchers at Brewer Science. Abstract "Branched polyethyleneimine (PEI), consisting of numerous imine groups, is employed for CO2 gas detection, attributed to the interaction between imine groups and CO2. Incorporatin... » read more

Multi-tier Die Stacking Through Collective Die-to-Wafer Hybrid bonding
By Brewer Science - 23 Jul, 2024 - Comments: 0

A technical paper titled "Multi-tier Die Stacking Through Collective Die-to-Wafer Hybrid bonding" was published by researchers at imec, Brewer Science and SUSS MicroTec Lithography GmbH. Abstract "A collective die-to-wafer bonding flow is extended beyond the N=2 tier to the N=3 and N=4 tier by collectively bonding multiple layers of dies on top of a target wafer. The N=2 die-level is show... » read more

An Efficient, Cost-Effective, Continuous Polymer Purification Method
By Brewer Science - 18 Jan, 2024 - Comments: 0

Polymer precipitation is a crucial process in chemical engineering and is widely applicable to many industries including semiconductors, pharmaceuticals, and wastewater treatment. In many industries, batch polymer precipitation is a common technique for polymer purification. However, batch polymer precipitation is an arduous and inefficient process, which generates excess solvent waste. It is l... » read more

Negative-Tone Photosensitive Polymeric Bonding Material To Enable Room Temperature Prebond For Cu/Polymer Hybrid Bonding
By Brewer Science - 18 Oct, 2023 - Comments: 0

An evaluation of a negative-tone i-line photosensitive polymeric bonding material for achieving prebonding in Cu/polymer hybrid bonding at low temperatures via the Cu damascene process. The polymeric material has a Tg≤100∘C ; Young’s modulus of 99 MPa, the dielectric constant of 2.6, and dissipation factor of 0.0016 at 10 GHz. Shear tests revealed a bond shear strength of over 10 MPa when... » read more

Functionalized Carbon Nanotubes Enabled Flexible And Scalable CO2 Sensors
By Brewer Science - 21 Sep, 2023 - Comments: 0

This work, we have demonstrated a low-cost and effective chemiresistive CO2 sensor based on a composite of functionalized carbon nanotubes (f-CNTs) with polyethyleneimine (PEI). The resulting sensor shows excellent selectivity and sensitivity, which can respond to the CO2 concentration in a wide range of 300 - 5000 ppm. The effects of ink dilution and humidity from the environment on the sen... » read more

Novel Assist Layers To Enhance EUV Lithography Performance Of Photoresists On Different Substrates
By Brewer Science - 16 Aug, 2023 - Comments: 0

In EUV lithography, good resist patterning requires an assist layer beneath it to provide adhesion to prevent pattern collapse of small features and allow for higher aspect ratios. In addition, future EUV high numerical aperture (NA) is expected to require a decrease in thickness from the overall patterning stack. In this study, we are exploring a fundamentally new approach to developing an alt... » read more

Nine Essential Criteria To Achieve A Successful Bonding Process
By Brewer Science - 14 Aug, 2023 - Comments: 0

A photosensitive permanent bonding material enables the creation of high-quality permanent bonds between dissimilar materials used in the creation of MEMS and sensors. Having a thorough understanding of the materials and product performance is crucial to the success of the end application. In this article, we explore nine criteria used to evaluate a polymeric photosensitive permanent bonding ma... » read more

Photonic Debond: Scalability And Advancements
By Brewer Science - 17 May, 2023 - Comments: 0

Advanced packaging technology has continuously evolved over the past 10-20 years to become a major driving force in improving integrated circuit (IC) performance. This improvement in IC performance is assisted by the ability to place specialized components near each other for shorter interconnects in the IC packages. Temporary bond and debond (TB/DB) is an enabling technique for this work. TB/D... » read more

Realization Of Sub-30-Pitch EUV Lithography Through The Application Of Functional Spin-On Glass
By Brewer Science - 19 Oct, 2022 - Comments: 0

Photoresist metrics such as resolution, roughness, CD uniformity, and overall process window are often aimed to realize the full potential of EUV lithography. From the view of the materials supplier, improvements over the aforementioned metrics can be achieved by optimizing the functional materials used under the resist. The underlayers can significantly enhance the resist performance by provid... » read more

A Novel Photosensitive Permanent Bonding Material Designed For Polymer/Metal Hybrid Bonding Applications
By Brewer Science - 18 Aug, 2022 - Comments: 0

Wafer-level hybrid bonding techniques, which provide simultaneous bonding between metal-metal and dielectric-dielectric layers, have attracted more attention in recent years for fabricating 3D integrated circuits with high bandwidth and high interconnect density. However, there are some issues for conventional hybrid bonding using silicon oxide as the dielectric, such as the high stress and low... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy