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Ed Sperling

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Ed Sperling is the editor in chief of Semiconductor Engineering.

Author's Latest Posts

Co-Packaged Optics In The Data Center
By Ed Sperling - 08 Jun, 2022 - Comments: 0

Just because faster Ethernet is added to the data center doesn’t mean existing hardware can utilize it efficiently. Scott Durrant, strategic marketing manager at Synopsys, talks with Semiconductor Engineering about the rapid rollout of faster Ethernet rates, problems in moving data to the front module of the switch and how much energy is required, and what optical technology can bring to the ... » read more

Chip Substitutions Raising Security Concerns
By Ed Sperling - 02 Jun, 2022 - Comments: 0

Substituting chips is becoming more common in the electronics industry as shortages drag on, allowing systems vendors to continue selling everything from cars to manufacturing equipment and printer cartridges without waiting for a commoditized part. But substitutions aren't always an even swap, and they increase security risks in ways that may take years to show up or fully understand. So fa... » read more

Who Benefits From Chiplets, And When
By Ed Sperling - 31 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss new packaging approaches and integration issues with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front of a... » read more

Repositioning For A Changing IC Market
By Ed Sperling - 26 May, 2022 - Comments: 0

Sailesh Chittipeddi, executive vice president at Renesas, sat down with Semiconductor Engineering to talk about how changes in end markets are shifting demand for technology. What follows are excerpts of that conversation. SE: Renesas has acquired a number of companies over the past several years. What's the goal? Chittipeddi: The goal very simply is to create an industry leading solutio... » read more

Deep Learning In Industrial Inspection
By Ed Sperling - 24 May, 2022 - Comments: 0

Deep learning is at the upper end of AI complexity, sifting through more data to achieve more accurate results. Charlie Zhu, vice president of R&D at CyberOptics, talks about how DL can be utilized with inspection to identify defects in chips that are not discernible by traditional computer vision algorithms, classifying multiple objects simultaneously from multiple angles and taking into accou... » read more

Protecting ICs Against Specific Threats
By Ed Sperling - 18 May, 2022 - Comments: 0

Identifying potential vulnerabilities and attack vectors is a first step in addressing them. Anders Nordstrom, security application engineer at Tortuga Logic, talks with Semiconductor Engineering about the growing risk of remote hardware attacks, what to do when a chip is hacked, and where to find the most common weaknesses for chips. » read more

Bridging IC Design, Manufacturing, And In-Field Reliability
By Ed Sperling - 18 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management and how that can potentially glue together design, manufacturing, and devices in the field, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer sci... » read more

Transforming AI Models For Accelerator Chips
By Ed Sperling - 17 May, 2022 - Comments: 0

AI is all about speeding up the movement and processing of data. Ali Cheraghi, solution architect at Flex Logix, talks about why floating point data needs to be converted into integer point data, how that impacts power and performance, and how different approaches in quantization play into this formula. » read more

New End Markets, More Demand For Complex Chips
By Ed Sperling - 16 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss economic conditions and how that affects chip design with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front... » read more

Hidden Impacts Of Software Updates
By Ed Sperling - 10 May, 2022 - Comments: 0

Over-the-air updates can reduce obsolescence over longer chip and system lifetimes, but those updates also can impact reliability, performance, and affect how various resources such as memory and various processing elements are used. The connected world is very familiar with over-the-air (OTA) updates in smart phones and computers, where the software stack — firmware, operating systems, dr... » read more

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