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A Hybrid PLP Technology Based On A 650mm x 650mm Platform


A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, multilayer high-density chip-last packages have been introduced for more advanced applications. This technology would also benefit from PL processing for cost reduction. Due to the large package di... » read more