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The Materials Side Of AI


As we enter the foundry 7nm and below technology nodes, tungsten fill for contacts has reached the physical limits of scaling and copper used in the lowest level interconnects is facing challenges on multiple fronts. Solving these issues will require a new conducting material, namely cobalt. This transition can enable continued device scaling and less power consumption per computation. Follo... » read more

The Role Of Cobalt In Enabling AI


We are on the cusp of the biggest computing wave yet — the AI era driven by Big Data. Enabling this era will require significant enhancements in processor performance and in the capacity and latency of memory. These requirements are coming at a time when the industry is being increasingly challenged by a slowdown in classic Moore’s Law scaling. What’s needed to continue driving the indust... » read more