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Hybrid System-Level Test For RF SiP


In recent years, the proliferation of the IoT has focused attention on low-power-wireless applications. IoT modules incorporating functions such as Bluetooth Low Energy (BLE) transceivers, MCUs, and power-management circuitry are becoming system-in-package (SiP) and even one-chip devices. Such devices increase the demand for a mass-production test environment that can measure them in a short ti... » read more