Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

Manufacturing Bits: Dec. 14
By Mark LaPedus - 14 Dec, 2021 - Comments: 0

3D-SOCs At this week’s IEEE International Electron Devices Meeting (IEDM), a plethora of companies, R&D organizations and universities presented papers on the latest and greatest technologies. One of the themes at IEDM is advanced packaging, a technology enables an IC vendor to boost the performance of a chip. Advanced forms of packaging also enables new 3D-like chip architectures. Fo... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Dec, 2021 - Comments: 0

Semicon West news The Semicon West trade show opened this week with a hybrid in-person and virtual event. Several companies introduced new products or made announcements at Semicon. Some announcements coincided with the show. At Semicon, Lam Research introduced the Syndion GP, a new product that provides deep silicon etch capabilities to chipmakers developing next-generation power devices a... » read more

Manufacturing Bits: Dec. 6
By Mark LaPedus - 06 Dec, 2021 - Comments: 0

China’s rare earth power play Rare earth elements (REEs) are back in the news. China, the world’s largest supplier of rare earths, plans to combine three domestic vendors to create a large state-owned company with a nearly 70% share of the REE market, according to reports from Nikkei and others. In 2020, China in total accounted for 85% of global production of refined REEs, accordi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 03 Dec, 2021 - Comments: 0

Packaging and test Taiwan’s ASE--the world’s largest OSAT--has announced the proposed sale and disposal of equity interests in its subsidiaries, GAPT Holding and ASE (Kun Shan), to Wise Road Capital, a private equity firm based in China. The deal has a value of $1.46 billion. The announcement is related to four ASE assembly and test facilities in China, including Shanghai, Suzhou, Kunsh... » read more

Manufacturing Bits: Nov. 30
By Mark LaPedus - 30 Nov, 2021 - Comments: 0

Quantum chemistry QunaSys has launched a technology that enables researchers to perform chemical calculations using quantum computers in the cloud. The company has announced the launch of the cloud version of Qamuy, which is supported by Amazon Web Services Japan. Qamuy is a software technology that allows researchers to perform chemical calculations using quantum computers. Developers c... » read more

Manufacturing Bits: Nov. 24
By Mark LaPedus - 24 Nov, 2021 - Comments: 0

Tiny MEMS gyroscope CEA-Leti and Politecnico di Milano (POLIMI) have developed the world’s smallest MEMS gyroscope. Based on a nano-resistive sensing technology, the gyroscope enables a navigation-grade performance with a sensor footprint of only 1.3mm2. The tiny gyroscope is targeted for high-volume markets like automotive and others. The technology was reported in a paper, entitled “1... » read more

China Accelerates Foundry, Power Semi Efforts
By Mark LaPedus - 22 Nov, 2021 - Comments: 4

China has unveiled several initiatives to advance its domestic semiconductor industry, including a new and massive fab expansion campaign in the foundry, gallium-nitride (GaN), and silicon carbide (SiC) markets. The nation is making a big push into what it calls “third-generation semiconductors,” which is a misnomer. The term actually refers to two existing and common power semiconductor... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Nov, 2021 - Comments: 0

Chipmakers China’s Tsinghua Unigroup is in trouble. The group is the parent company of China’s YMTC, a 3D NAND supplier, and other chip ventures. It is close to moving into bankruptcy proceedings. Now, a consortium led by Alibaba has emerged as the frontrunner to take over Tsinghua Unigroup, according to a report from Bloomberg. That deal would keep the company afloat, the report said. ... » read more

End In Sight For Chip Shortages?
By Mark LaPedus - 18 Nov, 2021 - Comments: 2

The current wave of semiconductor and IC packaging shortages is expected to extend well into 2022, but there are also signs that supply may finally catch up with demand. The same is true for manufacturing capacity, materials and equipment in both the semiconductor and packaging sectors. Nonetheless, after a period of shortages in all segments, the current school of thought is that chip suppl... » read more

Outlook: DRAM, NAND, Next-Gen Memory
By Mark LaPedus - 18 Nov, 2021 - Comments: 0

Jim Handy, director at Objective Analysis, sat down with Semiconductor Engineering to talk about the 3D NAND, DRAM and next-generation memory markets. What follows are excerpts of that discussion. SE: How would you characterize the NAND market thus far in 2021? Handy: All chips are seeing unusual strength in 2021, but NAND flash and DRAM are doing what they usually do by exhibiting more e... » read more

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