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Ed Sperling

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Ed Sperling is the editor in chief of Semiconductor Engineering.

Author's Latest Posts

Shifting Auto Architectures
By Ed Sperling - 29 Apr, 2021 - Comments: 0

Domain controllers and gateways are being replaced by central processing modules and zonal gateways to handle all of the data traffic in a vehicle. Ron DiGiuseppe, automotive IP segment manager at Synopsys, talks with Semiconductor Engineering about how automotive applications are changing, what that means for engineering teams, and how they will shift as AI is increasingly deployed. » read more

Putting Limits On What AI Systems Can Do
By Ed Sperling - 22 Apr, 2021 - Comments: 0

New techniques and approaches are starting to be applied to AI and machine learning to ensure they function within acceptable parameters, only doing what they're supposed to do. Getting AI/ML/DL systems to work has been one of the biggest leaps in technology in recent years, but understanding how to control and optimize them as they adapt isn't nearly as far along. These systems are generall... » read more

Next-Gen Design Challenges
By Ed Sperling - 20 Apr, 2021 - Comments: 0

As more heterogeneous chips and different types of circuitry are designed into one system, that all needs to be simulated, verified and validated before tape-out. Aveek Sarkar, vice president of engineering at Synopsys, talks with Semiconductor Engineering about the intersection of scale complexity and systemic complexity, the rising number of corners, and the reduced margin with which to buffe... » read more

EDA, IP Revenues Soar
By Ed Sperling - 13 Apr, 2021 - Comments: 1

EDA and IP revenues increased 15.4% to $3.032 billion in Q4 2020, according to a just-released report, with huge increases reported in China and India, and a solid double-digit increase in the Americas. EDA/IP revenue from China increased 66.4% in Q4 EDA/IP compared with the same period in 2019, and for the 2020 calendar year it was up 52.3%. India's spending was up 32% for the quarter. And ... » read more

New Uses For AI
By Ed Sperling - 01 Apr, 2021 - Comments: 0

AI is being embedded into an increasing number of technologies that are commonly found inside most chips, and initial results show dramatic improvements in both power and performance. Unlike high-profile AI implementations, such as self-driving cars or natural language processing, much of this work flies well under the radar for most people. It generally takes the path of least disruption, b... » read more

Network Interface Card Evolution
By Ed Sperling - 31 Mar, 2021 - Comments: 0

Longer chip lifetimes, more data to process and move, and a slowdown in the rate of processor improvements has created a series of constantly shifting bottlenecks. Kartik Srinivasan, director of data center marketing at Xilinx, looks at one of those bottlenecks, the network interface card, why continuous enhancements and changes will be required, and how to extend the life of NICs as the networ... » read more

How Heterogeneous ICs Are Reshaping Design Teams
By Ed Sperling - 31 Mar, 2021 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the complex interactions developing between different engineering groups as designs become more heterogeneous, with Jean-Marie Brunet, senior director for the Emulation Division at Siemens EDA; Frank Schirrmeister, senior group director for solution marketing at Cadence; Maurizio Griva, R&D Manager at Reply; and Laurent Mai... » read more

What Goes Wrong In Advanced Packages
By Ed Sperling - 24 Mar, 2021 - Comments: 1

Advanced packaging may be the best way forward for massive improvements in performance, lower power, and different form factors, but it adds a whole new set of issues that were much better understood when Moore's Law and the ITRS roadmap created a semi-standardized path forward for the chip industry. Different advanced packaging options — system-in-package, fan-outs, 2.5D, 3D-IC — have a... » read more

Customized Micro-Benchmarks For HW/SW Performance
By Ed Sperling - 23 Mar, 2021 - Comments: 0

Raw performance used to be the main focus of benchmarks, but they may have outlived their usefulness for many applications. Dana McCarty, vice president of sales and marketing for AI Inference Products at Flex Logix, talks about why companies need to develop and utilize their own specific models to accurately gauge hardware and software performance, which can be slowed by bottlenecks in I/O and... » read more

Changing The Rules For Chip Scaling
By Ed Sperling - 10 Mar, 2021 - Comments: 0

Aki Fujimura, CEO of D2S, talks with Semiconductor Engineering about the incessant drive for chip density, how to improve that density through other means than just scaling, and why this is so important for the chip industry. » read more

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