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Ed Sperling

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Ed Sperling is the editor in chief of Semiconductor Engineering.

Author's Latest Posts

Challenges Of Heterogeneous Integration
By Ed Sperling - 13 Jul, 2023 - Comments: 0

Heterogeneous integration opens the door to an almost unlimited number of features in a single package, but it also adds system-level challenges into a small space filled with a whole spectrum of possible interactions. Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology, talks about a variety of issues ranging from uneven aging, warpage, and different mechanical stresse... » read more

EDA, IP Fundamentals Shift As Market Soars
By Ed Sperling - 10 Jul, 2023 - Comments: 0

EDA tools and IP continued their double-digit growth trajectory this year, despite a downturn in consumer electronics and a continued shortage of key components that took a large bite out of the semiconductor market as a whole. A just-released report from the ESD Alliance showed a 12% increase in revenue for Q1, increasing to $3.95 billion compared with $3.53 billion in the same period in 20... » read more

Changes In Memory Design
By Ed Sperling - 29 Jun, 2023 - Comments: 0

An explosion of data in automotive, cloud, and AI are altering the fundamentals of memory design. One size no longer fits all, as memory is used for a broader set of applications, from automotive and cloud to consumer devices. Anand Theruvengadam, director of product management at Synopsys, talks about the impact of big data applications on density, memory stacking, and growing concerns about r... » read more

Challenges Grow For Data Management And Sharing In EDA
By Ed Sperling - 29 Jun, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about more openness in EDA data, how increased complexity is affecting time to working silicon, and the impact of geopolitics, with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business U... » read more

Preparing For 5G Millimeter Wave And 6G
By Ed Sperling - 21 Jun, 2023 - Comments: 0

Cellular technology is about to take a giant leap forward, but the packaging, assembly, and testing of the chips used in 5G millimeter wave and the forthcoming 6G ecosystem will be significantly more complicated than anything used in the past. So far, most 5G devices are still working at sub-6 GHz frequencies. A massive rollout of mmWave technology over the next few years will significantly ... » read more

The Next Chip Shortages?
By Ed Sperling - 15 Jun, 2023 - Comments: 0

The rollout of chiplets and heterogeneous designs could have unexpected implications on a global scale, creating a whole new round of chip shortages that will be much harder to fix. It's impossible to say for certain what will happen here in the wake of massive changes in chip design and a fluid and unpredictable geopolitical situation. The trade war between the United States and China began... » read more

CEO Outlook: Chiplets, Data Management, And Reliability
By Ed Sperling - 14 Jun, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about changes in chip design with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business Unit; Niels Faché, vice president and general manager of PathWave Software Solutions at Keysight; ... » read more

Striking A Balance In Acoustic Inspection
By Ed Sperling - 12 Jun, 2023 - Comments: 0

Sound energy is a quick way to to spot voids, delamination, cracks, and other possible defects that are accessible from outside the chip or package, as well as some defects that are inside of chips. But acoustic inspection also is highly sensitive to different materials with different polarities, which can change the reflection of sound waves. Bill Zuckerman, product marketing manager at Nordso... » read more

Improving Image Resolution At The Edge
By Ed Sperling - 30 May, 2023 - Comments: 0

How much cameras see depends on how accurately the images are rendered and classified. The higher the resolution, the greater the accuracy. But higher resolution also requires significantly more computation, and it requires flexibility in the design to be able to adapt to new algorithms and network models. Jeremy Roberson, technical director and software architect for AI/ML at Flex Logix, talks... » read more

Chip Design CEO Outlook
By Ed Sperling - 25 May, 2023 - Comments: 0

Semiconductor Engineering sat down with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business Unit; Niels Faché, vice president and general manager of PathWave Software Solutions at Keysight; Dean Drako, president and CEO of IC M... » read more

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