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Manufacturing Bits: Nov. 3


Zeptosecond measurements A group of researchers have set a new world’s record for the shortest timespan measurement. DESY, Fritz-Haber-Institute and Goethe University Frankfurt have measured how long it takes for a photon to cross a hydrogen molecule. The result? About 247 zeptoseconds. A zeptosecond is a trillionth of a billionth of a second (10-21 seconds). This is said to be the sh... » read more

Week In Review: Manufacturing, Test


Trade and government The U.S. continues to tighten its export controls for hi-tech, including a move to restrict fab technologies that enable 5nm chip production. The U.S. Department of Commerce has imposed controls on six more technologies, bringing the total to 37. They include: hybrid additive manufacturing/computer controlled tools; computational lithography software designed for EUV masks... » read more

Manufacturing Bits: Oct. 27


Single-molecule switches A group of researchers have demonstrated a single-molecule switch or electret, a technology that could one day enable a new class of non-volatile memory storage devices. Yale University, Nanjing University, Renmin University, Xiamen University, and the Rensselaer Polytechnic Institute have demonstrated a single-molecule electret with functional memory. Still in ... » read more

Week In Review: Manufacturing, Test


Chipmakers AMD and Xilinx have entered into a definitive agreement for AMD to acquire Xilinx in an all-stock transaction valued at $35 billion. With the proposed deal, AMD will enter the FPGA business, putting it further in competition with Intel. The transaction has been unanimously approved by the AMD and Xilinx boards. The transaction is expected to close by the end of calendar year 2021. U... » read more

What’s Ahead For Chips & Equipment?


It’s been a topsy-turvy year in the semiconductor industry. 2020 was supposed to be a strong year. Then, the coronavirus outbreak hit. Countries implemented various measures to mitigate the outbreak, such as stay-at-home orders and store closures. Economic turmoil and job losses soon followed. Earlier in the year, the chip market looked bleak. Now, business appears to be strong. To gain... » read more

Defect Challenges Grow For IC Packaging


Several vendors are ramping up new inspection equipment based on infrared, optical, and X-ray technologies in an effort to reduce defects in current and future IC packages. While all of these technologies are necessary, they also are complementary. No one tool can meet all defect inspection requirements. As a result, packaging vendors may need to buy more and different tools. For years, p... » read more

Mask/Lithography Issues For Mature Nodes


Semiconductor Engineering sat down to discuss lithography and photomask issues with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Harry Levinson, principal at HJL Lithography; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What follows are excerpts of that conversation. ... » read more

Manufacturing Bits: Oct. 20


Thermometers for 3D measurements The National Institute of Standards and Technology (NIST) is developing a nano-thermometer technology that could one day take 3D temperature measurements at the microscopic scale. The project, called Thermal Magnetic Imaging and Control (Thermal MagIC), hopes to develop tiny thermometers based on magnetic nanoparticles. These tiny thermometers could be injec... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Intel is exiting the NAND flash market. SK Hynix and Intel announced that they have signed an agreement on Oct. 20, under which SK Hynix would acquire Intel’s NAND memory and storage business for $9 billion.The transaction includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel will retain it... » read more

Manufacturing Bits: Oct. 12


MoSi2 pellicles for EUV Hanyang University has presented a paper that describes a novel molybdenum disilicide (MoSi2) pellicle membrane for use in extreme ultraviolet (EUV) lithography. With a 28nm thickness, a MoSi2 membrane has demonstrated a 89.33% transmittance for EUV lithography. The pellicle technology is still in R&D. MoSi2, which is a silicide of molybdenum, is a refractory cer... » read more

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