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Ed Sperling

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Ed Sperling is the editor in chief of Semiconductor Engineering.

Author's Latest Posts

Emerging Technologies Driving Heterogeneous Integration
By Ed Sperling - 24 Sep, 2024 - Comments: 0

As chips are disaggregated into chiplets, more features are being added into these devices that chipmakers were unable to include in the past due to reticle size limits and the high cost of scaling everything to the latest process node. This has opened the door to new architectures, new materials such as glass substrates, and a variety of new challenges. Dick Otte, president and CEO of Promex I... » read more

Striking A Balance On Efficiency, Performance, And Cost
By Ed Sperling - 11 Sep, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss power-related issues such as voltage droop, application-specific processing elements, the impact of physical effects in advanced packaging, and the benefits of backside power delivery, with Hans Yeager, senior principal engineer, architecture, at Tenstorrent; Joe Davis, senior director for Calibre interfaces and EM/IR product m... » read more

New AI Processors Architectures Balance Speed With Efficiency
By Ed Sperling - 04 Sep, 2024 - Comments: 1

Leading AI systems designs are migrating away from building the fastest AI processor possible, adopting a more balanced approach that involves highly specialized, heterogeneous compute elements, faster data movement, and significantly lower power. Part of this shift revolves around the adoption of chiplets in 2.5D/3.5D packages, which enable greater customization for different workloads and ... » read more

Real-Time Safety Monitoring
By Ed Sperling - 28 Aug, 2024 - Comments: 0

Various types of semiconductor test will determine whether a chip is free of defects and meets the specification, but understanding how it's behaving in the field under real workloads and harsh ambient conditions may be very different in automotive applications, where vibration, heat, cold can disrupt the normal functioning of a chip over time and reduce its lifespan. Alex Burlak, vice presiden... » read more

Why Connectivity Is Changing Microcontrollers
By Ed Sperling - 22 Aug, 2024 - Comments: 0

More devices are being connected to the internet and to each other, transforming what used to be a simple microprocessor with fixed memory and limited connectivity into a much more complex and versatile device. These new MCUs need more compute power, more memory both on and off-chip, and on-the-fly encryption/decryption. Sivaram Trikutam, vice president of the Wi-Fi product line at Infineon, ta... » read more

Next-Gen High-Speed Communication In Data Centers
By Ed Sperling - 21 Aug, 2024 - Comments: 0

Data centers are being flooded with data. While more of it needs to be processed locally, much of it also needs to be moved around within a system and between systems. This has put a spotlight on a variety of new optical technologies and methodologies. Yang Zhang, senior product marketing manager at Cadence, talks about the rapid increase in different types of optics and optical scenarios being... » read more

3.5D: The Great Compromise
By Ed Sperling - 21 Aug, 2024 - Comments: 1

The semiconductor industry is converging on 3.5D as the next best option in advanced packaging, a hybrid approach that includes stacking logic chiplets and bonding them separately to a substrate shared by other components. This assembly model satisfies the need for big increases in performance while sidestepping some of the thorniest issues in heterogeneous integration. It establishes a midd... » read more

Real-World Applications Of Computational Fluid Dynamics
By Ed Sperling - 05 Aug, 2024 - Comments: 0

More powerful chips are enabling chips to process more data faster, but they're also having a revolutionary impact on how that data can be used. Simulations that used to take days or weeks now can be completed in a matter of hours, and multi-physics simulations that were implausible to even consider are now very much in the realm of what is possible. Parviz Moin, professor of mechanical enginee... » read more

Making Electronics More Efficient
By Ed Sperling - 31 Jul, 2024 - Comments: 0

Projections about the amount of energy required for AI in data centers and other electronic devices are putting a spotlight on more efficient electronics. But making chips and systems more efficient is an enormous challenge. It used to be as simple as turning down the voltage or moving to the next process node, but those approaches are no longer yielding the same kinds of benefits as in the pas... » read more

Where Power Savings Really Count
By Ed Sperling - 31 Jul, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss why and where improvements in architectures and data movement will have the biggest impact, with Hans Yeager, senior principal engineer, architecture, at Tenstorrent; Joe Davis, senior director for Calibre interfaces and EM/IR product management at Siemens EDA; Mo Faisal, CEO of Movellus; Trey Roessig, CTO and senior vice presi... » read more

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