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Ed Sperling

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Ed Sperling is the editor in chief of Semiconductor Engineering.

Author's Latest Posts

3 Types Of AI Hardware
By Ed Sperling - 20 Jul, 2020 - Comments: 1

As AI chips become more pervasive, three primary approaches are moving to the forefront. Bradley Geden, director of product marketing at Synopsys, looks at how to take advantage of repeatability, what the different flavors look like, the difference between flat and hierarchical design, and what impact black-box arrays have on programmability. » read more

EDA Strong, M&A Activity Up
By Ed Sperling - 20 Jul, 2020 - Comments: 3

The EDA industry is faring well in an era of COVID-19 and global uncertainty, and the numbers prove it. But the question being asked privately by a number of executives across the industry is whether growth will hold up beyond the first quarter of next year if a vaccine or treatment isn't ready. There are a lot of financial models based upon a variety of developments, and so far there is lit... » read more

Make Way For Flexible ICs
By Ed Sperling - 16 Jul, 2020 - Comments: 0

The push to develop intelligent sensors everywhere does not require everything to be on a silicon substrate. In fact, a growing part of the market increasingly is focused on flexible substrates. The market for printed sensors is roughly $3.6 billion today, according to a new report by IDTechEx. In a decade, that number is expected to grow to $4.5 billion, according to the firm, with growth i... » read more

Smaller Nodes, Much Bigger Problems
By Ed Sperling - 15 Jul, 2020 - Comments: 3

João Geada, chief technologist at Ansys, sat down with Semiconductor Engineering to talk about device scaling, advanced packaging, increasing complexity and the growing role of AI. What follows are excerpts of that conversation. SE: We've been pushing along Moore's Law for roughly a half-century. What sorts of problems are you seeing now that you didn't see a couple nodes ago? Geada: The... » read more

Rethinking Architectures Based On Power
By Ed Sperling - 13 Jul, 2020 - Comments: 0

The newest chips being developed for everything from the cloud to the edge of the network look nothing like designs of even a year or two ago. They are architected for speed, from the throughput of high-speed buses and external interconnects to the customized accelerators and arrays of redundant MACs. But many of these designs have barely scratched the surface for saving power, which will becom... » read more

Next Challenge: Known Good Systems
By Ed Sperling - 07 Jul, 2020 - Comments: 0

The leading edge of design is heading toward multi-die/multi-chiplet architectures, and an increasing number of mainstream designs likely will follow as processing moves closer to the edge. This doesn't mean every chipmaker will be designing leading-edge chips, of course. But more devices will have at least some leading-edge logic or will be connected over some advanced interconnect scheme t... » read more

Chip Reliability Vs. Cost
By Ed Sperling - 05 Jul, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss the cost, reliability and security with Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of IC EDA at Mentor, a Siemens Business; Raik Brinkmann, CEO of OneSpin Solutions; Babak Taheri, CEO of Silvaco; John Kibarian, CEO of PDF Solutions; and Prakash Narain, CEO of Real Intent. What follows are excerpts of that virtual conversation... » read more

Winners And Losers At The Edge
By Ed Sperling - 01 Jul, 2020 - Comments: 0

The edge is a vast collection of niches tied to narrow vertical markets, and it is likely to stay that way for years to come. This is both good and bad for semiconductor companies, depending upon where they sit in the ecosystem and their ability to adapt to a constantly shifting landscape. Some segments will see continued or new growth, including EDA, manufacturing equipment, IP, security an... » read more

Globalization And Regionalization Of Knowledge
By Ed Sperling - 29 Jun, 2020 - Comments: 0

Anyone who has clicked on the chat feature on virtual conferences may have noticed the striking mix of nationalities logging in. The explosion of these conferences, as well as video calls, has opened the door for engineers at all levels — from students to industry veterans — to exchange ideas on a global scale. In the past, companies would send a handful of their employees to conferences... » read more

2020 CEO Outlook
By Ed Sperling - 25 Jun, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss the semiconductor industry's outlook and what's changing with Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of IC EDA at Mentor, a Siemens Business; Raik Brinkmann, CEO of OneSpin Solutions; Babak Taheri, CEO of Silvaco; John Kibarian, CEO of PDF Solutions; and Prakash Narain, CEO of Real Intent. The conversation was part of the... » read more

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