Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

ASML To Buy Hermes
By Mark LaPedus - 16 Jun, 2016 - Comments: 0

Looking to expand into new markets, ASML Holding has entered into an agreement to acquire e-beam wafer inspection specialist Hermes Microvision (HMI) in a cash transaction valued at 2.75 billion euros (US$3.08 billion). With the proposed acquisition of Taiwan’s HMI, ASML will enter two new markets—-wafer inspection as well as mask inspection for extreme ultraviolet (EUV) lithography. In ... » read more

Manufacturing Bits: June 14
By Mark LaPedus - 14 Jun, 2016 - Comments: 0

3D printed neural networks The European Commission has launched a program that will replicate the brain’s neural network using 3D nano-printing. The program, dubbed the MESO-BRAIN consortium, has received an award of €3.3 million in funding from the European Commission. This research, led by Aston University, also involves Axol Bioscience, Laser Zentrum, the University of Barcelona, th... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Jun, 2016 - Comments: 0

MEMS manufacturing A*STAR’s Institute of Microelectronics (IME) in Singapore has launched its third consortium to develop MEMS technologies. This would allow MEMS sensor devices to achieve better performance, higher power efficiency and a smaller form factor. The MEMS Consortium III consists of the following companies: Applied Materials, Coventor, Delta Electronics, GlobalFoundries, InvenS... » read more

Manufacturing Bits: June 7
By Mark LaPedus - 07 Jun, 2016 - Comments: 0

Intel’s spintronic spectrometer Intel and Stanford University have presented the first results for a technology called a ferromagnetic resonance (FMR) spectrometer. Initially invented and developed by the National Institute of Standards and Technology (NIST), FMR examines the properties of materials for spintronic-based memories. Today’s DRAMs store binary data in tiny capacitors. I... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Jun, 2016 - Comments: 0

Chipmakers Through a joint venture with the government of Chongqing, GlobalFoundries will take over an existing 200mm fab in China. Then, GlobalFoundries plans to retrofit the facility and turn it into a 300mm fab. The foundry vendor is transferring its 180nm and 130nm processes to the China fab. Meanwhile, TSMC, UMC and others are also building fabs in China. Samsung Electronics has begu... » read more

Fab Investment Increases In China
By Mark LaPedus - 02 Jun, 2016 - Comments: 1

By Mark LaPedus & Ed Sperling Fab construction in China is heating up, driven by real and projected demand for IoT devices and the government's push for internally manufactured chips. [getentity id="22819" comment="GlobalFoundries"], UMC and [getentity id="22586" comment="TSMC"] are all actively building up fab capacity inside of China, usually in conjunction with other local governme... » read more

Manufacturing Bits: May 31
By Mark LaPedus - 31 May, 2016 - Comments: 0

Superconducting magnets The National High Magnetic Field Laboratory (MagLab) has broken another world’s magnet record. This time, MagLab broke a record for a high-temperature superconducting (HTS) coil operating inside a high-field resistive magnet. With the technology, the agency achieved a magnetic field of 40.2 teslas. The previous record was 35.4 teslas. Tesla, or T, is the measuremen... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 May, 2016 - Comments: 0

Fab tools Thermo Fisher Scientific and FEI have announced that their boards of directors have unanimously approved Thermo Fisher’s acquisition of FEI for $107.50 per share in cash. The transaction represents a purchase price of approximately $4.2 billion. In a video, Aki Fujimura, chief executive of D2S, recaps the emerging mask and lithography trends presented at the recent Photomask Ja... » read more

Manufacturing Bits: May 24
By Mark LaPedus - 24 May, 2016 - Comments: 2

Microbunching EUV Researchers at the SLAC National Accelerator Laboratory have provided a status report on its ongoing efforts to develop a steady-state microbunching (SSMB) technology. SSMB is a technology used within a storage ring, which is a large-scale, circular particle accelerator. An SSMB mechanism produces a high-power radiation source within the ring. This, in turn, could enable a... » read more

How To Make 3D NAND
By Mark LaPedus - 23 May, 2016 - Comments: 0

In 2013, Samsung reached a major milestone in the IC industry by shipping the world’s first 3D NAND device. Now, after some delays and uncertainty, Intel, Micron, SK Hynix and the SanDisk/Toshiba duo are finally ramping up or sampling 3D NAND. 3D NAND is the long-awaited successor to today’s planar or 2D NAND, which is used in memory cards, solid-state storage drives (SSDs), USB flash dr... » read more

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