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Ed Sperling

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Ed Sperling is the editor in chief of Semiconductor Engineering.

Author's Latest Posts

Getting Particular About Partitioning
By Ed Sperling - 31 Aug, 2020 - Comments: 0

Partitioning could well be one of the most important and pervasive trends since the invention of computers. It has been around for almost as long, too. The idea dates back at least as far back as the Manhattan Project during World War II, when computations were wrapped within computations. It continued from there with what we know as time-sharing, which rather crudely partitioned access by p... » read more

RISC-V’s Expanding Footprint
By Ed Sperling - 27 Aug, 2020 - Comments: 0

Zdenek Prikryl, CTO of Codasip, sat down with Semiconductor Engineering to talk about the RISC-V market, where this open instruction set architecture (ISA) is gaining ground, and what are the biggest challenges in working with this technology. SE: Where do you see the value in RISC-V? Is it for off-the-shelf processors or more customized components? Prikryl: A few years ago, RISC-V was us... » read more

Moore’s Law Enters The 4th Dimension
By Ed Sperling - 21 Aug, 2020 - Comments: 5

The basic idea that more transistors are better hasn't changed in more than half a century. In fact, the overriding theme of a number of semiconductor conferences this month is that we will never have enough compute capability or storage capacity. In the past, when the number of transistors in a given area actually did double every 18 to 24 months, increasing density per square millimeter fo... » read more

Huawei: 5G Is About Capacity, Not Speed
By Ed Sperling - 18 Aug, 2020 - Comments: 3

Paul Scanlan, CTO of the Huawei Carrier Business Group in Huawei Technologies, sat down with Semiconductor Engineering to talk about 5G, which use cases are attractive and why, and how that compares with previous wireless technologies. SE: Where are you seeing 5G, and how do you see this rolling out both for sub-6GHz and millimeter wave? Scanlan: 5G is a platform for transformation. The f... » read more

From Cloud To Cloudlets
By Ed Sperling - 17 Aug, 2020 - Comments: 0

Cloudlets, or mini-clouds, are starting to roll out closer to the sources of data in an effort to reduce latency and improve overall processing performance. But as this approach gains steam, it also is creating some new challenges involving data distribution, storage and security. The growing popularity of distributed clouds is a recognition that the cloud model has limitations. Sending the ... » read more

The Next Leap
By Ed Sperling - 14 Aug, 2020 - Comments: 0

Some interesting new technologies are about to go on display. Chipmakers and systems companies have been working on quantum computing, photonics, and specialized AI processors, for the past several years, and those efforts are beginning to gain momentum. The goal is no longer a doubling of performance and power. It's now orders of magnitude improvement, and next week's Hot Chips conference i... » read more

Astera Labs: Purpose-Built Connectivity
By Ed Sperling - 14 Aug, 2020 - Comments: 0

Growing amounts of data are forcing companies to rethink where data is processed and when, how and where it is moved. But solutions may vary greatly from one company to the next, and from one use case or application to the next. This is forcing the adoption of a heterogenous compute architecture that combines traditional processors, such as CPUs, GPUs and FPGAs, with AI processors and smart net... » read more

Power And Performance Optimization At 7/5/3nm
By Ed Sperling - 13 Aug, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss power optimization with Oliver King, CTO at Moortec; João Geada, chief technologist at Ansys; Dino Toffolon, senior vice president of engineering at Synopsys; Bryan Bowyer, director of engineering at Mentor, a Siemens Business; Kiran Burli, senior director of marketing for Arm's Physical Design Group; Kam Kittrell, senior product management group d... » read more

Chiplet Reliability Challenges Ahead
By Ed Sperling - 12 Aug, 2020 - Comments: 2

Assembling chips using LEGO-like hard IP is finally beginning to take root, more than two decades after it was first proposed, holding the promise of faster time to market with predictable results and higher yield. But as these systems of chips begin showing up in mission-critical and safety-critical applications, ensuring reliability is proving to be stubbornly difficult. The main driver fo... » read more

The Very Long Road To Autonomous Vehicles
By Ed Sperling - 11 Aug, 2020 - Comments: 0

It may be a long wait before fully autonomous vehicles hit the road. Even semi-autonomous vehicles aren't doing so well. The American Automobile Association drove 4,000 miles in cars equipped with active driver assistance, averaging problems every 8 miles. AAA cited a host of problems, including driving too close to other cars or guardrails, aggressive braking, and automated steering that wo... » read more

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