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Ed Sperling

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Ed Sperling is the editor in chief of Semiconductor Engineering.

Author's Latest Posts

MLPerf Benchmarks
By Ed Sperling - 11 Dec, 2019 - Comments: 2

Geoff Tate, CEO of Flex Logix, talks about the new MLPerf benchmark, what’s missing from the benchmark, and which ones are relevant to edge inferencing. » read more

5 Major Shifts In Automotive
By Ed Sperling - 11 Dec, 2019 - Comments: 1

Much of the automotive industry has begun repositioning and retrenching over the past few months, pushing back the projected rollout for fully autonomous vehicles and changing direction on power sources and technology used in the next-generation of electric vehicles. Taken together, these shifts mark a significant departure for traditional automakers, which find themselves playing catch-up t... » read more

Reliability At 5nm And Below
By Ed Sperling - 10 Dec, 2019 - Comments: 2

The best way to figure out how a chip or package will age is to bake it in an oven, heat it in a pressure cooker, and stick it in a freezer. Those are all standard methods to accelerate physical effects and the effects of aging, but it's not clear they will continue working as chips shrink to 5nm and 3nm, or as they are included in multi-die packages. Extending any of those kitchen-like appr... » read more

Gaps Emerge In Test And Analytics
By Ed Sperling - 10 Dec, 2019 - Comments: 0

Sensor and process drift, increased design complexity, and continued optimization of circuitry throughout its lifetime are driving test and analytics in new directions, requiring a series of base comparisons against which equipment and processes can be measured. In the design world this type of platform is called a digital twin, but in the test world there is no equivalent today. And as more... » read more

Challenges In IP Reuse
By Ed Sperling - 09 Dec, 2019 - Comments: 0

Jeff Markham, software architect at ClioSoft, explains why IP reuse is so important in advanced process node SoC chip designs, what companies need to keep track of when working with third-party IP, and how it needs to be characterized. » read more

CXL Vs. CCIX
By Ed Sperling - 06 Dec, 2019 - Comments: 0

Kurt Shuler, vice president of marketing at ArterisIP, explains how these two standards differ, which one works best where, and what each was designed for. » read more

Preparing For The Great Auto War
By Ed Sperling - 05 Dec, 2019 - Comments: 7

The internal combustion engine's days are numbered, and what comes next is going to cause one of the biggest upheavals in the history of business. Before semiconductors and electronics, it was the auto industry that defined economies of scale. In fact, the auto industry became the model on which the entire electronics industry was built. It always was assumed that the mainframe, minicomputer... » read more

Distributed Design Implementation
By Ed Sperling - 04 Dec, 2019 - Comments: 0

PV Srinivas, group director for R&D at Synopsys, talks about the impact of larger chips and increasing complexity on design productivity, why divide-and-conquer doesn’t work so well anymore, and how to reduce the number of blocks that need to be considered to achieve faster timing closure and quicker time to market. » read more

Finding Hardware Trojans
By Ed Sperling - 03 Dec, 2019 - Comments: 0

John Hallman, product manager for trust and security at OneSpin Technologies, looks at how to identify hardware Trojans in a design, why IP from different vendors makes this more complicated, and how a digital twin can provide a reference point against which to measure if a design has been compromised. » read more

Cadence To Buy NI’s AWR Unit For $160M
By Ed Sperling - 02 Dec, 2019 - Comments: 0

Cadence signed a deal to buy National Instruments' AWR business unit for about $160 million in cash, a move that Cadence describes as a way to broaden its market into intelligent system design. AWR's strength is high-frequency RF design automation tools, particularly in the millimeter wave and microwave spectrums, which are critical for radar and 5G. Both of those technologies are expected t... » read more

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