Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

The Week In Review: Manufacturing
By Mark LaPedus - 07 Nov, 2014 - Comments: 0

China’s Jiangsu Changjiang Electronics Technology (JCET) has made a bid to acquire STATS ChipPAC for $780 million, according to reports. This year’s top-20 chip ranking includes two pure-play foundries--TSMC and UMC--and six fabless companies, according to IC Insights. GlobalFoundries is forecast to be replaced in this year’s top 20 ranking by fabless IC supplier Nvidia, according to t... » read more

Manufacturing Bits: Nov. 4
By Mark LaPedus - 04 Nov, 2014 - Comments: 0

World’s fastest IC amplifier Northrop Grumman has set a record for the world’s fastest integrated circuit amplifier. The record has been recognized by officials from Guinness World Records. The amplifier uses 10 transistor stages to reach an operating speed of one terahertz, or one trillion cycles per second. This surpassed the company's own record of 850 billion cycles per second set i... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 31 Oct, 2014 - Comments: 0

STMicroelectronics announced mixed results for the quarter. The company also launched a plan to cut $100 million in costs. As part of the plan, it is reviewing the implications to its process technology efforts following the recent announcements by its research alliance partners, namely IBM. STMicro is one of the main drivers of FDSOI technology. The company’s FDSOI partner is IBM, which is s... » read more

Applied-TEL Deal Faces Delays
By Mark LaPedus - 29 Oct, 2014 - Comments: 1

Applied Materials’ proposed move to acquire rival Tokyo Electron Ltd. (TEL) faces a possible delay. The blockbuster deal could get pushed out until next year amid a host of complicated regulatory issues. As reported in September of 2013, Applied Materials announced a definitive agreement to acquire TEL in a stock deal valued at around $9.3 billion. Under the terms, Applied Materials would ... » read more

Manufacturing Bits: Oct. 28
By Mark LaPedus - 28 Oct, 2014 - Comments: 0

Making graphene from cooked sawdust The University of Birmingham has found a new and cheap way to make nanostructured carbon materials, such as carbon nanotubes and graphene. The magic formula? Common sawdust. Sawdust is made up of cellulose and lignin. Researchers can convert this biomass material into nanostructured graphitic carbon in a single step. [caption id="attachment_15639" alig... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 24 Oct, 2014 - Comments: 0

After months of on-again, off-again negotiations, IBM agreed to hand over its Microelectronics unit to GlobalFoundries for $1.5 billion—meaning IBM will actually pay GlobalFoundries that amount to get rid of what has become an albatross for Big Blue. Analyst Jim McGregor said it is only a matter of time before GlobalFoundries shuts down IBM’s fabs, according to the Albany Business Review... » read more

Manufacturing Bits: Oct. 21
By Mark LaPedus - 21 Oct, 2014 - Comments: 0

Peanut butter and chocolate TEMs Lawrence Livermore National Laboratory, Johns Hopkins University and the National Institute of Standards and Technology (NIST) have developed a new microscopy technology that combines two types of key measurements. The technology, dubbed the dynamic transmission electron microscope (DTEM), captures information about both temperature and the crystal structure... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Oct, 2014 - Comments: 0

It’s official: IBM appears to be exiting the chip business. After months of talks, IBM has agreed to pay GlobalFoundries $1.5 billion to take Big Blue’s chip unit off its hands, according to reports from Bloomberg. IBM will also receive $200 million worth of assets, according to the reports. At the upcoming IEEE International Electron Devices Meeting (IEDM), Intel and IBM will present... » read more

Litho Options Sparse After 10nm
By Mark LaPedus - 16 Oct, 2014 - Comments: 0

Leading-edge foundries are ramping up their 16nm/14nm logic processes, with 10nm and 7nm in R&D. Barring a major breakthrough in [getkc id="80" comment="lithography"], chipmakers will use 193nm immersion and multiple patterning for both 16nm/14nm and 10nm. So now, chipmakers are focusing on the lithography options for 7nm. As before, the options include the usual suspects—[gettech id="... » read more

ATE Market Gets More Crowded
By Mark LaPedus - 16 Oct, 2014 - Comments: 0

Over the years, the automatic test equipment (ATE) industry has undergone a dramatic shakeout. In fact, the ATE industry has shrunk from about a dozen major vendors several years ago to just three sizable companies today. There is also a smattering of smaller ATE players in the market. In other words, the big ATE vendors became bigger and the mid-sized players were gobbled up. The consol... » read more

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