Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

Manufacturing Bits: Aug. 31
By Mark LaPedus - 31 Aug, 2021 - Comments: 0

X-ray nanotomography The U.S. Department of Energy’s (DOE) Argonne National Laboratory has developed a new method for improving the resolution of hard X-ray nanotomography. In general, tomography involves a system, which takes images or cross sections of a sample using X-rays or ultrasound. The images are then re-created in the form of a 3D model. One common form is called micro-comput... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Aug, 2021 - Comments: 0

Chipmakers, OEMs Reports have surfaced that TSMC has delayed its 3nm process. But TSMC says the technology remains on track. Volume production for TSMC’s 3nm is still scheduled for the second half of 2022. On the flip side, there is speculation that TSMC may increase its wafer prices by up to 20%, according to a report from the Taipei Times. Here's another report. This is due to chip shortag... » read more

Manufacturing Bits: Aug. 24
By Mark LaPedus - 24 Aug, 2021 - Comments: 0

Panel packaging consortium Fraunhofer Institute for Reliability and Microintegration IZM has provided an update on a consortium that is developing panel-level IC packaging technologies. Fraunhofer IZM is leading the consortium. The R&D organization and its partners, including Intel and others, have made progress in terms of equipment, processes and other technologies in the so-called Pa... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Aug, 2021 - Comments: 0

Chipmakers, OEMs At Intel’s Architecture Day this week, the company revealed several new chip architectures. Some were already announced, while others are new. These include Intel’s first performance hybrid architecture, a data center architecture, a discrete gaming graphics processing unit (GPU) architecture, infrastructure processing units (IPUs), and a data center GPU architecture. Here... » read more

What’s Ahead For DRAM, NAND?
By Mark LaPedus - 19 Aug, 2021 - Comments: 1

For the last year, the semiconductor industry has been in the midst of a boom cycle. But if you look close enough, there are mixed signals in the market, especially in memory. Still, it’s a banner year for semiconductors. In total, the semiconductor market is expected to grow by 18.1% in 2021, according to Semico Research. That compares to 6.6% growth in 2020, according to Semico. Today... » read more

Angstrom-Level Measurements With AFMs
By Mark LaPedus - 19 Aug, 2021 - Comments: 0

Competition is heating up in the atomic force microscopy (AFM) market, where several vendors are shipping new AFM systems that address various metrology challenges in packaging, semiconductors and other fields. AFM, a small but growing field that has been under the radar, involves a standalone system that provides surface measurements on structures down to the angstrom level. (1 angstrom = 0... » read more

Current And Future Packaging Trends
By Mark LaPedus - 19 Aug, 2021 - Comments: 1

Semiconductor Engineering sat down to discuss IC packaging technology trends and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Thomas Uhrmann, directo... » read more

Manufacturing Bits: Aug. 17
By Mark LaPedus - 17 Aug, 2021 - Comments: 0

Scaling qubits Australia is a hotbed of R&D activity, especially in the field of quantum computing. For example, the University of New South Wales (UNSW) in Australia has demonstrated a possible way to control millions of qubits in a silicon quantum chip. Researchers from UNSW Sydney have devised a new three-dimensional dielectric resonator, a technology that could deliver controlled... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Aug, 2021 - Comments: 0

Chipmakers and OEMs Samsung has announced its latest foldable smartphones--the Galaxy Z Fold3 5G and Galaxy Z Flip3 5G. The systems are based on Samsung’s 5nm application processor. One system is the company’s most affordable foldable phone. The Galaxy Z Fold3 is $1,799.99, while the Galaxy Z Flip3 is $999.99. Samsung also announced two smartwatches—the Galaxy Watch4 and Galaxy Watch4... » read more

Manufacturing Bits: Aug. 9
By Mark LaPedus - 09 Aug, 2021 - Comments: 1

Quantum RF sensors The quantum computer market is an emerging and hot business. So is the quantum sensor market, where several entities are developing this technology for a range of applications. “Quantum sensors utilize quantum states for measurements,” according to Chalmers University of Technology. “They capitalize on the fact that quantum states are extremely sensitive to disturba... » read more

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