Gregory Haley

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Gregory Haley is a technology editor at Semiconductor Engineering.

Author's Latest Posts

What’s Failing At The Interface
By Gregory Haley - 07 Apr, 2026 - Comments: 0

Key Takeaways The interface is where failures in advanced packaging become visible, but it's increasingly not where they originate. Weak interfaces often don't fail at time zero, but they do degrade due to parametric drift and margin erosion that binary test screens miss entirely. The temporary test interconnect is the largest variable in the measurement chain and must be controlled ... » read more

Advanced Packaging Limits Come Into Focus
By Gregory Haley - 19 Mar, 2026 - Comments: 0

Key Takeaways: Packaging is now a performance variable. Substrate, bonding, and process sequence determine what can be built at scale. Warpage underlies most advanced packaging failures and gets harder to control as package sizes grow. Every proposed solution, such as glass, panel processing, and backside power, solves one problem while creating another. Moore's Law has shif... » read more

Detecting Chemical Variability At Advanced Nodes
By Gregory Haley - 10 Mar, 2026 - Comments: 2

Key Takeaways Yield loss is increasingly driven by molecular variability in thin films, interfaces, and contamination rather than visible defects. Reliability issues often appear first as parametric drift or margin erosion under workload and thermal stress. Detection requires correlating molecular metrology, embedded electrical telemetry, and AI-driven wafer inspection. As s... » read more

Tool And Methodology Changes Coming In Fab And Package Automation
By Gregory Haley - 04 Mar, 2026 - Comments: 0

Experts at the table: Semiconductor Engineering sat down to discuss what's changing in semiconductor fabs and packaging houses with Michael Lowman, senior product marketing manager for Data Analytics at Cohu; Aftkhar Aslam, CEO at yieldWerx, Woo Young Han, product marketing director at Onto Innovation; and Lihong Cao, senior director of engineering and technical marketing for ASE. What foll... » read more

Back-End Automation Tackles Growing Complexity
By Gregory Haley - 25 Feb, 2026 - Comments: 0

Experts at the table: Semiconductor Engineering sat down to discuss back-end automation challenges in advanced packaging with Michael Lowman, senior product marketing manager for Data Analytics at Cohu; Aftkhar Aslam, CEO at yieldWerx, Woo Young Han, product marketing director at Onto Innovation; and Lihong Cao, senior director of engineering and technical marketing for ASE. What follows are ex... » read more

When Cleaning Chips Isn’t Clean Enough
By Gregory Haley - 19 Feb, 2026 - Comments: 0

Key Takeaways Contamination is becoming much more difficult to identify at the most advanced nodes, forcing fabs to rethink how control is achieved. Issues may show up as electrical or statistical anomalies, not particles, and not at time zero. Reliable classification is needed to identify critical contamination and reduce time and effort spent on nuisance failures. For much... » read more

Resistance In Advanced Packages Is Now A System-Level Problem
By Gregory Haley - 10 Feb, 2026 - Comments: 0

Key Takeaways Kelvin measurement, which has been in use for decades, is no longer sufficient for addressing resistance in complex chips. The problem is that resistance is no longer concentrated in transistors, and where it does show up isn't always consistent or obvious. Traditional pass/fail approaches need to be replaced by more granular and flexible analytics and methodologies. ... » read more

Every Atom Now Counts In Advanced Chip Manufacturing
By Gregory Haley - 22 Jan, 2026 - Comments: 0

Artificial-intelligence workloads are pushing semiconductor design to a point where traditional scaling strategies are running out of room. Performance improvements that once came from shrinking transistors now depend increasingly on how devices are stacked, interconnected, and isolated. Transistor scaling still matters, but advanced device architectures no longer can accommodate the power dens... » read more

Wafer Probe Struggles To Adapt To Multi-Die Assemblies
By Gregory Haley - 13 Jan, 2026 - Comments: 1

Wafer probe, one of the key processes for ensuring reliability in semiconductor manufacturing, is becoming increasingly unreliable in multi-die assemblies and at leading-edge nodes. For much of the semiconductor industry’s history, wafer probe occupied a stable, largely uncontested role in manufacturing. It was understood as a screening step, an electrical checkpoint to identify failing de... » read more

Reliability Risks Shift To The Materials Stack
By Gregory Haley - 18 Dec, 2025 - Comments: 0

The semiconductor industry’s push into 3D integration and large-format substrates has fundamentally changed the role of materials in packaging. What were once structural supports and electrical insulators have become critical performance limiters. Modern packages contain far more polymers, adhesives, advanced dielectrics, thermal materials, and composite laminates than previous generations... » read more

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