Author's Latest Posts


Safe And Robust Machine Learning


Deploying machine learning in the real world is a lot different than developing and testing it in a lab. Quenton Hall, AI systems architect at Xilinx, examines security implications on both the inferencing and training side, the potential for disruptions to accuracy, and how accessible these models and algorithms will be when they are used at the edge and in the cloud. This involves everything ... » read more

Design For Test Data


As design pushes deeper into data-driven architectures, so does test. Geir Eide, director for product management of DFT and Tessent Silicon Lifecycle Solutions at Siemens Digital Industries Software, talks with Semiconductor Engineering about a subtle but significant shift for designing testability into chips so that test data can be used at multiple stages during a device’s lifetime. » read more

CEO Outlook: Chiplets, Longer IC Lifetimes, More End Markets


Experts at the Table: Semiconductor Engineering sat down to discuss chiplets, longer IC lifetimes, and a spike in the number of end applications with Lip-Bu Tan, CEO of Cadence; Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of Siemens IC EDA; John Kibarian, CEO of PDF Solutions; Prakash Narain, president and CEO of Real Intent; Dean Drako, president and CEO of IC Manage; an... » read more

Dynamically Reconfiguring Logic


Dynamic reconfiguration of semiconductor logic has been possible for years, but it never caught on commercially. Cheng Wang, co-founder and senior vice president of software and engineering at Flex Logix, explains why this capability has been so difficult to utilize, what’s changed, how a soft logic layer can be used to control when to read, compute, steer, and write data back to memory, and ... » read more

Challenges In Developing A New Inferencing Chip


Cheng Wang, co-founder and senior vice president of software and engineering at Flex Logix, sat down with Semiconductor Engineering to explain the process of bringing an inferencing accelerator chip to market, from bring-up, programming and partitioning to tradeoffs involving speed and customization.   SE: Edge inferencing chips are just starting to come to market. What challenges di... » read more

Week In Review: Manufacturing, Test


Lots more fabs and capacity The chip industry sees opportunity in shortages, and is racing to meet demand. SEMI reports 19 new worldwide high-volume fabs already have started construction, or will start by end of this year, and another 10 are scheduled in 2022. “Equipment spending for these 29 fabs is expected to surpass $140 billion over the next few years as the industry pushes to addre... » read more

CEO Outlook: More Data, More Integration, Same Deadlines


Experts at the Table: Semiconductor Engineering sat down to discuss the future of chip design and EDA tools with Lip-Bu Tan, CEO of Cadence; Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of Siemens IC EDA; John Kibarian, CEO of PDF Solutions; Prakash Narain, president and CEO of Real Intent; Dean Drako, president and CEO of IC Manage; and Babak Taheri, CEO of Silvaco. What ... » read more

Problems In The Power Grid


The gap is widening between power availability and peak demand. Ritesh Tyagi, head of innovation and growth strategy at Infineon Technologies, talks about what needs to be done to fix the power grid, particularly as more cars are electrified and more electronic devices are mobile. While there currently is a surplus in power being generated on a macro level in the United States, for example, it�... » read more

Geopolitical And Economic Outlook For Chips And Equipment


Experts at the Table: Semiconductor Engineering sat down to discuss geopolitical and economic changes and how they affect the chip industry with Jean-Christophe Eloy, CEO of Yole Developpement; Risto Puhakka, president of VLSI Research; Carolyn Evans, chief economist at Intel; Duncan Meldrum, chief economist at Hilltop Economics; and Rozalia Beica, head of the semiconductor business at AT&S... » read more

Improving Power & Performance Beyond Scaling


Steven Woo, Rambus fellow and distinguished inventor, discusses architectural changes inside of servers and data centers to allow pooling of resources such as memory. That has a big impact on power efficiency and overall performance, but it also allows data centers to customize their architectures and prioritized resources with much more granularity than they can do today. » read more

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