Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

The Week In Review: Manufacturing
By Mark LaPedus - 15 May, 2015 - Comments: 0

Cypress Semiconductor has made a bid to buy U.S. memory maker Integrated Silicon Solution Inc. (ISSI). In fact, Cypress may have started a bidding war against a Chinese consortium to buy ISSI. In March, a Chinese consortium of investors led by Summitview Capital entered into a definitive merger agreement to acquire ISSI. The proposed transaction values ISSI’s equity at approximately $639.5 mi... » read more

Manufacturing Bits: May 12
By Mark LaPedus - 12 May, 2015 - Comments: 0

Photonic thermometers The National Institute of Standards and Technology (NIST) has developed a new class of photonic thermometers. These chip-based thermometers measure temperature using light. They are resistant to electromagnetic interference and are self-calibrating. In the future, photonic thermometers could be buried into walls or sent into space. They could be used for chemical, pres... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 May, 2015 - Comments: 0

Investment firm TIG Advisors, a stockholder of Altera, has urged stockholders to vote against Altera’s lead independent director to the board. TIG also contends that Altera has failed stockholders by rejecting a recent acquisition bid from Intel. Altera’s 14nm foundry partner is Intel, while TSMC handles the 20nm and above foundry work. Soon, Altera will choose a 10nm foundry partner. “Sh... » read more

Manufacturing Bits: May 5
By Mark LaPedus - 05 May, 2015 - Comments: 0

Transparent armor The U.S. Naval Research Laboratory (NRL) has developed transparent armor. The technology is actually a hard transparent ceramic, based on a material called spinel. Spinel is a magnesium aluminate compound. Spinel is also a gemstone, which could come in various colors. NRL has devised a fabrication process to create the technology, which is harder and superior to glass, sap... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 01 May, 2015 - Comments: 0

After several delays due to a myriad of complex regulatory issues, Applied Materials’ proposed deal to buy Tokyo Electron Ltd. (TEL) has been scrapped. Now, Applied Materials and TEL are separately re-grouping, and are back to where they originally started as competitors in the fab tool market. Applied Materials held a conference call to explain the situation with TEL. Applied Materials... » read more

Manufacturing Bits: April 28
By Mark LaPedus - 28 Apr, 2015 - Comments: 0

CIA and 3D printers Voxel8, a supplier of 3D printers, has closed a strategic investment and technology development agreement with In-Q-Tel (IQT), the venture capital arm of the U.S. Central Intelligence Agency (CIA). Voxel8, founded by technologists from Harvard University, is commercializing a new platform for 3D printing. The company enables engineers to create products with embedded 3D ... » read more

Analysis: Applied-TEL Scrap Merger
By Mark LaPedus - 27 Apr, 2015 - Comments: 0

After several delays due to a myriad of complex regulatory issues, Applied Materials’ proposed deal to buy Tokyo Electron Ltd. (TEL) has been scrapped. It appears that the U.S. Department of Justice (DoJ) stepped in and blocked the deal. Now that the deal has been terminated, Applied Materials and TEL are separately re-grouping, and are back to where they originally started as fierce compe... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 24 Apr, 2015 - Comments: 0

For years, Altera’s sole foundry was TSMC. Then, not long ago, Altera selected Intel as its foundry partner for 14nm. TSMC still handles 20nm and above work for Altera. This quarter, Altera was supposed to select a foundry partner for 10nm. This week, Altera posted lackluster results in the quarter. Altera did not elaborate on its 10nm plans, nor did it discuss the Intel rumors. "Altera did n... » read more

Manufacturing Bits: April 21
By Mark LaPedus - 21 Apr, 2015 - Comments: 0

Fan-out packaging consortium A*STAR’s Institute of Microelectronics (IME) and others have formed a high-density fan-out wafer level packaging (FOWLP) consortium in Singapore. Others in the group include Amkor, Nanium, STATS ChipPAC, NXP, GlobalFoundries, Kulicke & Soffa, Applied Materials, Dipsol Chemicals, JSR, KLA-Tencor, Kingyoup Optronics, Orbotech and Tokyo Ohka Kogyo (TOK). T... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Apr, 2015 - Comments: 0

It could be a long year for the equipment industry. First, Intel reduced its 2015 capital expenditure budget to $8.7 billion, plus or minus $500 million. This is down from the previous mid-point guidance of $10.1 billion. As a result of Intel’s announcement, Pacific Crest Securities cut its worldwide 2015 semiconductor CapEx forecast. The new CapEx forecast is now $62.5 billion in 2015. Th... » read more

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