Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

zeroK NanoTech: FIB Circuit Edit
By Mark LaPedus - 30 Sep, 2015 - Comments: 0

Focused ion beam (FIB) circuit editing is an enabling technology that has been around for some time. Using a standard FIB tool, a chipmaker can basically edit portions of a circuit before it goes into production. It allows chipmakers to debug chips, cut traces, add metal connections and perform other functions. One startup, zeroK NanoTech, is putting a new and innovative twist on FIB circui... » read more

Mask Metrology Challenges Grow
By Mark LaPedus - 29 Sep, 2015 - Comments: 0

Photomasks are becoming more complex at each node. In fact, masks are moving from traditional shapes to non-orthogonal patterns and complex shapes, such as curvilinear mask patterns. To measure patterns and shapes on the mask, photomask makers use traditional critical-dimension scanning electron microscopes (CD-SEMs). In general, the CD-SEM, the workhorse metrology tool in the mask shop, use... » read more

Survey: Mask Complexity To Increase
By Mark LaPedus - 29 Sep, 2015 - Comments: 1

The eBeam Initiative today released its annual members’ perceptions survey, a set of results that reveals some new and surprising data about EUV, multi-beam and photomask technology. As part of the results in the new survey, there is a growing level of optimism for the implementation of extreme ultraviolet (EUV) lithography in high-volume manufacturing, as compared to last year’s results... » read more

Manufacturing Bits: Sept. 29
By Mark LaPedus - 29 Sep, 2015 - Comments: 0

Turning the nano-wrench The University of Vermont has developed a wrench that has linewidth geometries at 1.7nm. The so-called nano-wrench is an atomic-level tool, which could one day be used to create tiny structures and molecules. The nano-wrench has been devised using a technology called chirality-assisted synthesis (CAS). Chirality is derived from the Greek word for hand. If one holds u... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 25 Sep, 2015 - Comments: 0

Samsung Semiconductor unveiled its North American R&D Headquarters for its Device Solutions group in San Jose, Calif. The new campus is a 1.1 million-square-foot R&D, sales and marketing center. Is 5G the next big thing in wireless? Verizon–the first company to introduce 4G LTE–is once again poised to usher in a new era with an aggressive roadmap for fifth-generation, or 5G, wireless t... » read more

Manufacturing Bits: Sept. 22
By Mark LaPedus - 22 Sep, 2015 - Comments: 0

Superconductor puddles Superconductors are devices that have zero electrical resistance, making them attractive for a range of applications. But superconductors must be cooled down to temperatures near zero to work, which, in turn, limits their applications. High-temperature superconductors are more promising technologies, but once again, they must be cooled down to function. The industr... » read more

Chasing After Quantum Dots
By Mark LaPedus - 21 Sep, 2015 - Comments: 2

In the 1980s, researchers stumbled upon a tiny particle or nanocrystal with unique electrical properties. These mysterious nanocrystals, which are based on semiconductor materials, were later named quantum dots. Quantum dots were curiosity items until 2013, when Sony launched the world’s first LCD TV using these inorganic semiconductor nanocrystals. Basically, when inserted into an LCD TV,... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 18 Sep, 2015 - Comments: 0

In case you missed it, Apple rolled out its latest iPhones and other products. The latest iPhone 6 is using chips based on finFETs. So, who won Apple’s application processor foundry business for the iPhone 7? “In our foundry checks, it appears Apple is likely splitting the 14/16nm business for the recent product launches between TSMC and Samsung. We suspect Samsung’s 14nm is used for the ... » read more

Finding Defects Is Getting Harder
By Mark LaPedus - 17 Sep, 2015 - Comments: 1

Chipmakers are plotting out a strategy to scale the transistor to 10nm and beyond. Migrating to these nodes presents a number of challenges, but one issue is starting to gain more attention in the market—killer defects. Defects have always been problematic in the yield ramp for chip designs, but the ability to find them is becoming more difficult and expensive at each node. And it will be... » read more

Inside The MRAM
By Mark LaPedus - 17 Sep, 2015 - Comments: 0

Today, the industry is shipping various next-generation nonvolatile memory types, such as 3D NAND, MRAM and ReRAM. In fact, MRAM has been shipping for some time. To get a handle on MRAM, Semiconductor Engineering sat down to discuss the technology with Phillip LoPresti, president and chief executive of Everspin, a supplier of MRAMs. What follows are excerpts of that conversation. SE: Where ... » read more

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