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Ed Sperling

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Ed Sperling is the editor in chief of Semiconductor Engineering.

Author's Latest Posts

More Data, More Redundant Interconnects
By Ed Sperling - 19 May, 2025 - Comments: 0

The proliferation of AI dramatically increases the amount of data that needs to be processed, stored, and moved, accelerating the aging of signal paths through which that data travels and forcing chipmakers to build more redundancy into the interconnects. In the past, nearly all redundant data paths were contained within a planar chip using a relatively thick silicon substrate. But as chipma... » read more

Speeding Up Die-To-Die Interconnectivity
By Ed Sperling - 14 May, 2025 - Comments: 0

Disaggregating SoCs, coupled with the need to process more data faster, is forcing engineering teams to rethink the electronic plumbing in a system. Wires don't shrink, and just cramming more wires or thicker wires into a package are not viable solutions. Kevin Donnelly, vice president of strategic marketing at Eliyan, talks about how to speed up data movement between chiplets with bi-direction... » read more

Conversing With Your Dishwasher
By Ed Sperling - 12 May, 2025 - Comments: 0

What does "Error 22" mean on your smart appliance? Today, most people have to look it up on the internet, but that's about to change. John Weil, vice president and general manager for Synaptics IoT and Edge AI Processor business unit, talks about how AI can be inexpensively and efficiently utilized by mapping directly to a database using a natural language interface. Unlike today, that informat... » read more

Three-Way Race To 3D-ICs
By Ed Sperling - 05 May, 2025 - Comments: 1

Intel Foundry, TSMC, and Samsung Foundry are scrambling to deliver all the foundational components of full 3D-ICs, which collectively will deliver orders of magnitude improvements in performance with minimal power sometime within the next few years. Much attention has been focused on process node advances, but a successful 3D-IC implementation is much more complex and comprehensive than just... » read more

AI Drives Re-Engineering Of Nearly Everything In Chips
By Ed Sperling - 24 Apr, 2025 - Comments: 0

AI's ability to mine patterns across massive quantities of data is causing fundamental changes in how chips are used, how they are designed, and how they are packaged and built. These shifts are especially apparent in high-performance AI architectures being used inside of large data centers, where chiplets are being deployed to process, move, and store massive amounts of data. But they also ... » read more

What’s Changing In SerDes
By Ed Sperling - 16 Apr, 2025 - Comments: 0

SerDes is all about pushing data through the smallest number of physical channels. But when it comes to AI, more data needs to be moved, and it has to be moved more quickly. Todd Bermensolo, product marketing manager at Alphawave Semi, talks about the impact of faster data movement on the transmitter (more power) and on the receiver (gain and advanced equalization), how to ensure signal inte... » read more

First-Time Silicon Success Plummets
By Ed Sperling - 27 Mar, 2025 - Comments: 0

First-time silicon success is falling sharply due to rising complexity, the need for more iterations as chipmakers shift from monolithic chips to multi-die assemblies, and an increasing amount of customization that makes design and verification more time-consuming. Details from a new functional verification survey[1] highlight the growing difficulty of developing advanced chips that are both... » read more

Chip Failures: Prevention And Responses Over Time
By Ed Sperling - 19 Mar, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the causes of chip failures, how to respond to them, and how that can change over time, with Steve Pateras, vice president of marketing and business development at Synopsys; Noam Brousard, vice president of solutions engineering at proteanTecs; Harry Foster, chief verification scientist at Siemens EDA; and Jerome Toublanc, hi... » read more

Optimizing Data Movement In SoCs And Advanced Packages
By Ed Sperling - 18 Mar, 2025 - Comments: 0

The amount of data that needs to move around a chip is growing exponentially, driven by the rollout of AI and more sensors everywhere. There may be hundreds of IP blocks, more compute elements, and many more wires to contend with. Andy Nightingale, vice president of product management and marketing at Arteris, talks about the demand for low-latency on-chip communication in increasingly complex ... » read more

Changes In Motor Control
By Ed Sperling - 17 Mar, 2025 - Comments: 0

Motors are changing in fundamental ways, and you can actually hear the difference. Vacuums, air conditioners, and home appliances are getting quieter. They're also becoming more efficient, able to last longer on a single battery charge or drawing less energy from the grid, and they're becoming more secure. Steve Tateosian, senior vice president for Infineon's IoT, Compute & Wireless Busines... » read more

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