John Parry

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John Parry is an electronics industry manager at Siemens Digital industries Software. A chemical engineer by training, Parry earned a PhD in reactor design before getting involved with computational fluid dynamics (CFD) more than 25 years ago. He joined Flomerics Ltd. when it opened its doors in 1989 and continued there when it became the Mechanical Analysis Division of Mentor Graphics, now Simulation and Test Systems, Siemens Digital Industries Software. As the division’s Electronics Industry Manager, Parry has coordinated EC-funded projects and managed Knowledge Transfer Programs and strategic internal projects, as well as overseeing the technical integration of MicReD’s business into the division. Parry's technical contributions to the discipline of electronics cooling include developing a host of compact thermal models for fans, heat sinks, chip packages and LEDs. He has published several papers in these areas, and also has expertise in Design of Experiments and optimization. Today he also is responsible for the Mechanical Analysis Division’s research activities and its Higher Education Program. He serves on the JEDEC JC15 Thermal Standards Committee and on various conference committees, and was General Chair of the SEMI-THERM 21 conference.

Author's Latest Posts

Achieving Physical Reliability Of Electronics With Digital Design

By John Parry - 14 Jan, 2021 - Comments: 0

By John Parry and G.A. (Wendy) Luiten With today’s powerful computational resources, digital design is increasingly used earlier in the design cycle to predict zero-hour nominal performance and to assess reliability. The methodology presented in this article uses a combination of simulation and testing to assess design performance, providing more reliability and increased productivity. ... » read more

Huawei Delivers Outstandingly Accurate Models

By John Parry - 25 May, 2017 - Comments: 0

By John Parry, Mentor, a Siemens Business, and Yake Fang, Huawei Technologies Co., Ltd. Packaging high-performance multi-core IC devices used in communication applications is a key challenge for both manufacturers and system integrators. Traditionally a System-in-Package (SiP) has been taken, with chips mounted side-by-side, allowing differing semiconductor technologies to be mixed. More r... » read more

A Better Way To Measure Heat

By John Parry - 24 Nov, 2015 - Comments: 0

Are you an engineering manager with budget responsibility, concerned about the thermal performance of your company’s designs or manufactured products? Or, are you a senior engineer who is responsible for the thermal design or characterization of components and systems? In either situation, the results of using the transient thermal testing method would be of benefit to you. The method is non-... » read more